Patent application number | Description | Published |
20120140520 | LIGHT EMITTING DEVICE MODULE AND BACKLIGHT UNIT INCLUDING THE SAME - Disclosed is a light emitting device module, which includes a circuit board having at least two cavities, a reflective layer formed on a surface of each cavity, and a light emitting device package disposed in each cavity. The light emitting device package includes a package body and a light emitting device disposed on the package body, the light emitting device being electrically connected to a first lead frame and a second lead frame. | 06-07-2012 |
20120286319 | LIGHT EMITTING DEVICE PACKAGE AND ULTRAVIOLET LAMP HAVING THE SAME - Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member. | 11-15-2012 |
20130049563 | LIGHT EMITTING DEVICE PACKAGE, LIGHT SOURCE MODULE, AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region. | 02-28-2013 |
20130049564 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT - Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface. | 02-28-2013 |
20140042482 | LIGHT EMITTING PACKAGE - A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body. | 02-13-2014 |
20150069445 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region. | 03-12-2015 |
20160043296 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT - Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface. | 02-11-2016 |