Patent application number | Description | Published |
20090202140 | PATTERN EVALUATION METHOD, COMPUTER-READABLE RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A pattern evaluation method includes: acquiring data of a design pattern for an evaluation pattern to detect a first edge of the design pattern; acquiring an image of the evaluation pattern to detect a second edge of the evaluation pattern; dividing the first edge into first linear parts and first corner parts; performing matching of the first and second edges to obtain correspondence between the first and second edges; dividing the second edge into second linear parts and second corner parts based on the correspondence between the first and second edges; and evaluating the evaluation pattern based on at least one of the second linear parts and the second corner parts. | 08-13-2009 |
20100046006 | PATTERN MEASUREMENT APPARATUS AND PATTERN MEASUREMENT METHOD - A pattern measurement method includes: acquiring sectional shapes of a first pattern corresponding to process parameters, respectively; using the acquired sectional shapes to calculate predicted spectral waveforms which would be obtained when light is applied to the first pattern, and adding information on the corresponding process parameters to the calculated predicted spectral waveforms, respectively, to form a waveform library; setting a process parameter to obtain a desired shape, and acquiring an actual spectral waveform of a second pattern actually created from the first pattern using the set process parameter; performing waveform matching between the actual spectral waveform and the predicted spectral waveforms to acquire matching scores for respective waveform matching, and calculating an optimum process parameter providing the maximum matching score; generating an optimum pattern sectional shape corresponding to the optimum process parameter to measure the optimum pattern sectional shape. | 02-25-2010 |
20100128966 | PATTERN SHAPE EVALUATION METHOD AND PATTERN SHAPE EVALUATION APPARATUS UTILIZING THE SAME - The present invention provides a pattern shape evaluation method that can securely decide whether patterns are connected or disconnected and, further, evaluate a pattern shape qualitatively. | 05-27-2010 |
20100158389 | Pattern evaluation method, pattern matching method and computer readable medium - A pattern evaluation method includes: generating first array data from edge data on a pattern to be evaluated, the edge data on the pattern to be evaluated being shape data including edge points of the pattern to be evaluated; generating second array data from edge data on a reference pattern, the edge data on the reference pattern including edge points of the reference pattern which serves as an inspection standard of the pattern to be evaluated; subjecting each component of the second array data to array conversion processing, the array conversion processing being designed to convert a value of the component of the second array data into a function value of a value of a distance from that component to the edge point closest thereto, thereby generating third array data; executing arithmetic processing between the first array data and the third array data to generate fourth array data; and using a component of the fourth array data to calculate a numerical value representative of an relation between the pattern to be evaluated and the reference pattern. | 06-24-2010 |
20100177952 | DEFECT INSPECTION APPARATUS AND DEFECT INSPECTION METHOD - A defect inspection method includes: acquiring an image of an inspection pattern obtained by an imaging device, detecting an edge of the inspection pattern in the image, dividing the image into an inspection region and a non-inspection region, using the detected edge as a boundary thereof, performing image processing only on the inspection region to determine the intensity value distribution in the image, and detecting a defect in the inspection pattern based on the obtained intensity value distribution. | 07-15-2010 |
20100303361 | PATTERN EDGE DETECTING METHOD AND PATTERN EVALUATING METHOD - A pattern edge detecting method includes: detecting edge points in an image of an inspection pattern acquired from an imaging device; generating a plurality of edge lines from the edge points using a grouping process; generating a plurality of edge line group pairs, each composed of a combination of first and second edge line groups to be a candidate of any of one and the other of an outside edge and an inside edge of the inspection pattern, the generated edge lines being divided into two parts in different manners; performing shape matching between the first and second edge line groups for each edge line group pair; and specifying, as an edge of the inspection pattern, one of the first and second edge line groups constituting the edge line group pair whose matching score is best of matching scores of the edge line group pairs obtained during the shape matching. | 12-02-2010 |
20110164807 | PATTERN EVALUATION SYSTEM, PATTERN EVALUATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - In accordance with an embodiment, a pattern evaluation system includes an image acquisition unit, a plurality of image processing units, and a control unit which controls the plurality of image processing units. The image acquisition unit loads a series of images of a pattern to be evaluated. The images are acquired at a first speed. The plurality of image processing units process the series of images at a second speed and then output a result of the evaluation of the pattern to be evaluated. The control unit acquires the first and second speeds, estimates the number of the image processing units which allow the time for acquiring the series of images to be substantially the same as the time for processing the series of images, and allocates the estimated image processing units to the processing of the series of images. | 07-07-2011 |
20110280471 | Image processing apparatus, image processing method, defect detection method, semiconductor device manufacturing method, and program - An image processing apparatus which compresses an image, the apparatus includes: a storage unit which stores a code book, the code book being prepared by allocating identification codes to code blocks, the code blocks being formed by executing quantization processing regarding a plurality of first image blocks as multidimensional vectors, the plurality of first image blocks being generated by cutting, in preset sizes, first regions out of a code book preparation image containing a first edge, each of the first regions surrounding and including an edge point of the first edge, the first edge being detected from the code book preparation image; an edge detection unit which detects a second edge from a compression target image containing the second edge; an image block generation unit which cuts, in preset sizes, second regions out of the compression target image to generate a plurality of second image blocks, each of the second regions surrounding and including an edge point of the detected second edge; a search unit which searches the code book stored in the storage unit for code blocks similar to the second image blocks; and an output unit which outputs information on the identification codes of the similar code blocks which have been searched for and information on coordinates of the edge points of the second image blocks. | 11-17-2011 |
20110286658 | PATTERN INSPECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - In one embodiment, a pattern inspection method is disclosed. The method can include predicting an edge shape at a given future time with respect to the same inspection target pattern, setting a threshold corresponding to a required specification of the inspection target pattern, and predicting the time when the inspection target pattern fails to meet the required specification from the predicted edge shape and the threshold. The method can further include taking a plurality of images concerning the inspection target pattern at different times by use of an imaging apparatus, detecting edges of the obtained images, respectively, matching the detected edges of different imaging times, and obtaining a difference between corresponding edges to generate a difference vector after the matching. The edge shape of the future time can be predicted based on the generated difference vector and an interval between the imaging times. | 11-24-2011 |
20120068065 | PATTERN DEFECT INSPECTION APPARATUS AND PATTERN DEFECT INSPECTION METHOD - A pattern defect inspection method includes generating electron beam irradiation point track data on the basis of first data on an inspection target pattern, irradiating the electron beam to the inspection target pattern in accordance with the electron beam irradiation point track data, detecting secondary electrons generated from the inspection target pattern due to the irradiation of the electron beam, acquiring second data regarding a signal intensity of the secondary electrons from a signal of the detected secondary electrons, and detecting an abnormal point from the second data and outputting the abnormal point as a defect of the inspection target pattern. The electron beam irradiation point track data includes data on a track of irradiation points of an electron beam to the inspection target pattern and is intended to control over scanning with the electron beam, the electron beam irradiation point track data. | 03-22-2012 |