Patent application number | Description | Published |
20080224879 | Mounted shock sensor - This application is directed to a shock sensor mounted in an electronic device. The shock sensor includes both active and passive shock detection methods that allow a technician to determine whether the electronic device was subjected to a shock event that exceeded an impact threshold level. The shock sensor may include shock detection contacts that form an electrical circuit that remains open in the absence of a shock event that exceeds an impact threshold level. In response to a significant shock event, a movable component or substance of the shock sensor may move from a first position to a second position, thereby closing the electrical circuit formed by the shock detection contacts. The change in circuit may be detected and used to provide active indication of whether the electronic device has been subjected to a substantial shock event. In addition, the shock sensor may be observed to passively determine whether the electronic device has been subjected to a substantial shock event. | 09-18-2008 |
20080316121 | WIRELESS HANDHELD ELECTRONIC DEVICE - A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors. | 12-25-2008 |
20090017242 | Methods and systems for forming a dual layer housing - Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate. | 01-15-2009 |
20090205444 | MOUNTED SHOCK SENSOR - This application is directed to a shock sensor mounted in an electronic device. The shock sensor includes both active and passive shock detection methods that allow a technician to determine whether the electronic device was subjected to a shock event that exceeded an impact threshold level. The shock sensor may include shock detection contacts that form an electrical circuit that remains open in the absence of a shock event that exceeds an impact threshold level. In response to a significant shock event, a movable component or substance of the shock sensor may move from a first position to a second position, thereby closing the electrical circuit formed by the shock detection contacts. The change in circuit may be detected and used to provide active indication of whether the electronic device has been subjected to a substantial shock event. In addition, the shock sensor may be observed to passively determine whether the electronic device has been subjected to a substantial shock event. | 08-20-2009 |
20090316351 | PORTABLE ELECTRONIC DEVICE WITH MULTIPURPOSE HARD DRIVE CIRCUIT BOARD - A hard drive for a portable electronic device is provided that contains a multipurpose circuit board. The multipurpose circuit board may be mounted within a hard drive housing. System components and hard drive controller components may be mounted to the multipurpose circuit board. The multipurpose circuit board may be formed from a rigid flex structure or other structure that is able to accommodate translation of the multipurpose circuit board relative to the remainder of the portable electronic device in the event of an impact event. Components may be mounted to the multipurpose board in accordance with their heights. The portable electronic device may include components such as a battery, display, buttons, and other input-output devices that are connected to the multipurpose circuit board via flex circuit portions of a rigid flex or other electrical paths. | 12-24-2009 |
20100054493 | ACCESSORY CONTROLLER FOR ELECTRONIC DEVICES - Accessories such as headsets for electronic devices are provided. A headset may be provided with a button controller assembly that has user-actuated buttons. The button controller assembly may be formed of housing portions that float with respect to each other. Plastic engagement structures may limit the amount of unimpeded travel that is exhibited by the housing portions. The housing portions may be formed from first and second housings. A rigid frame may be mounted within the second housing. The first housing may flex along its length when the user squeezes the first and second housings together to actuate a desired button. Housings may be formed as double-shot plastic parts having first and second plastics with different properties. Integrated circuits and a microphone may be mounted within the button controller assembly. A nonoperational microphone port may be provided as a visual indicator that the button controller contains a microphone. | 03-04-2010 |
20100117841 | WATER DETECTION ARRANGEMENT - An electronic device having an enclosure is disclosed. The electronic device includes a hole disposed at least partially through the enclosure. The electronic device also includes a detector configured to provide at least one visual indication after being immersed in water. The detector may include a moisture-indicating portion and a light-permitting moisture-proof membrane. The detector may be disposed inside at least one of the enclosure and the hole such that at least a portion of the detector is visible through the hole from outside of the enclosure without dismantling or opening the electronic device. The distance between the light-permitting moisture-proof membrane and an opening of the hole in the enclosure may be less than the distance between the moisture-indicating portion and the opening of the hole. | 05-13-2010 |
20100282405 | MEDIA PLAYER WITH MACHINED WINDOW UNDERCUT AND TRANSPARENT WALL DISPOSED THEREIN - A media player comprising a display screen is provided. The media player can include a housing having an opening and an area of reduced thickness around the opening. The media player can also include a transparent wall having a flange. Alternatively, the transparent wall may not require a flange but rather can be a flat, substantially transparent piece of material such as plexiglass or glass. The flange can be adhered to a surface of the area of reduced thickness in order to form a transparent protective cover for the display screen. In another embodiment of the invention, a method is provided. The method can include forming a transparent wall having a stepped edge for placing in an opening of a media player. The method can also include adhering an adhesive to at least one surface of the stepped edge of the transparent wall. The method can include as well using the cutting tool to cut away a portion of the underside of a housing that surrounds an opening in a media player. The method can also include adhering the transparent wall to the housing the adhesive. | 11-11-2010 |
20100313409 | HYBRID BUTTON - A hybrid button according to the invention is provided. In one embodiment, the button can be implemented in an electronic device such as a media player. The button can include a metal or other non-plastic portion having a reverse flange and a plastic portion including anti-rotation legs. The legs can prevent rotation at least in part because they are retained by another structure. The plastic portion can be injection-molded onto the reverse flange of the metal or non-plastic portion. As such, the reverse flange fixes the position of the plastic portion with respect to the metal portion. Finally, the metal portion can include an actuator nub that actuates a switch when the button is depressed. | 12-16-2010 |
20110001706 | ELECTRONIC DEVICE TOUCH SCREEN DISPLAY MODULE - An electronic device may have a housing in which a touch screen display module is mounted. A cover glass may cover the touch screen display module. The touch screen display module may include display structures and touch sensor structures. A first cable may be connected to the display structures along an edge of the touch screen display module. A second cable may be connected to the touch sensor structures along another edge of the touch screen display module. The cables may be formed from flex circuits that are connected to the display module using heat-and-pressure-bondable conductive adhesive. A printed circuit board in electronic device may have connectors that receive the ends of the first and second flex circuits. The connectors may be located along a common edge of the printed circuit board to facilitate assembly of the touch screen display module within the housing of the electronic device. | 01-06-2011 |
20110012845 | TOUCH SENSOR STRUCTURES FOR DISPLAYS - An electronic device may have a touch screen display. The display may have a touch sensor structure that determines the location at which external objects touch the display. The touch sensor structure may have a clear substrate on which conductive capacitive touch sensor electrodes are formed. The electrodes may be formed from a transparent conductive material such as indium-tin oxide. The clear substrate may be formed from a flexible material such as a polymer. The polymer may be a clear polyimide. Copper traces or other conductive traces may be used to route sensor signals from the capacitive touch sensor electrodes to processing circuitry in the electronic device. | 01-20-2011 |
20110012873 | DISPLAY MODULES - An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion. | 01-20-2011 |
20110043413 | CONNECTORS WITH EMBEDDED ANTENNAS - Connectors for electronic devices are provided with embedded antennas. The connectors may be 30-pin connectors. A 30-pin connector may have a conductive shell structure that defines a cavity and a planar dielectric member that extends into the cavity and that has contact pins. An antenna may be formed from an antenna resonating element on the planar dielectric member and an antenna ground formed from the conductive shell structure. An antenna may be formed from a slot in the conductive shell. The antenna and the pins may be electrically coupled to an electronic device using a cable. | 02-24-2011 |
20110075388 | SOLDER CONTAINMENT BRACKETS - Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste. | 03-31-2011 |
20110100124 | MOUNTED SHOCK SENSOR - This application is directed to a shock sensor mounted in an electronic device. The shock sensor includes both active and passive shock detection methods that allow a technician to determine whether the electronic device was subjected to a shock event that exceeded an impact threshold level. The shock sensor may include shock detection contacts that form an electrical circuit that remains open in the absence of a shock event that exceeds an impact threshold level. In response to a significant shock event, a movable component or substance of the shock sensor may move from a first position to a second position, thereby closing the electrical circuit formed by the shock detection contacts. The change in circuit may be detected and used to provide active indication of whether the electronic device has been subjected to a substantial shock event. In addition, the shock sensor may be observed to passively determine whether the electronic device has been subjected to a substantial shock event. | 05-05-2011 |
20110109516 | Wireless Handheld Electronic Device - A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors. | 05-12-2011 |
20110185562 | FLUSHNESS SHIMS - A media player according to the invention is provided. The media player may include a scroll wheel and a housing including a retention ledge. The retention ledge may maintain the position of the scroll wheel with respect to the housing. A flexible printed circuit may also be included in the media player. The flexible printed circuit may include a first face and a second face. The first face may contact the scroll wheel. The second face may include tactile dome switches. Compressible shims may also form a portion of the media player and may be adjacent the second face. The compressible shims may control the distance between the scroll wheel and the retention ledge. | 08-04-2011 |
20120120562 | UNITARY HOUSING FOR ELECTRONIC DEVICE - An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding. | 05-17-2012 |
20120234791 | Methods and Systems for Forming a Dual Layer Housing - Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate. | 09-20-2012 |
20120255768 | Solder Containment Brackets - Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste. | 10-11-2012 |
20120281344 | MEDIA PLAYER WITH MACHINED WINDOW UNDERCUT AND TRANSPARENT WALL DISPOSED THEREIN - A media player comprising a display screen is provided. The media player can include a housing having an opening and an area of reduced thickness around the opening. The media player can also include a transparent wall having a flange. Alternatively, the transparent wall may not require a flange but rather can be a flat, substantially transparent piece of material such as plexiglass or glass. The flange can be adhered to a surface of the area of reduced thickness in order to form a transparent protective cover for the display screen. | 11-08-2012 |
20130128462 | AMORPHOUS DIAMOND-LIKE CARBON COATINGS FOR INCREASING THE THERMAL CONDUCTIVITY OF STRUCTURAL FRAMES IN PORTABLE ELECTRONIC DEVICES - The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame. | 05-23-2013 |
20130162485 | WIRELESS HANDHELD ELECTRONIC DEVICE - A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors. | 06-27-2013 |
20130201010 | Tactile Feedback in an Electronic Device - An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status; in response to receiving a particular type of communication or in response to receiving a communication from a particular contact; or in response to receiving a particular user input or to detecting a user's finger on a particular portion of the electronic device. | 08-08-2013 |
20130248219 | Laser Cladding Surface Treatments - A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance. | 09-26-2013 |
20130319090 | TESTING OF SURFACE CRYSTALLINE CONTENT IN BULK AMORPHOUS ALLOY - Provided in one embodiment is a method, comprising: forming a part comprising a bulk amorphous alloy, wherein the part comprises a sampling portion; determining a parameter related to the part by detecting by imaging on a surface of the sampling portion presence of crystals of the alloy; and evaluating the part based on the parameter. | 12-05-2013 |
20130333165 | FASTENER MADE OF BULK AMORPHOUS ALLOY - Embodiments relates to a fastener having a head portion and an interlock portion comprising a bulk solidifying amorphous alloy comprising a metal alloy. The fastener could further have a screw portion. Other embodiments relate to methods of making and using the fasteners. | 12-19-2013 |
20140007713 | MECHANICAL TESTING OF TEST PLAQUE FORMED ON AN ALLOY PART AND MECHANICAL PROOF TESTING - Disclosed are quality control methods used in fabrication processes to make bulk-solidifying amorphous alloy parts. The quality control methods include forming a test plaque together with bulk-solidifying amorphous alloy part where the test plaque is formed on the alloy part at a location having a predetermined likelihood of failure, and testing the plaque to determine the quality of the product. | 01-09-2014 |
20140007984 | CAST CORE INSERT OUT OF ETCHABLE MATERIAL - Provided in an embodiment is a method for molding, including: providing a molten alloy in a space between a mold cavity and an etchable block shaped to form an undercut on a part formed in the space, cooling the molten alloy to form the part with the undercut, and etching the etchable block. An undercut is a beveled edge caused by an etchant attacking an etchable block laterally and optionally vertically. The formed part can be made of a bulk amorphous alloy. In some cases, the etchable block can also be used to form at least one threaded portion in the part. | 01-09-2014 |
20140008999 | BULK AMORPHOUS ALLOY PRESSURE SENSOR - Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied. | 01-09-2014 |
20140009215 | TOUCH INTERFACE USING PATTERNED BULK AMORPHOUS ALLOY - Touch sensing systems comprising bulk-solidifying amorphous alloys and methods of making touch sensing arrays and electronic devices containing touch sensitive screens that include arrays containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloy substrates have select areas of crystalline and amorphous alloy providing for discrete areas of conductivity and resistivity. | 01-09-2014 |
20140011050 | BMG PARTS HAVING GREATER THAN CRITICAL CASTING THICKNESS AND METHOD FOR MAKING THE SAME - The embodiments described herein relate to BMG articles with high bulk having all dimensions greater than the critical dimension. Exemplary BMG article can include at least one bulk component and/or one or more fixation elements configured on surface of the bulk component or inserted into the bulk component. Other embodiments relate to methods of making the BMG articles by thermo-plastic-formation of BMG alloy materials. | 01-09-2014 |
20140043751 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-13-2014 |
20140071601 | INSERT MOLDED DEVICE HOUSINGS FOR PORTABLE ELECTRONIC DEVICES - Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices. | 03-13-2014 |
20140217864 | CLADDED METAL STRUCTURES - A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance. | 08-07-2014 |
20140218850 | UNITARY HOUSING FOR ELECTRONIC DEVICE - An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding. | 08-07-2014 |
20140297202 | NONDESTRUCTIVE METHOD TO DETERMINE CRYSTALLINITY IN AMORPHOUS ALLOY - One embodiment provides a method of determining an unknown degree of crystallinity, the method comprising: constructing a master curve plot comprising a plurality of reference curves, each reference curve representing a relationship between electrical resistivity and temperature for one of a plurality of reference alloy samples having a chemical composition and various pre-determined degrees of crystallinity; for an alloy specimen having the chemical composition and the unknown degree of crystallinity, obtaining a curve representing the electrical resistivity and temperature thereof; and determining the unknown degree of crystallinity by comparing the curve to the master curve plot. | 10-02-2014 |
20140348571 | JOINING BULK METALLIC GLASS SHEETS USING PRESSURIZED FLUID FORMING - Provided in one embodiment is a method of joining one or more articles together using pressurized fluid to deform a bulk-solidifying amorphous alloy material and form a mechanical interlock between the respective surfaces joined together. | 11-27-2014 |