Patent application number | Description | Published |
20140085767 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces opposing each other and third and fourth end surfaces connecting the first and second side surfaces, first and second internal electrodes formed in the ceramic body and having one ends exposed to the first and second side surfaces and the third end surface or exposed to the first and second side surfaces and the fourth end surface, first and second external electrodes formed on an outer side of the ceramic body and electrically connected to the first and second internal electrodes, and a plating layer partially formed on certain regions of the first and second external electrodes, wherein a polymer layer is additionally formed on the ceramic body on regions of upper portions of the first and second external electrodes on which the plating layer is not formed. | 03-27-2014 |
20140098457 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME - There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO | 04-10-2014 |
20140168851 | MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD WITH MULTILAYER CERAMIC CAPACITOR MOUNTED THERE ON - A multilayer ceramic capacitor includes a ceramic body having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another. First and second internal electrodes have an overlap region with lead out portions exposed to the first lateral surface of the ceramic body. An insulating layer is formed to cover the overlap region of the lead out portions exposed to the first lateral surface of the ceramic body; and first and second external electrodes are formed on the first lateral surface of the ceramic body on which the insulating layer is formed and electrically connected to the first and second internal electrodes. Thicknesses of the insulating layer from the first lateral surface and the first and second external electrodes from the first lateral surface are specified. | 06-19-2014 |
20140218840 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a dielectric composition and a multilayer ceramic electronic component using the same, the dielectric composition including dielectric grains having a perovskite structure represented by ABO | 08-07-2014 |
20140268484 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - A dielectric ceramic composition includes: a base material powder Ba | 09-18-2014 |
20140355175 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - A multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; first and second internal electrodes stacked to have the dielectric layer interposed therebetween within the ceramic body and alternately exposed through the first and second end surfaces; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, and including first and second head parts formed on the first and second end surfaces, wherein width of the first and second head parts is less than width of the ceramic body, and when length, width and thickness of the ceramic body are defined as L, W, and T, respectively, T/W>1.0 is satisfied. | 12-04-2014 |