Patent application number | Description | Published |
20090152121 | THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same. | 06-18-2009 |
20090314419 | PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF - A printed circuit board material for embedded passive devices, which has excellent electromagnetic properties and reliability is provided. The invention provides a printed circuit board material comprises: a conductive copper foil layer; a resin bonding layer formed on the conductive layer and including above 70-100 vol % of resin and 0-30 vol % of filler; and a functional layer formed on the resin bonding layer and including resin and filler. The printed circuit board material has the resin bonding layer interposed between the copper foil layer and the functional layer. Thus, even when the content of fillers in the functional layer is increased, the adhesion strength between the conductive layer and the functional layer is ensured without deteriorating the properties of the functional layer, such as dielectric and magnetic properties. | 12-24-2009 |
20110034606 | COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME - Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature. | 02-10-2011 |
20130098668 | CONDUCTIVE SUBTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a conductive substrate, the method including: a first electrode applying operation of applying first electrodes on a substrate; a first electrode forming operation of forming the first electrodes of fine lines by partly removing the first electrodes; and a second electrode forming operation of forming second electrodes on the substrate from which the first electrodes are removed, thereby enhancing reliability in a whole product including the conductive substrate. | 04-25-2013 |
Patent application number | Description | Published |
20090128988 | DIELECTRIC CERAMIC COMPOSITION FOR LOW-TEMPERATURE SINTERING AND HOT INSULATION RESISTANCE AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic composition for low-temperature sintering and hot insulation resistance (hot IR) is capable of carrying out low-temperature sintering, improving a hot IR characteristic, and meeting X5R characteristics, and a multilayer ceramic capacitor makes use of the dielectric ceramic composition. The dielectric ceramic composition includes a main component BaTiO | 05-21-2009 |
20090258231 | GLASS COMPOSITION FOR LOW TEMPERATURE SINTERING, GLASS FRIT, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - The invention relates to a glass composition and a glass frit adequate for low temperature sintering agent at 1,100° C. or less, and a dielectric composition and a multilayer ceramic capacitor using the same. The glass composition comprises aLi | 10-15-2009 |
20100069222 | GLASS COMPOSITION FOR LOW TEMPERATURE SINTERING, GLASS FRIT, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - The invention relates to a glass composition and a glass frit adequate for low temperature sintering agent at 1,100° C. or less, and a dielectric composition and a multilayer ceramic capacitor using the same. The glass composition comprises aLi | 03-18-2010 |
20100165542 | BOROSILICATE GLASS COMPOSITIONS FOR SINTERING AGENT, DIELECTRIC COMPOSITIONS AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - The present invention relates to borosilicate glass compositions for a sintering agent, dielectric compositions containing the borosilicate glass compositions and a multilayer ceramic capacitor using the dielectric compositions. Borosilicate glass compositions for a sintering agent according to an aspect of the invention include an alkali oxide, an alkaline earth oxide and a rare earth oxide, can sinter ceramic dielectrics at low temperatures and improve the hot insulation resistance of a multilayer ceramic capacitor. Correspondingly, dielectric compositions including these borosilicate glass compositions and a multilayer ceramic capacitor using the dielectric compositions can be sintered at a low temperature of 1100° C. or less and have high hot insulation resistance, thereby ensuring high levels of reliability. | 07-01-2010 |
Patent application number | Description | Published |
20110042699 | Substrate for light emitting diode package and light emitting diode package having the same - A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented. | 02-24-2011 |
20140001611 | SEMICONDUCTOR PACKAGE | 01-02-2014 |
20140117522 | SEMICONDUCTOR PACKAGE - There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate. | 05-01-2014 |
20140117524 | POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF - There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity. | 05-01-2014 |
20140146487 | CONTACT PIN AND POWER MODULE PACKAGE HAVING THE SAME - Disclosed herein is a contact pin including: a deformation part elastically deformed; connection parts coupled to both ends of the deformation part; and contact parts coupled to the connection parts coupled to both ends of the deformation part, respectively, and having one end coupled to the connection part and the other end. | 05-29-2014 |
20140160691 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor module capable of being easily manufactured. The semiconductor module includes: a control part including at least one control device; and a power part including at least one power device, wherein any one of the control part and the power part includes contact pins having elasticity, and the control part and the power part are electrically connected to each other by the contact pins. | 06-12-2014 |