Patent application number | Description | Published |
20080309358 | Active wafer probe - A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test. | 12-18-2008 |
20090021273 | On-wafer test structures - A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies. | 01-22-2009 |
20100253377 | ACTIVE WAFER PROBE - A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test. | 10-07-2010 |
20100264948 | DIFFERENTIAL SIGNAL PROBING SYSTEM - A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal | 10-21-2010 |
20130015871 | SYSTEMS, DEVICES, AND METHODS FOR TWO-SIDED TESTING OF ELECTRONIC DEVICES - Systems, devices, and methods for two-sided testing of electronic devices. These systems, devices, and methods may include the use of a test fixture that is configured to electrically connect a back side electrical pad of a device under test with an auxiliary pad that faces in a different direction than the back side electrical pad. Additionally or alternatively, these systems, devices, and methods also may include the use of a probe head that is configured to form an electrical connection with both the auxiliary pad and a front side electrical pad of the device under test. The systems, devices, and methods also may include providing a test signal to the device under test, receiving a resultant signal from the device under test, and/or analyzing the resultant signal. | 01-17-2013 |
Patent application number | Description | Published |
20100001742 | Calibration technique - The tolerance of Short-Open-Load (SOL) and Short-Open-Load-Reflect (SOLR) VNA calibration for variability in probe position is improved by using load and short calibration structures having impedance elements with a length at least two times the probe contact pitch and a width at least two times the sum of the combined pitches of the probe contacts. | 01-07-2010 |
20120098559 | SYSTEMS AND METHODS FOR SIMULTANEOUS OPTICAL TESTING OF A PLURALITY OF DEVICES UNDER TEST - Systems and methods for simultaneous optical testing of a plurality of devices under test. These systems and methods may include the use of an optical probe assembly that includes a power supply structure that is configured to provide an electric current to a plurality of devices under test (DUTs) and an optical collection structure that is configured to simultaneously collect electromagnetic radiation that may be produced by the plurality of DUTs and to provide the collected electromagnetic radiation to one or more optical detection devices. The systems and methods also may include the use of the optical probe assembly in an optical probe system to evaluate one or more performance parameters of each of the plurality of DUTs. | 04-26-2012 |
20120306587 | HIGH FREQUENCY INTERCONNECT STRUCTURES, ELECTRONIC ASSEMBLIES THAT UTILIZE HIGH FREQUENCY INTERCONNECT STRUCTURES, AND METHODS OF OPERATING THE SAME - High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure. | 12-06-2012 |
20130183898 | SYSTEMS AND METHODS FOR NON-CONTACT POWER AND DATA TRANSFER IN ELECTRONIC DEVICES - Systems and methods for non-contact and/or wireless transmission of power and/or data between and/or within electronic devices. These systems and methods may include the use of two or more wireless power modules to transmit a wireless power signal between a first electronic device and a second electronic device and/or the use of two or more wireless data modules to transmit a wireless data signal between the first electronic device and the second electronic device. The wireless power modules and/or the wireless data modules may include one or more near-field coupling devices. The wireless power modules and/or wireless data modules associated with the first electronic device may be arranged in complementary locations to the wireless power modules and/or wireless data modules associated with the second electronic device and the complementary modules may be separated by a distance of less than 10 um. | 07-18-2013 |