Stumpf
Andre Stumpf, Bonsecours FR
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20100045105 | INTEGRATED MULTIPLE POWER CONVERSION SYSTEM FOR TRANSPORT REFRIGERATION UNITS - The invention relates to an electrical subsystem to power a vehicle refrigeration system. The electrical subsystem includes an AC drive electrically coupled to a high voltage DC bus. The AC drive provides “refrigeration compressor AC power” responsive to a cooling demand. The electrical subsystem also includes a “low voltage DC bus”. The low voltage DC bus powers a plurality of low voltage refrigeration components including refrigeration fans. A microcontroller sets the compressor AC voltage and the compressor AC frequency. A method of preventing vehicle refrigeration system compressor stall includes the step of limiting the electrical AC power to the compressor such that the AC voltage does not droop causing a compressor stall. Also, an electrical subsystem for powering a compressor in a vehicle refrigeration system includes “V/f” operating information for the compressor, and a microcontroller commands the AC voltage and the AC frequency to the compressor. | 02-25-2010 |
André Georges Stumpf, Bonsecours FR
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20160101667 | Thermochemical Boosted Refrigeration System - A transport refrigeration system ( | 04-14-2016 |
20160101674 | Refrigerated Container with Dual Air Curtain - A transport refrigeration system comprises: a container ( | 04-14-2016 |
Joseph C. Stumpf, Carlsbad CA
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20140091230 | UV FLUX MULTIPLICATION SYSTEM FOR STERILIZING AIR, MEDICAL DEVICES AND OTHER MATERIALS - An ultraviolet flux multiplying air sterilization chamber comprises inner surfaces having a diffuse reflective behavior. The sterilization chamber includes an inlet aperture and an outlet aperture for air to flow through said chamber and a light source emitting an ultraviolet light. Due to the reflectivity of the inner surfaces of the chamber, a flux of the ultraviolet light is multiplied by reflecting multiple times from the inner surfaces of the chamber. The inlet and outlet apertures are advantageously configured to reduce the amount of light that escapes from the chamber and increase the amount of photons available in the chamber. In an exemplary embodiment, perforated end panels having diffuse, reflective interior surfaces may be provided over at least a portion of the inlet and outlet apertures. | 04-03-2014 |
Pascal Stumpf, Horbourg-Wihr FR
Patent application number | Description | Published |
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20090302447 | SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND METHOD FOR FABRICATING SUCH AN ARRANGEMENT - A semiconductor arrangement includes first and second integrated circuits (dies), an electrically conductive intermediate element, and one or more bond conductors. The first and the second integrated circuits are arranged in a package. The first integrated circuit has a first contact pad. The second integrated circuit has a second contact pad. The intermediate element is disposed on the second contact pad. The conductors electrically connect the first and the second integrated circuits. At least one of the bond conductors has a first end electrically connected to the first contact pad, and a second wedge shaped end electrically connected to the intermediate element. The bond conductor is made of a first material and the intermediate element is made of a second material which is softer than the first material. | 12-10-2009 |
20120228756 | SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUCTOR HOUSING - A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body. | 09-13-2012 |
20130062779 | BONDING CONTACT AREA ON A SEMICONDUCTOR SUBSTRATE - A bonding contact area on a semiconductor substrate is provided that includes a reinforcing structure having at least one conductive material layer arranged on the semiconductor substrate to receive the patterned reinforcing structure, a metal layer formed as a bonding contact layer with a bonding surface and arranged on a conductive material layer. Whereby, below the bonding surface, an oxide layer having at least about a 2 μm thickness is arranged, which extends beyond the edge of the bonding surface. The reinforcing structure is arranged in the oxide layer, when viewed looking down onto the bonding surface, outside the bonding surface within the oxide layer. | 03-14-2013 |
20140057395 | SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUCTOR HOUSING - A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body. | 02-27-2014 |
Taisa Regina Stumpf, Florianopolis BR
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20150191445 | ACYL-HYDRAZONE AND OXADIAZOLE COMPOUNDS, PHARMACEUTICAL COMPOSITIONS CONTAINING THE SAME AND USES THEREOF - The present invention relates to acyl-hydrazone compounds, in particular 3,4,5-trimethoxyphenyl-hydrazide derivatives, as well as the oxadiazole analogs thereof and other similar compounds, and to the pharmaceutical use of the same for the treatment of various diseases associated with cell proliferation, such as leukemias, including acute lymphoblastic leukemia (ALL), tumours and inflammation. Acyl-hydrazones have been obtained having activity similar to that of the compound used as a standard in experiments (colchicine). The greater selectivity of the compounds according to the invention is an important feature, associated with fewer side effects than the pharmaceuticals used at present in clinical treatments. The synthetised acyl-hydrazones, more particularly the compounds 02 and 07, exhibited important antileukemic activity, which suggests 02 and 07 as candidates to pharmaceutical prototypes, or to pharmaceuticals for the treatment of leukemias, in particular acute lymphoblastic leukemia (ALL), tumours and other proliferative diseases, such as inflammation. The action mechanism of the most active compounds was determined by using DNA microarrays and subsequent tests indicated by the chip, besides selectivity studies in healthy human lymphocytes. | 07-09-2015 |
Waldo Edmund Stumpf, Pretoria ZA
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20120174749 | Armour steel - A low-carbon martensitic armour steel comprises at least Fe, C, Si and Ni and has a ratio of yield strength to ultimate tensile strength of less than 0.7. The steel includes retained austenite at a volume fraction of at least 1%. The low-carbon martensitic armour steel can be prepared by subjecting a steel which comprises at least Fe, C, Si and Ni and which has a martensite start temperature of less than 210° C. to an austenisation heat treatment step at a temperature of at least 800° C., quenching the steel, and subjecting the steel to a tempering step at a temperature of less than 300° C. | 07-12-2012 |
Waldo Edmund Stumpf, Groenkloof ZA
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20120144989 | HIGH BALLISTIC STRENGTH MARTENSITIC ARMOUR STEEL ALLOY - The invention relates to an air hardenable high-hardness steel for armouring applications, such as armour plate for use in light armoured vehicles and body armour, and having a high level of ballistic performance relative to its plate thickness. In particular, the invention concerns a high ballistic strength martensitic armour steel which, in an air cooled and untempered condition, has a strength coefficient (s0) of higher than 2500 MPa; a flow parameter (P) of higher than 8.0, preferably higher than 18.0; and a manganese content of 1.8 to 3.6% by weight of manganese, preferably 2.8 to 3.1% by weight of manganese. The armour steel also includes retained austenite at a volume fraction of at least 1%, and preferably a volume fraction of 4 to 20%. | 06-14-2012 |