Patent application number | Description | Published |
20100127190 | CHARGED PARTICLE BEAM MASKING FOR LASER ABLATION MICROMACHINING - An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser. | 05-27-2010 |
20100197142 | HIGH SELECTIVITY, LOW DAMAGE ELECTRON-BEAM DELINEATION ETCH - A method and apparatus for selective etching a substrate using a focused beam. For example, multiple gases may be used that are involved in competing beam-induced and spontaneous reactions, with the result depending on the materials on the substrate. The gases may include, for example, an etchant gas and an auxiliary gas that inhibits etching. | 08-05-2010 |
20110070381 | USE OF NITROGEN-BASED REDUCING COMPOUNDS IN BEAM-INDUCED PROCESSING - A system for beam-induced deposition or etching, in which a charged particle or laser beam can be directed to a work piece within a single vacuum chamber, either normally incident or at an angle. Simultaneously with beam illumination of the work piece, a deposition or etch precursor gas is co-injected or premixed with a purification compound and (optionally) a carrier gas prior to injection into the process chamber. The beam decomposes the deposition precursor gas to deposit a film only in areas illuminated by the beam, or decomposes the etch precursor gas to etch a film only in areas illuminated by the beam. Undesired impurities such as carbon in the deposited film are removed during film growth by interaction with adsorbed species on the work piece surface that are generated by interaction of the beam with adsorbed molecules of the film purification compound. Alternatively, the film purification compound can be used to inhibit oxidation of the material etched by the etch precursor gas. By co-injecting or premixing the deposition or etch precursor gas and film purification compound prior to injection, the deposition or etch process may be optimized with respect to growth/etch rate and achievable material purity. | 03-24-2011 |
20110114665 | GAS DELIVERY FOR BEAM PROCESSING SYSTEMS - Gas flow from multiple gas sources into a sample chamber of a beam system is controlled by a cycling valve for each gas source, with the gas pressure in the sample chamber being determined by the relative time that the valve is opened and the upstream pressure at the valve. A gas valve positioned inside the vacuum chamber allows rapid response in shutting off a gas. In some preferred embodiments, a precursor gas is supplied from a solid or liquid material in a container that remains outside the vacuum system while in use and which is readily connected or disconnected to the gas injection system without significant leakage. | 05-19-2011 |
20120196440 | Method of Depositing Material - Material is deposited in a desired pattern by spontaneous deposition of precursor gas at regions of a surface that are prepared using a beam to provide conditions to support the initiation of the spontaneous reaction. One the reaction is initiated, it continues in the absence of the beam at the regions of the surface at which the reaction was initiated. | 08-02-2012 |
20120200007 | Charged Particle Beam Masking for Laser Ablation Micromachining - An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser. | 08-09-2012 |
20120308740 | Beam-Induced Deposition of Low-Resistivity Material - An improved method of beam deposition to deposit a low-resistivity metal. Preferred embodiments of the present invention use a novel focused ion beam induced deposition precursor to deposit low-resistivity metallic material such as tin. Applicants have discovered that by using a methylated or ethylated metal such as hexamethylditin as a precursor, material can be deposited having a resistivity as low as 40 μΩ·cm. | 12-06-2012 |
20130068611 | Localized, In-Vacuum Modification of Small Structures - A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or micro-electromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber. | 03-21-2013 |
20140065319 | Seed Layer Laser-Induced Deposition - A method of creating a layer of a target deposit-material, in a first target pattern, on a substrate surface. The substrate surface is placed in a vacuum and exposed to a first chemical vapor, having precursor molecules for a seed deposit-material, thereby forming a first substrate surface area that has adsorbed the precursor molecules. Then, a charged particle beam is applied to the first substrate surface area in a second target pattern, largely identical to the first target pattern thereby forming a seed layer in a third target pattern. The seed layer is exposed to a second chemical vapor, having target deposit-material precursor molecules, which are adsorbed onto the seed layer. Finally, a laser beam is applied to the seed layer and neighboring area, thereby forming a target deposit-material layer over and about the seed layer, where exposed to the laser beam. | 03-06-2014 |
20140151335 | Microfluidics Delivery Systems - Methods of dispensing a small amount of liquid onto a work piece includes in some embodiments known providing a microscopic channel for the liquid to flow from the nanodispenser. In some embodiments, dispensing the liquid includes dispensing the liquid using a nanodispenser have at least one slit extending to the tip. Some methods include controlling the rate of evaporation or the rate of liquid flow to establish an equilibrium producing a bubble of a desired size. | 06-05-2014 |