Syunsuke
Syunsuke Fujita, Otsu-Shi JP
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20090023575 | Optical Glass - The present invention provides a glass having a refractive index and a coefficient of thermal expansion close to those of quartz glass, respectively, and also having anti-devitrification properties excellent enough to avoid the development of defects such as devitrification on the glass surface even when it is molded by drawing process or reheat forming, more specifically an optical glass for use in optical communication devices, particularly an optical glass for use in a stub. | 01-22-2009 |
Syunsuke Gokyu, Kodaira-Shi JP
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20140067193 | SYSTEM FOR PREDICTING TIRE CASING LIFE - A system for predicting tire casing life remaining for a casing in a tire, the system including: a tire condition measurement unit that measures one characteristic value including tire internal pressure information indicating at least one of a tire condition and a vehicle running condition; a temperature history estimation unit that estimates a temperature history of at least one location in at least one casing structural member based on the characteristic value; a member physical property calculation unit that calculates at least one current physical property value of the at least one casing structural member that degrades due to tire internal air temperature based on at least the tire internal pressure information and the temperature history; and a remaining drivable distance prediction unit that predicts a drivable distance of the tire until the current physical property value reaches a physical property value limit set in advance. | 03-06-2014 |
20140067599 | METHOD FOR TREAD SELECTION - A method for tread selection to select a tread to attach to a tread side of a tire casing when manufacturing a tire includes the steps of: a) measuring, by a tire condition measurement unit, at least one characteristic value indicating at least one of a tire condition and a vehicle running condition; b) predicting, by a casing life prediction unit, a remaining life of the tire casing based on the at least one characteristic value measured in step a); c) selecting, by a tread selection unit, at least one recommended tread in accordance with the remaining life of the tire casing predicted in step b) from among a plurality of treads attachable to the tire casing, using wear life information calculated in advance for each of the treads; and d) displaying, by a terminal, the at least one recommended tread selected in step c). | 03-06-2014 |
Syunsuke Harada, Kariya-City JP
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20140131798 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor substrate including a first semiconductor layer on the semiconductor substrate; multiple semiconductor elements in the semiconductor substrate; and an ineffective region. Each semiconductor element includes: a second semiconductor layer in a surface portion of the first semiconductor layer; a third semiconductor layer disposed in another surface portion of the first semiconductor layer and spaced a part from the second semiconductor layer; and a control layer disposed on a portion of the first semiconductor layer between the second semiconductor layer and the third semiconductor layer. The ineffective region is disposed in the semiconductor substrate between at least two adjacent semiconductor elements; and does not provide a function of the semiconductor elements. | 05-15-2014 |
Syunsuke Hirano, Tokyo JP
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20150056454 | RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE - Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin. | 02-26-2015 |
20150210832 | RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE - The present invention provides a resin sheet that exhibits a small reduction in light reflectance due to a heating treatment and a light irradiation treatment with an excellent heat resistance being maintained. The present invention provides a resin sheet including a layer including a resin composition containing an aliphatic epoxy-modified silicone compound (A), a branched imide resin having an isocyanurate group and a carboxyl group (B), titanium dioxide (C) and a wetting and dispersing agent (D). | 07-30-2015 |
Syunsuke Horiuchi, Nagoya-Shi, Aichi JP
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20150329677 | PRODUCTION METHOD OF CYCLIC POLYARYLENE SULFIDE (AS AMENDED) - There is provided a production method of a cyclic polyarylene sulfide by heating and reacting a raw material mixture (a) including at least a sulfidizing agent, a dihalogenated aromatic compound and an organic polar solvent. The production method continually performs each of an operation (A) of supplying the raw material mixture (a) to a reaction mixture (b) in a reaction vessel which includes a reaction product obtained from the raw material mixture (a), an operation (B) of withdrawing part of the reaction mixture (b) from the reaction vessel, and an operation (C) of heating the reaction vessel. | 11-19-2015 |
Syunsuke Koga, Onojou JP
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20140029603 | METHOD AND DEVICE FOR TIME-SYNCHRONIZATION IN AD HOC NETWORK - A method and a device perform time-synchronization with an ad hoc network configured by a plurality of nodes. The method includes: transmitting a time-synchronization request frame including an address of one of the plurality of nodes which belong to the ad hoc network to one of the plurality of nodes having a function of receiving the time-synchronization request frame and transmitting a time-synchronization reply frame including time-synchronization information; receiving the time-synchronization reply frame including the time-synchronization information from one of the plurality of nodes which receive the time-synchronization request frame; and performing time-synchronization with one of the plurality of nodes using the time-synchronization information included in the time-synchronization reply frame. | 01-30-2014 |
Syunsuke Kubo, Gifu JP
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20150369262 | FLUID PRESSURE CONTROL DEVICE - A fluid pressure control device includes a switching valve configured to operate in conjunction with the control valve by the pilot pressure led through the pilot valve to switch work of the operation check valve. The switching valve includes a pilot chamber to which the pilot pressure is led, a spool that moves in accordance with the pilot pressure of the pilot chamber, a bias member that biases the spool in the valve closing direction, a collar detachably installed in the pilot chamber, and a piston slidably inserted into the collar, the piston being configured to receive the pilot pressure on a back surface thereof and give thrust force to the spool against bias force of the bias member. | 12-24-2015 |
Syunsuke Maruyama, Kanagawa-Ken JP
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20090238027 | Apparatus for and Method of Kneading Rubber Material - Disclosed are: an apparatus for kneading a rubber material which continuously performs a series of processes which are kneading a rubber material with a non-vulcanization compounding agent at the beginning, kneading it with a vulcanization compounding agent, and finally obtaining final kneaded rubber; and a kneading method using this kneading apparatus. Preparatory kneaded rubber having been kneaded in one internal mixer is selectively fed, by a distribution conveyor, to a group of kneading lines where at least two kneading lines are provided to be arranged side by side. Each of the kneading line consists of a plurality of open roll mixers serially connected with each other. Intermediate kneaded rubber resulted in having a target viscosity after having been kneaded in the group of kneading lines is kneaded with a vulcanization compounding agent, whereby final kneaded rubber is obtained. | 09-24-2009 |
Syunsuke Nakazawa, Nara JP
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20160039060 | Tool Changer - A tool changer | 02-11-2016 |
20160074981 | MACHINE TOOL SPINDLE DEVICE - In a machine tool spindle device, a draw bar is arranged inside a center hole of a spindle, and a disc spring is arranged inside a spring member arrangement space between the draw bar and the center hole. A draw bar inner pipe is inserted inside a through hole of the draw bar, and the interior of the draw bar inner pipe is used as a coolant passage. A gap between the draw bar inner pipe and the through hole is used as an air passage for supplying the purge air, and the interior of the spring member arrangement space is used as a coolant supply passage for supplying coolant to cooling jackets of the spindle. | 03-17-2016 |
Syunsuke Nomura, Kariya-City JP
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20130060418 | ELECTRONIC CONTROL UNIT - An electronic control unit includes an abnormality detecting section, a storage portion, a simplifying section, and a storing section. The abnormality detecting section detects an occurrence of a vehicle abnormality. The storage portion stores driving information of a vehicle. The simplifying section simplifies time-series data values of the driving information before the occurrence of the vehicle abnormality by reducing an accuracy of the time-series data values of the driving information and does not simplify a data value of the driving information at the occurrence of the vehicle abnormality. The storing section stores the data value of the driving information at the occurrence of the vehicle abnormality, which is not simplified by the simplifying section, and the time-series data values of the driving information before the occurrence of the vehicle abnormality, which are simplified by the simplifying section, in the storage portion. | 03-07-2013 |
20150221145 | ELECTRONIC CONTROL APPARATUS FOR ELECTRICALLY-DRIVEN VEHICLE - An electronic control apparatus controls am electrically-driven vehicle, which has no engine but has only a motor supplied with electric power from an electric power supply source. The electronic control apparatus has a self-diagnosis function for storing an abnormality code corresponding to a diagnosis object when abnormality of the diagnosis object is detected. The electronic control apparatus checks whether the motor and the electric power supply source are operating normally when a power control switch is turned on under a state that the abnormality code is stored in a memory. The electronic control apparatus checks whether abnormality is detected again in the diagnosis object, the abnormality code of which has already been stored, when the motor and the electric power supply source are operating normally. The electronic control unit erases the abnormality code when no abnormality is detected again. | 08-06-2015 |
Syunsuke Oda, Kusatsu-Shi JP
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20100105992 | Pressure-sensitive conductive yarn and biological information-measuring garment | 04-29-2010 |
Syunsuke Okuda, Nagaokakyo-Shi JP
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20120068127 | BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC COMPOSITION AND BARIUM TITANATE-BASED SEMICONDUCTOR CERAMIC DEVICE - A barium titanate-based semiconductor ceramic composition which can be used for PTC thermistors for temperature sensors and which has characteristics, including a linear characteristic, advantageous for such PTC thermistors and a barium titanate-based semiconductor ceramic device. The barium titanate-based semiconductor ceramic composition is represented by the formula (Ba | 03-22-2012 |
Syunsuke Ono, Takatsuki-Shi JP
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20080258622 | HIGH-PRESSURE DISCHARGE LAMP, LIGHTING METHOD AND LIGHTING DEVICE FOR HIGH-PRESSURE DISCHARGE LAMP, HIGH-PRESSURE DISCHARGE LAMP DEVICE, AND LAMP UNIT, IMAGE DISPLAY DEVICE AND HEADLIGHT DEVICE - In a high-pressure discharge lamp that includes a bulb formed from a light emitting part having a discharge space therein and a pair of sealing parts connected to the light emitting part, and an electrode pair disposed within the discharge space, a section of a proximity conductor is wound substantially spirally around one of the sealing parts within a predetermined range from the light emitting part, while the remaining section of the proximity conductor crosses over the light emitting part and is electrically connected to the electrode nearer the other sealing part. By initiating a discharge after applying a high-frequency voltage of 1 kHz to 1 MHz to a high-pressure mercury lamp having this structure, the breakdown voltage can be suppressed to at least 8 kV. | 10-23-2008 |
Syunsuke Satoh, Kakogawa-Shi JP
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20100270891 | SEALING MEMBER OF PIEZOELECTRIC RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR - A sealing member of a piezoelectric resonator device is configured to hermetically seal a driving electrode formed on a piezoelectric resonator plate. In the sealing member, a through hole is formed so that an electrode pattern formed on both major surfaces of the substrate is brought into conduction; and a conductive member fills in the through hole. The through hole has a smaller diameter at a portion thereof inside the substrate than at both end portions thereof at the major surfaces of the sealing member. Both end faces of the conductive member have a concave shape with respect to the major surfaces of the substrate of the sealing member. | 10-28-2010 |
20110043079 | TUNING-FORK TYPE PIEZOELECTRIC RESONATOR PLATE AND TUNING-FORK TYPE PIEZOELECTRIC RESONATOR DEVICE - A tuning-fork type piezoelectric resonator plate includes: at least a plurality of leg portions serving as vibrating portions; a bonding portion bonded to the outside, and a base portion from which the leg portions and the bonding portion protrude. The plurality of leg portions protrude from a first end face of the base portion and are provided side-by-side on the first end face. The bonding portion protrude from a second end face located opposite the first end face of the base portion at a position located opposite a center position of the plurality of leg portions in a width direction of the first end face of the base portion. And, at least a base end portion of the bonding portion is used as a bond region that is bonded to the outside. | 02-24-2011 |
20110187236 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 08-04-2011 |
20120012356 | PACKAGE MEMBER ASSEMBLY, METHOD FOR MANUFACTURING THE PACKAGE MEMBER ASSEMBLY, PACKAGE MEMBER, AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE USING THE PACKAGE MEMBER - [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face. | 01-19-2012 |
20120187805 | PIEZOELECTRIC RESONATOR PLATE AND MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR PLATE - In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed. | 07-26-2012 |
Syunsuke Satoh, Hyogo JP
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20080265717 | Piezoelectric Resonator Plate and Piezoelectric Resonator Device - An electrode forming region for providing lead electrodes ( | 10-30-2008 |
20090267460 | PIEZOELECTRIC RESONATOR PLATE, AND PIEZOELECTRIC RESONATOR DEVICE - A piezoelectric resonator device comprises a piezoelectric resonator plate, a base for holding the piezoelectric resonator plate, a lid for hermetically enclosing the piezoelectric resonator plate held on the base, and a support member made of a brittle material for reducing external stress to the piezoelectric resonator plate. The piezoelectric resonator plate is held on the base via a support member. In this case, the base, the piezoelectric resonator plate, and the support member are bonded with each other using a base bonding member and a piezoelectric resonator plate bonding member (connection bumps) by FCB using ultrasonic waves. The base is electrically and mechanically bonded with the support member via the base bonding member in a plurality of areas of the support member using ultrasonic waves. Also, the piezoelectric resonator plate is electrically and mechanically bonded with the support member via the piezoelectric resonator plate bonding member in an area of the piezoelectric resonator plate using ultrasonic waves. | 10-29-2009 |
20110265298 | METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR DEVICE - A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained. | 11-03-2011 |
Syunsuke Shibata, Nishio-City JP
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20150276514 | OPERATION INPUT DEVICE - An operation input device includes a connection body that has two slopes respectively having an angle against an operation panel to form a gable roof shape, and each of the two slopes has a strain body disposed thereon, and an vertex of the roof-shaped slopes is positioned within a preset distance from an outer face of the operation panel, and the strain body, the connection body and a strain gauge are disposed in an inside of a box-shaped operation unit. | 10-01-2015 |
20150276515 | OPERATION INPUT DEVICE - An operation input device has an improved position detection accuracy for detecting a position of an operation force by forming a wide portion on one end of an operation unit at a periphery thereof and by fixedly disposing, on a stay, a narrow portion on an opposite end of the operation unit, among which the wide portion protrudes in an in-parallel direction of an operation surface of the operation unit. | 10-01-2015 |
Syunsuke Takeuchi, Nagaokakyo-Shi JP
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20110122540 | LAMINATED ELECTRONIC COMPONENT - A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less. | 05-26-2011 |
20110193448 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent. | 08-11-2011 |
20110234045 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer. | 09-29-2011 |
20110235232 | ELECTRONIC COMPONENT - An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more. | 09-29-2011 |
20110235234 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface. | 09-29-2011 |
20110236658 | LAMINATED ELECTRONIC COMPONENT - A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation. | 09-29-2011 |
20110309718 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region. | 12-22-2011 |
20120069489 | ELECTRONIC COMPONENT - In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin. | 03-22-2012 |
20120169180 | LAMINATE TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts. | 07-05-2012 |
20120188683 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT - A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon. | 07-26-2012 |
20120236461 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view. | 09-20-2012 |
20130250474 | ELECTRONIC COMPONENT - An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more. | 09-26-2013 |
20130294009 | ELECTRONIC COMPONENT - In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively. | 11-07-2013 |
20150325374 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer. | 11-12-2015 |
Syunsuke Tanaka, Saitama-Shi JP
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20150288901 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device comprises a plurality of hybrid pixels. The hybrid pixel comprises a photodiode, which has a charge storage region and a photoelectric conversion region, and a transparent electrode. The transparent electrode applies a voltage to the charge storage region to modulate a potential with respect to a charge. Thereby the width of the charge storage region is reduced to form an effective charge storage region. Unless potentially modulated, the hybrid pixel functions as a normal pixel. Upon the potential modulation, the hybrid pixel functions as a phase detection pixel, which selectively stores the charge generated in a part of the photoelectric conversion region. | 10-08-2015 |
Syunsuke Uchida, Tochigi JP
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20160104657 | Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device - A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm | 04-14-2016 |
Syunsuke Uchida, Tokyo JP
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20160118316 | THERMALLY CONDUCTIVE SHEET - A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more. | 04-28-2016 |