Patent application number | Description | Published |
20130292126 | Methods Of Using Enhanced Wellbore Electrical Cables - An embodiment of a method of deploying a cable into a wellbore penetrating a subterranean formation comprises providing a cable, wherein the cable comprises at least one insulated conductor, at least one armor wire layer surrounding the insulated conductor, a polymeric material disposed in interstitial spaces formed between armor wires forming the at least one armor wire layer, and interstitial spaces formed between the at least one armor wire layer and insulated conductor, the polymeric material forming a continuously bonded layer which separates and encapsulates the armor wires forming the at least one armor wire layer, and whereby the polymeric material is extended to form a smooth polymeric jacket around the at least one armor wire layer, introducing the cable into a wellbore and performing at least one operation in the wellbore utilizing the cable. | 11-07-2013 |
20140352952 | Methods of Using Enhanced Wellbore Electrical Cables - A method of deploying a cable into a wellbore penetrating a subterranean formation that includes providing a cable. The cable includes an insulated conductor; an armor wire layer surrounding the insulated conductor; and a polymeric material disposed in interstitial spaces formed between armor wires forming the armor wire layer, and in interstitial spaces formed between the at least one armor wire layer and the at least one insulated conductor. The method also includes introducing the cable into a wellbore and performing at least one operation in the wellbore utilizing the cable. | 12-04-2014 |
20150075796 | WELLSITE HANDLING SYSTEM FOR PACKAGED WELLSITE MATERIALS AND METHOD OF USING SAME - Systems and methods for handling wellsite packets for a wellsite are provided. The wellsite packets include soluble packaging with wellsite materials therein. The wellsite has surface equipment and downhole equipment positioned about a wellbore. The handling system includes at least one feeder, at least one mixer, at least one metering device, and a pump. The feeder moves the wellsite packets directly or indirectly into the mixer. The mixer stimulates dissolution of the soluble packaging so as to mix the wellsite materials with a fluid to form a wellsite mixture. The metering device selectively controls the number of wellsite packets moving to the mixer. The pump is operatively coupled to the mixer to pump the wellsite mixture at the wellsite. | 03-19-2015 |
Patent application number | Description | Published |
20080289849 | Enhanced Electrical Cables - Electrical cables formed from at least one insulated conductor, a layer of inner armor wires disposed adjacent the insulated conductor, and a layer of shaped strength members disposed adjacent the outer periphery of the first layer of armor wires. A polymeric material is disposed in interstitial spaces formed between the inner armor wires and the layer of shaped strength members, and the polymeric material is further disposed in interstitial spaces formed between the inner armor wire layer and insulated conductor. The polymeric material serves as a continuously bonded layer which also separates and encapsulates the armor wires forming the inner armor wire layer wire layer. | 11-27-2008 |
20090081034 | Oilfield Equipment Composed of a Base Material Reinforced With a Composite Material - Oilfield equipment is provided that includes a base material less subject to abrasion, corrosion, erosion and/or wet fatigue than conventional oilfield equipment materials such as carbon steel, and a reinforcing composite material for adding stress resistance and reduced weight to the oilfield equipment. | 03-26-2009 |
20090145610 | Methods of Using Enhanced Wellbore Electrical Cables - An embodiment of a method of deploying a cable into a wellbore penetrating a subterranean formation comprises providing a cable, wherein the cable comprises at least one insulated conductor, at least one armor wire layer surrounding the insulated conductor, a polymeric material disposed in interstitial spaces formed between armor wires forming the at least one armor wire layer, and interstitial spaces formed between the at least one armor wire layer and insulated conductor, the polymeric material forming a continuously bonded layer which separates and encapsulates the armor wires forming the at least one armor wire layer, and whereby the polymeric material is extended to form a smooth polymeric jacket around the at least one armor wire layer, introducing the cable into a wellbore and performing at least one operation in the wellbore utilizing the cable. | 06-11-2009 |
20100012348 | Enhanced Wellbore Electrical Cables - Wellbore electrical cables according to the invention include at least one insulated conductor, at least one layer of armor wires surrounding the insulated conductor, and a polymeric material disposed in the interstitial spaces formed between armor wires and interstitial spaces formed between the armor wire layer and insulated conductor which may further include wear resistance particles or even short fibers, and the polymeric material may further form a polymeric jacket around an outer, layer of armor wires. The insulated conductor is formed from a plurality of metallic conductors encased in an insulated jacket. The invention also discloses a method of preparing a cable by extruding first layer of polymeric material upon at least one insulated conductor; serving a first layer of armor wires upon the polymeric material; softening the polymeric material to partially embed armor wires; extruding a second layer of polymeric material over the armor wires; serving a second layer outer armor wires thereupon; softening the polymeric material to partially embed the second armor wire layer; and optionally extruding a third layer of polymeric material over the outer armor wires embedded in the second layer of polymeric material. Further disclosed are methods of using the cables of the invention in seismic and wellbore operations, including logging operations. | 01-21-2010 |
20100074583 | Packaging for Encasing an Optical Fiber in a Cable - A cable component is provided that includes at least one optical fiber; and a plurality of shaped profiles having inner and outer surfaces such that the inner surfaces combine to from an enclosure for the at least one optical fiber. | 03-25-2010 |
Patent application number | Description | Published |
20120126247 | SELF-POWERED INTEGRATED CIRCUIT WITH MULTI-JUNCTION PHOTOVOLTAIC CELL - A photovoltaic cell is provided as a composite unit together with elements of an integrated circuit on a common substrate. In a described embodiment, connections are established between a multiple photovoltaic cell portion and a circuitry portion of an integrated structure to enable self-powering of the circuitry portion by the multiple photovoltaic cell portion. | 05-24-2012 |
20120126298 | SELF-POWERED INTEGRATED CIRCUIT WITH PHOTOVOLTAIC CELL - A photovoltaic cell is provided as a composite unit together with elements of an integrated circuit on a common substrate. In a described embodiment, connections are established between a photovoltaic cell portion and a circuitry portion of an integrated structure to enable self-powering of the circuitry portion by the photovoltaic cell portion. | 05-24-2012 |
20120126624 | HIGH EFFICIENCY WIDE LOAD RANGE BUCK/BOOST/BRIDGE PHOTOVOLTAIC MICRO-CONVERTER - Series strings of photovoltaic (PV) modules with integrated dc-dc microconverters that can function in buck, boost, or an intermediate bridge mode based on the load can harvest more energy than conventional central-inverter architectures, especially when the arrays are partially shaded or when the modules are mismatched. The integrated multi-mode dc-dc converter includes a maximum power point tracking (MPPT) algorithm that can track the true MPP, even when a PV module becomes partially-shaded, without scanning the entire output voltage range. The algorithm compares power levels only at a voltage that occurs when a bypass diode bypasses a portion of an associated PV module, and multiples thereof. | 05-24-2012 |
20130295711 | SELF-POWERED INTEGRATED CIRCUIT WITH MULTI-JUNCTION PHOTOVOLTAIC CELL - A photovoltaic cell is provided as a composite unit together with elements of an integrated circuit on a common substrate. In a described embodiment, connections are established between a multiple photovoltaic cell portion and a circuitry portion of an integrated structure to enable self-powering of the circuitry portion by the multiple photovoltaic cell portion. | 11-07-2013 |
Patent application number | Description | Published |
20090142480 | Optimal Acoustic Impedance Materials for Polished Substrate Coating to Suppress Passband Ripple in BAW Resonators and Filters - Methods of reducing phase and amplitude ripples in a BAW resonator frequency response by providing a substrate, fabricating a Bragg mirror having alternate layers of a high acoustic material and a low acoustic material on a first surface of the substrate, fabricating a BAW on the Bragg mirror, and coating a second side of the substrate opposite the first side with a lossy material having an acoustic impedance in the range of 0.01x to 1.0x the acoustic impedance of the layers of high impedance material, the second surface of the substrate being a polished surface. Various embodiments are disclosed. | 06-04-2009 |
20090289722 | Bonded Wafer Package Module - Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices, the bonded wafers being diced to form individual sealed devices. The devices may be duplexers, interstage filters or other circuits such as VCOs and RF circuits. Various embodiments are disclosed. | 11-26-2009 |
20120193808 | BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS - A wafer structure includes a first wafer stack and a first bonding layer disposed on the first wafer stack. The wafer structure further includes a second wafer stack that includes a first surface and a second surface opposing the first surface. A second bonding layer is disposed on the second surface and is in contact with the first bonding layer. The second wafer stack comprises through-silicon-vias (TSVs) that extend from the first surface to the second bonding layer. A seed layer is disposed on the first surface and is in contact with the TSVs. | 08-02-2012 |
20120194306 | PREVENTING CONTACT STICTION IN MICRO RELAYS - A micro relay of a micro-electro-mechanical system (MEMS), includes a cap substrate, a first electrical contact, an actuator, and a second electrical contact. The first electrical contact is formed on the cap substrate, includes a platinum group metal, and includes a first surface layer of an oxide of the platinum group metal. The second electrical contact is formed on the actuator, includes the platinum group metal, and includes a second surface layer of the oxide of the platinum group metal. At least a first portion of the first surface layer contacts at least a second portion of the second surface layer during cycling of the micro relay. | 08-02-2012 |
20150132891 | BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS - A method including: providing a first wafer stack; applying a first bonding layer on the first wafer stack; providing a second wafer stack, where the second wafer stack includes vias; and applying a second bonding layer to the second wafer stack. The vias extend through the second wafer stack and to the second bonding layer. The second bonding layer is bonded to the first bonding layer. A seed layer is applied on a side of the second wafer stack opposite the second bonding layer such that a material of the seed layer (i) contacts the vias, and (ii) extends over and past ends of the second wafer stack and onto the first bonding layer. | 05-14-2015 |