Tadaki, JP
Asami Tadaki, Settsu-Shi JP
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20120135126 | Acidic Emulsified Liquid Seasoning Containing Sesame - The present invention provides a sesame-containing acidic emulsified liquid seasoning capable of sufficiently giving a roasted sesame flavor even after storage. The sesame-containing acidic emulsified liquid seasoning according to the present invention comprises ground roasted sesame, gum substance, egg yolk and edible oil and has a viscosity of 0.1 to 5 Pa·s and a total light transmittance, which is determined by measuring the turbidity of the sesame-containing acidic emulsified liquid seasoning using integrating sphere-type electrophotometry, of 1.5 to 10%. | 05-31-2012 |
Atsushi Tadaki, Koza-Gun JP
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20130112165 | ENGINE STARTING APPARATUS FOR IDLE-STOP VEHICLE - The total length of starter harness | 05-09-2013 |
Kyoko Tadaki, Atsugi JP
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20140146850 | TEMPERATURE DISTRIBUTION MEASUREMENT APPARATUS AND TEMPERATURE DISTRIBUTION MEASUREMENT METHOD - A temperature distribution measurement apparatus includes a laser light source optically connected to an optical fiber, a photodetector configured to detect light backscattered in the optical fiber, and a temperature distribution measurement unit configured to obtain a true measured temperature distribution by performing correction calculation using a transfer function on a temporary measured temperature distribution obtained based on an output from the photodetector. The temperature distribution measurement unit stores therein data on a transfer function set for each entire length of the optical fiber and for each longitudinal position in the optical fiber. Then, when the length of the optical fiber is changed, the temperature distribution measurement unit changes the transfer function to be used in the correction calculation by using the data on the transfer function. | 05-29-2014 |
20140153611 | TEMPERATURE DISTRIBUTION MEASUREMENT SYSTEM, TEMPERATURE DISTRIBUTION MEASUREMENT APPARATUS, AND TEMPERATURE DISTRIBUTION MEASUREMENT METHOD - A temperature distribution measurement system includes an optical fiber, a laser light source optically connected to the optical fiber, a photodetector configured to detect light backscattered in the optical fiber, and a temperature distribution measurement unit configured to perform correction calculation using a transfer function on a measured temperature distribution obtained from an output from the photodetector. The temperature distribution measurement unit acquires an actual temperature distribution in a location where the optical fiber is laid and determines appropriateness of the transfer function by computing a difference between the measured temperature distribution after the correction and the actual temperature distribution. | 06-05-2014 |
20150226679 | ABNORMALITY DETECTION SYSTEM AND ABNORMALITY DETECTION METHOD - An abnormality detection system includes an optical fiber, a Raman scattered light detection unit, and a data processing unit. The detection unit is configured to detect Stokes light and anti-Stokes light which are generated in the optical fiber and to output data on the intensity distribution of the Stokes light in the optical fiber in the length direction thereof and data on the intensity distribution of the anti-Stokes light in the optical fiber in the length direction. The processing unit is configured to calculate the product of a value obtained by applying an FIR filter to the intensity distribution of the Stokes light, and a value obtained by applying the FIR filter to the intensity distribution of the anti-Stokes light for each of locations on the optical fiber in the length direction, and to determine whether or not abnormality is present based on the result of the calculation. | 08-13-2015 |
20150233771 | TEMPERATURE MEASUREMENT SYSTEM AND ABNORMALITY DETECTION METHOD - A temperature measurement system includes an optical fiber, a temperature distribution measurement apparatus, and a data processing apparatus. The temperature distribution measurement apparatus is configured to detect backscattered light by causing light to enter the optical fiber, and acquire the temperature distribution of the optical fiber in the length direction thereof based on the result of the detection. The data processing apparatus is configured to store therein the temperature distribution acquired by the temperature distribution measurement apparatus, perform signal processing on a difference temperature distribution obtained by computing the difference between a current temperature distribution and a past temperature distribution, and determine whether or not abnormality is present based on the result of the signal processing. | 08-20-2015 |
20150241251 | ABNORMALITY DETECTION SYSTEM AND ABNORMALITY DETECTION METHOD - An abnormality detection system includes an optical fiber, a backscattered light detection unit, and a data processing unit. The detection unit is connected to one end and the other end of the optical fiber and configured to acquire a first intensity distribution of backscattered light by causing light to enter the optical fiber from the one end, and to acquire a second intensity distribution of backscattered light by causing light to enter the optical fiber from the other end. The processing unit is configured to calculate the product of a value obtained by applying a first FIR filter to the first intensity distribution, and a value obtained by applying a second FIR filter to the second intensity distribution, for each of locations on the optical fiber in the length direction thereof, and to determine whether or not abnormality is present based on the result of the calculation. | 08-27-2015 |
Kyouko Tadaki, Atsugi JP
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20130215930 | TEMPERATURE MEASUREMENT SYSTEM AND TEMPERATURE MEASUREMENT METHOD - To measure the temperature in a temperature-measurement target disposed in a first area, an optical fiber is drawn to the first area from a second area having an adjusted temperature, and the optical fiber is installed in the temperature-measurement target. Furthermore, a reference temperature-measurement unit is provided in the second area. A temperature measurement apparatus detects backscattered light generated in the optical fiber, and detects temperatures at multiple measurement points along an installation path of the optical fiber. When making a correction on a signal outputted from the temperature measurement apparatus, a signal processor replaces temperatures at measurement points located in the second area among the measurement points with a temperature at the reference temperature-measurement unit. | 08-22-2013 |
20130273825 | AIR-CONDITIONING CONTROL SYSTEM AND AIR VOLUME ADJUSTMENT DEVICE - An air volume adjustment device is located at a vent for connecting an equipment installation area, where a rack for housing computers is installed, to a free access floor provided below a floor of the equipment installation area and supplied with air from an air conditioner. The air volume adjustment device includes an air volume adjustment sheet provided with an opening to allow passage of air, a first roll connected to one end portion of the air volume adjustment sheet and made capable of reeling in the air volume adjustment sheet, and a second roll located away from the first roll, connected to another end portion of the air volume adjustment sheet, and made capable of reeling in the air volume adjustment sheet. | 10-17-2013 |
Shinji Tadaki, Kawasaki JP
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20080266510 | Liquid crystal display device - In a liquid crystal display device which has a pair of opposing substrates having a gap filled with a liquid crystal material, with a peripheral edge portion of the paired substrates being sealed by a sealing member, between the thickness (t | 10-30-2008 |
20080303990 | Liquid crystal display device - A liquid crystal material is used in which the maximum angle of the optical axis change by liquid crystal molecule when a voltage of one polarity is applied is larger than 45 degrees and a condition of |2Ps·A|>|5Clc·A| is satisfied where Ps (nC/cm | 12-11-2008 |
20100231843 | LIQUID CRYSTAL DISPLAY ELEMENT, METHOD OF MANUFACTURING THE ELEMENT, AND ELECTRONIC PAPER AND ELECTRONIC TERMINAL APPARATUS UTILIZING THE ELEMENT - The invention relates to a display element displaying images utilizing a cholesteric liquid crystal. The display element has improved contrast and can therefore display high quality images. The display element includes a pair of substrates, a liquid crystal enclosed between the pair of substrates, first electrodes formed on either of the pair of substrates, second electrodes formed on the other of the pair of substrates, a pixel region defined by disposing the substrates such that the first electrodes and the second electrodes face each other in an intersecting relationship, a wall structure formed between the pair of substrates and outside the pixel region so as to surround the pixel region, an opening provided in a part of the wall structure to allow the liquid crystal to flow, and a reflectance reducing portion formed at the opening to reduce the reflectance of the liquid crystal at the opening. | 09-16-2010 |
Shinji Tadaki, Atsugi JP
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20150323738 | OPTICAL DEVICE AND OPTICAL MODULE - An optical device includes: an optical integrated circuit chip that comprises an optical integrated circuit and an optical interface connected thereto; an electronic circuit chip that comprises an electronic circuit connected to the optical integrated circuit; a through wiring board that comprises a through wiring connected to the electronic circuit chip; a first bump that connects the optical integrated circuit and the electronic circuit between the optical integrated circuit chip and the electronic circuit chip; a second bump that connects the electronic circuit and the through wiring between the electronic circuit chip and the through wiring board; and a third bump connected to an end portion on an opposite side to the second bump of the through wiring. The optical integrated circuit chip and the through wiring board are disposed on a side of a first main surface of the electronic circuit chip. A first distance between the first main surface and a second main surface of the optical integrated circuit chip, the second main surface being on an opposite side to the electronic circuit chip, is equal to or smaller than a second distance between the first main surface and a vertex of the third bump, the vertex being on an opposite side to the electronic circuit chip. | 11-12-2015 |
Takanobu Tadaki, Kanagawa-Ken JP
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20120327511 | OPTICAL FILM, METHOD OF PRODUCING OPTICAL FILM, POLARIZING PLATE, DISPLAY PANEL, AND DISPLAY - Disclosed is an optical film having hardness and wipe-off resistance to solvents and capable of maintaining antistatic performance for a long period, and a method of producing the same. The optical film includes an optically-transparent substrate, and a hard coat layer having a thickness of 1 to 40 μm on one side of the optically-transparent substrate. The hard coat layer includes an ionic liquid containing a cation and an anion, and a region between a depth of 50 nm and a depth of 700 nm from an interface of the hard coat layer on a side opposite to an optically-transparent substrate side has a peak of an abundance of the ionic liquid present in an area from the interface to the depth of 700 nm in a thickness direction of the hard coat layer. | 12-27-2012 |
Takashi Tadaki, Kanagawa JP
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20130265925 | MOBILE PHONE TERMINAL AND COMMUNICATION STATE TRANSITION METHOD THEREOF - A mobile phone terminal has a transition request function in which the mobile phone terminal transmits to a network a state transition request that the state of communication with the network be set to a pocket idle state if a packet communication idle state continues for a predetermined time in a state in which the mobile phone terminal is connected to the network in an RRC (Radio Resource Control) state. The mobile phone terminal includes a control section that controls the transition request function based on a communication history of the mobile phone terminal, based on a transmission power value of the mobile phone terminal, or based on a reception electric field value of the mobile phone terminal. | 10-10-2013 |
Toshihiro Tadaki, Minato-Ku JP
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20120108737 | METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE BASED (CO)POLYMER, MODIFIED CONJUGATED DIENE BASED (CO)POLYMER, AND RUBBER COMPOSITION - The method for producing a modified conjugated diene based (co)polymer, according to the present invention comprises a step of reacting a conjugated diene based (co)polymer with a metal halide compound to obtain a modified conjugated diene based (co)polymer, the conjugated diene based (co)polymer having a weight-average molecular weight of 150,000 to 2,000,000 and being obtained by bonding, to a polymer having at least a conjugated diene unit, an alkoxysilyl group and an optionally protected primary amino group. The method can satisfactorily produce a conjugated diene based (co)polymer which has a high Mooney viscosity, excellent shape stability and good processability. | 05-03-2012 |
Toshihiro Tadaki, Yokkaichi JP
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20090076210 | Elastomeric composition comprising functionalized butadienic elastomers and high dispersible aluminium-based silica - The instant invention relates to elastomeric compositions especially useful for manufacturing articles for tires which comprise: (1) at least one butadienic elastomer E, containing a functionalized butadienic elastomer prepared in solution, and modified by a polyfunctional alkoxy silane coupling agent; and (2) a specific precipitated silica having high dispersibility properties and containing aluminium, as at least one reinforcing filler in said butadienic elastomer. | 03-19-2009 |
Toshihiro Tadaki, Mie JP
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20080200602 | BLOCK COPOLYMER, RUBBER COMPOSITION CONTAINING THE SAME AND MOLDED PRODUCT - An objective of the present invention is to provide a block copolymer which is excellent in processability at the time of preparing a rubber composition and leads to a cross-linked rubber composition excellent in tensile property, wearing resistance, weatherability, ozone resistance and heat aging resistance when it is cross-linked, a rubber composition containing the block copolymer and a molded product. The block copolymer of the present invention comprises two polymer blocks each having an ethylenic unsaturated bond and other polymer block which is interposed between two polymer blocks, has a uniform weight average molecular weight in the range from 5,000 to 100,000. The weight average molecular weight of the polymer block having the ethylenic unsaturated bond is preferably in the range from 1,000 to 20,000. | 08-21-2008 |
20080200606 | BLOCK COPOLYMER, RUBBER COMPOSITION CONTAINING THE SAME AND MOLDED PRODUCT - An objective of the present invention is to provide a block copolymer which is excellent in processability at the time of preparing a rubber composition and leads to a cross-linked rubber composition excellent in tensile property, wearing resistance, weatherability, ozone resistance and heat aging resistance when it is cross-linked, a rubber composition containing the block copolymer and a molded product. The block copolymer of the present invention comprises two polymer blocks each having an ethylenic unsaturated bond and other polymer block which is interposed between two polymer blocks, has a uniform weight average molecular weight in the range from 5,000 to 100,000. The weight average molecular weight of the polymer block having the ethylenic unsaturated bond is preferably in the range from 1,000 to 20,000. | 08-21-2008 |
20080295935 | Rubber Composition and Tire - A rubber composition comprising: (A) a rubber component including 30 to 100 mass % of diene rubber having at least one functional group selected from the group consisting of an amino group, an alkoxysilyl group, an epoxy group, a hydroxyl group, and a carboxyl group in an amount of 0.01 to 5.0 mmol per 100 g of the diene rubber; (B) silica in an amount of 5 to 130 parts by mass per 100 parts by mass of the rubber component; and (C) an aliphatic component having at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an amino group, and an epoxy group in an amount of 3 to 15 parts by mass per 100 parts by mass of the silica. The rubber composition and a tire using the rubber composition exhibit excellent scorching properties before vulcanization and exhibit excellent rolling resistance and wet skid properties after vulcanization. | 12-04-2008 |
Toshihiro Tadaki, Chuo-Ku JP
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20120142851 | PROCESS FOR PRODUCING CONJUGATED DIENE POLYMER, CONJUGATED DIENE POLYMER, AND RUBBER COMPOSITION - A process for simply and inexpensively producing a conjugated diene polymer with a narrow molecular weight distribution and a high cis-bond content at a low cost is provided. The process comprises a polymerization step, wherein a conjugated diene polymer having a cis-1,4-bond content of 98.5 mass % or more and a ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) measured by gel permeation chromatography of 2.5 or less is obtained by carrying out a polymerization reaction in conjugated diene compounds using a catalyst composition containing a rare earth element-containing compound or a reaction product of the rare earth element-containing compound with a Lewis base, an aluminoxane and/or organoaluminum compound, and an iodine-containing compound. | 06-07-2012 |
Toshimasa Tadaki, Tokyo JP
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20110059471 | ANTIBODY HAVING AN IMMUNE-ENHANCEMENT FUNCTION - The present invention provides a monoclonal antibody against FLJ32028, which binds specifically to the surfaces of regulatory T-cells (Treg) and especially to the surfaces of induced Treg. This monoclonal antibody can be used for a Treg-removal method or a Treg-removal apparatus. This monoclonal antibody can also be used as a drug that improves cell-proliferation function, an immune-enhancement function, or especially for cancer treatment. | 03-10-2011 |
Yasufumi Tadaki, Kanagawa JP
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20090047524 | EASY OPEN ENDS THAT CAN BE FAVORABLY OPENED AT HIGH TEMPERATURES - An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance. | 02-19-2009 |
20090220714 | RESIN-COATED SEAMLESS ALUMINUM CAN AND RESIN-COATED ALUMINUM ALLOY LID - The present invention provides a resin coated seamless aluminum can and a resin coated aluminum can lid having adhesiveness and corrosion resistance by applying a non-chromium chemical conversion coated film to an aluminum alloy sheet and by applying an organic resin layer to the non-chromium chemical conversion coated film. For this end, an organic-inorganic composite surface treated layer containing 2 to 20 mg/m | 09-03-2009 |
20100215965 | RESIN-COATED METAL SHEET AND FORMED BODY USING RESIN-COATED METAL SHEET - A resin-coated metal sheet having excellent corrosion resistance and excellent adhesiveness which has a chromium-free surface treatment layer and exhibits excellent adhesiveness and excellent corrosion resistance even after being subject to severe forming such as deep drawing after formation of an organic resin film on the surface treatment layer is provided. A resin-coated metal sheet includes: an aluminum substrate having a surface-treatment film on at least one surface thereof; and an organic resin film layer formed on the surface of the aluminum substrate by way of an adhesive layer. The adhesive layer contains a cationic-group containing resin and a water-based resin. A formed body such as a can body or a can lid which is formed by using such a resin-coated metal sheet is also provided. | 08-26-2010 |
20100260953 | RESIN-COATED ALUMINUM ALLOY SHEET AND FORMED BODY USING RESIN-COATED ALUMINUM ALLOY SHEET - A resin-coated aluminum alloy sheet which has a chromium-free surface treatment layer and has a coating film formed by applying an organic resin, and which exhibits excellent adhesiveness and excellent corrosion resistance even after being subject to severe forming such as drawing is provided. A resin-coated aluminum alloy sheet includes: an aluminum substrate having a surface treatment film on at least one surface thereof; and an organic resin film layer formed on the surface of the aluminum substrate. The surface treatment film includes 2 mg/m | 10-14-2010 |
Yasufumi Tadaki, Yokohama-Shi JP
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20100320216 | SURFACE-TREATED TIN-PLATED STEEL SHEET FOR WELDED CANS AND WELDED CANS MADE THEREFROM - A surface-treated tin-plated steel sheet for welded cans forming a surface-treating layer comprising chiefly a silane coupling agent on the surface of a tin-plated layer formed on the surface of a steel sheet, wherein the amount of free tin (Sn) (X g/m | 12-23-2010 |
Yohei Tadaki, Tokyo JP
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20090115563 | Laminated inductor and method of manufacture of same - A laminated inductor, in which there is extremely little tendency for cracking to occur between adjacent conductor patterns in portions of a laminate in the lamination direction even when the conductor pattern thickness is large, as well as a method of manufacturing such a laminated inductor, are provided. | 05-07-2009 |
Yoshitaka Tadaki, Hanno JP
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20090189480 | Ultrasonic Transducer And Manufacturing Method - This invention provides a technique whereby, even if a step is produced by splitting a lower electrode into component elements, resistance increase of an upper electrode, damage to a membrane and decrease of dielectric strength between an upper electrode and the lower electrode, are reduced. In an ultrasonic transducer comprising plural lower electrodes, an insulation film covering the lower electrodes, plural hollow parts formed to overlap the lower electrodes on the insulation film, an insulation film filling the gaps among the hollow parts, an insulation film covering the hollow parts and insulation film, plural upper electrodes formed to overlap the hollow parts on the insulation film and plural interconnections joining them, the surfaces of the hollow parts and insulation film are flattened to the same height. | 07-30-2009 |
20100148594 | Ultrasonic Transducer And Manufacturing Method Thereof - An ultrasonic transducer includes a first electrode, a second electrode, an insulating film disposed between the first and second electrodes, and a cavity disposed between the first and second electrodes. The insulating film includes a projection extending in the cavity, and a portion of the cavity is disposed between the projection and the first electrode. A portion of one of the first electrode and the second electrode has an opening corresponding to a position of the projection of the insulating film when viewed in plan view. | 06-17-2010 |
20120326556 | Ultrasonic Transducer and Manufacturing Method - An ultrasonic transducer includes a first electrode, a first insulation film covering the first electrode, a hollow part overlapping the first electrode on the first insulation film, a second insulation film covering the hollow part, a second electrode overlapping the hollow part on the second insulation film, and an interconnection joined to the second electrode. An edge of the first electrode is formed so as to moderate a step of the first electrode. | 12-27-2012 |
Yoshitaka Tadaki, Hanno-Shi JP
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20130256839 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE - A semiconductor wafer may include: a disk-shaped wafer body made of silicon; and an identification trench section having at least one trench and provided at a periphery section of the wafer body, wherein the trench is opened in the periphery of the wafer body, and has a depth less than a thickness of the wafer body. | 10-03-2013 |
20130256879 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface. | 10-03-2013 |
20150311146 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface. | 10-29-2015 |
Yoshitaka Tadaki, Tokyo JP
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20130181316 | SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE - A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate. | 07-18-2013 |
20140367853 | SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE - A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate. | 12-18-2014 |
Yudai Tadaki, Tsukuba-Shi JP
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20080236482 | METHOD FOR LOW TEMPERATURE THERMAL CLEANING - Methods and apparatus for cleaning undesired substances from a surface in a semiconductor processing chamber. A gas mixture containing a fluorine source and an oxygen source is pre-treated to contain active fluorine species. The pre-treated mixture is stored for a time in a gas storage device, and then introduced to a semiconductor processing chamber. Prior to introduction of the pre-treated gas, the temperature in the chamber is lowered to a temperature equal to or lower than the normal operating temperature. Undesired substances are removed or cleaned through chemical reaction with the pre-treated gas mixture, without the generation of a plasma or a high temperature condition in the chamber. | 10-02-2008 |
20140235066 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF CLEANING PROCESSING VESSEL - When a dry cleaning process is performed in a processing chamber by adding nitrogen monoxide (NO) gas to a cleaning gas, the handling is facilitated, and cleaning performance is improved. A substrate processing apparatus includes a processing vessel configured to process a substrate, a first cleaning gas supply system configured to pre-mix a gas containing fluorine atoms with the NO gas and supply the pre-mixed gas into the processing vessel, and a second cleaning gas supply system installed apart from the first cleaning gas supply system and configured to supply the fluorine-containing gas into the processing vessel. | 08-21-2014 |
Yudai Tadaki, Ibaraki JP
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20110259370 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF CLEANING PROCESSING VESSEL - When a dry cleaning process is performed in a processing chamber by adding nitrogen monoxide (NO) gas to a cleaning gas, the handling is facilitated, and cleaning performance is improved. A substrate processing apparatus includes a processing vessel configured to process a substrate, a first cleaning gas supply system configured to pre-mix a gas containing fluorine atoms with the NO gas and supply the pre-mixed gas into the processing vessel, and a second cleaning gas supply system installed apart from the first cleaning gas supply system and configured to supply the fluorine-containing gas into the processing vessel. | 10-27-2011 |
Yudai Tadaki, Tsukuba JP
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20080236483 | METHOD FOR LOW TEMPERATURE THERMAL CLEANING - Methods and apparatus for cleaning undesired substances from a surface in a semiconductor processing chamber. A gas mixture containing a fluorine source and an oxygen source is pre-treated to contain active fluorine species. The pre-treated mixture is stored for a time in a gas storage device, and then introduced to a semiconductor processing chamber. Prior to introduction of the pre-treated gas, the temperature in the chamber is lowered to a temperature equal to or lower than the normal operating temperature. Undesired substances are removed or cleaned through chemical reaction with the pre-treated gas mixture, without the generation of a plasma or a high temperature condition in the chamber. | 10-02-2008 |
20100132744 | Thermal Cleaning Gas Production and Supply System - Methods and apparatus for cleaning undesired substances from a surface in a semiconductor processing chamber. An cleaning gas mixture is formed onsite and stored in a buffer tank for a time, prior to its introduction into a semiconductor processing chamber, to remove an undesired substance from a surface in the chamber. The undesired substance is removed without the generation of a plasma in the chamber, and at a temperature of less than 300° C. | 06-03-2010 |
20140248783 | CLEANING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM - A cleaning method includes: providing a process container in which a process of forming a film on a substrate is performed; and removing a deposit including the film adhered to the process container by supplying a cleaning gas into the process container after performing the process. The act of removing the deposit includes generating a mixture gas of a fluorine-containing gas and a nitrosyl fluoride gas as the cleaning gas by mixture and reaction of the fluorine-containing gas and a nitrogen monoxide gas in a mixture part and supplying the mixture gas from the mixture part into the process container after removing exothermic energy generated by the reaction. | 09-04-2014 |