Shuji Tanaka
Shuji Tanaka, Sendai-Shi JP
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20110083517 | SENSOR SYSTEM - A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device. | 04-14-2011 |
20120199921 | SENSOR DEVICE AND METHOD FOR PRODUCING SENSOR DEVICE - Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate. | 08-09-2012 |
20120247226 | SHEET-LIKE TACTILE SENSOR SYSTEM - Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion. | 10-04-2012 |
20120254490 | TOUCH SENSOR SYSTEM - A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements. | 10-04-2012 |
20140137670 | DYNAMIC QUANTITY SENSOR AND DYNAMIC QUANTITY SENSOR SYSTEM - A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives. | 05-22-2014 |
20150333046 | INTEGRATED DEVICE - An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole. | 11-19-2015 |
Shuji Tanaka, Chigasaki-Shi JP
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20080226333 | USED TONER COLLECTION DEVICE AND IMAGE FORMING APPARATUS - A used toner conveyance device includes a lateral conveyance member for conveying used toner substantially in the horizontal direction, and a vertical conveyance member for upwardly conveying the used toner transferred from the lateral conveyance member. The vertical conveyance member transfers the used toner to either a collection space or a next conveyance path. The vertical conveyance member stops its operation when a prescribed delay time has elapsed after the lateral conveyance member stops conveyance operation. | 09-18-2008 |
20090180801 | ELECTROPHOTOGRAPHIC PHOTORECEPTOR, PHOTORECEPTOR SUPPORTING DEVICE, IMAGING DEVICE AND PROCESS CARTRIDGE - An electrophotographic photoreceptor includes, a cylindrical photoreceptor pipe; at least one flange which is attached to an opening of one end of the photoreceptor pipe, and which is provided with a shaft part projecting outward from the one end at a shaft center position of the photoreceptor pipe; and an earth member which is arranged to penetrate through the shaft part of the at least one flange, and which is provided on its inward side with at least one first contact part which contacts an inner circumference of the photoreceptor pipe, and on its outward side with a second contact part. | 07-16-2009 |
20100278558 | ELECTROPHOTOGRAPHIC IMAGE FORMING METHOD AND APPARATUS - The image forming apparatus includes a latent image bearing member; a charging device charging the surface of the latent image bearing member; a latent image forming device forming an electrostatic latent image on the surface of the latent image bearing member; a developing device supplying toner to the electrostatic latent image to form a toner image; a cover film supplying device supplying a cover film to the surface of the latent image bearing member at a cover film supplying position located on an upstream side from the development position so that the toner image is formed on the cover film covering the surface of the latent image bearing member; and a cover film separating device separating the cover film bearing the toner image thereon from the surface of the image bearing member before the cover film bearing the toner image thereon reaches the cover film supplying position. | 11-04-2010 |
Shuji Tanaka, Kosai-Shi JP
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20100151270 | Process of forming ultrafine crystal layer, machine component having ultrafine crystal layer formed by the ultrafine crystal layer forming process, process of producing the machine component, process of forming nanocrystal layer, machine component having nanocrystal layer formed by the nanocrystal layer forming process, and process of producing the machine component - A process of forming an ultrafine crystal layer in a workpiece constituted by a metallic material. The process includes: performing a machining operation on a surface of the workpiece, so as to impart a large local strain to the machined surface of the workpiece, where the machining operation causes the machined surface of the workpiece to be subjected to a plastic working that causes to have large local strain in the form of a true strain of at least one, such that the ultrafine crystal layer is formed in a surface layer portion of the workpiece that defines the machined surface of the workpiece. Also disclosed are a nanocrystal layer forming process, a machine component having the ultrafine crystal layer or the nanocrystal layer, and a machine component producing process of producing the machine component. | 06-17-2010 |
Shuji Tanaka, Kanagawa JP
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20080260426 | Unit, Image Forming Apparatus, and Method of Manufacturing Unit Frame - To provide a unit that can increase positioning precision of a blade member to a rotating member, an image forming apparatus, and a method of manufacturing a unit frame. A first reference surface of a boss provided on a surface of a frame to which a blade is contacted is formed by a first mold that forms a positioning hole for positioning a rotating member The first reference surface supports the blade member to prevent the blade member from moving to a weight direction. With this arrangement, there is no manufacturing error of the first reference surface due to a mold assembling error. As a result, precision of positioning the blade member to the rotating member can be increased. | 10-23-2008 |
20090180794 | CHARGING DEVICE, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS - A charging device includes a charging roller and a cleaning roller configured to make contact with the charging roller. The cleaning roller is rotated following the charging roller. A dynamic friction coefficient of a surface of the charging roller measured by an oiler belt method is equal to or larger than 0.5. | 07-16-2009 |
20110229232 | LUBRICANT APPLYING DEVICE, IMAGE FORMING APPARATUS, PROCESS UNIT, AND SOLID LUBRICANT - A lubricant applying device includes: a solid lubricant; an applying member that applies lubricant powder scraped off from the solid lubricant to an application target; a holding member that holds the solid lubricant; a biasing unit that biases the holding member to bring the solid lubricant on the holding member into contact with the applying member; and a regulating unit that regulates, when a force of a direction orthogonal to an endless movement direction of the applying member is applied from the applying member to the solid lubricant at a frictional surface therebetween, movement of the solid lubricant and the holding member in the orthogonal direction. | 09-22-2011 |
Shuji Tanaka, Gunma JP
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20090152627 | SEMICONDUCTOR DEVICE - This invention is directed to offer a MOS transistor that has a high source-drain breakdown BVds, a low on resistance and a high electric current driving capacity. On resistance is lowered by forming an N well layer for lowering on resistance in the drift region. The N well layer is disposed beneath the gate electrode and away from the N well layer with a certain space between them. This space ensures the withstand voltage at the edge of the gate electrode of the drain layer side. Also, the N well layer is formed on the surface of an epitaxial layer in the region that includes a P+L layer. The edge of the N well layer of the drain layer side is located near the edge of the P+L layer of the drain layer side and away from the N well layer. This space makes the expansion of depletion layer from the P+L layer easier, further improving the withstand voltage. | 06-18-2009 |
20090152628 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - It is desirable to reduce chip area, lower on resistance and improve electric current driving capacity of a DMOS transistor in a semiconductor device with a DMOS transistor. On the surface of an N type epitaxial layer, a P+W layer of the opposite conductivity type (P type) is disposed and a DMOS transistor is formed in the P+W layer. The epitaxial layer and a drain region are insulated by the P+W layer. Therefore, it is possible to form both the DMOS transistor and other device element in a single confined region surrounded by an isolation layer. An N type FN layer is disposed on the surface region of the P+W layer beneath the gate electrode. An N+D layer, which is adjacent to the edge of the gate electrode of the drain layer side, is also formed. P type impurity layers (a P+D layer and a FP layer), which are located below the drain layer, are disposed beneath the contact region of the drain layer. | 06-18-2009 |
Shuji Tanaka, Chigasaki City JP
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20090097879 | WASTE TONER STORAGE UNIT AND IMAGE FORMING APPARATUS USING SAME - A waste toner storage unit detachably mountable to an image forming apparatus includes a waste toner container and an inner cover integrally attached to the waste toner container. The waste toner container stores waste toner recovered after an image forming process. The inner cover is located at a region of the waste toner storage unit that does not store waste toner. | 04-16-2009 |
Shuji Tanaka, Miyagi JP
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20090035706 | Method for Fabricating Micromachine Component of Resin - A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge potion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer. | 02-05-2009 |
20120217638 | WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE - By forming a metal layer | 08-30-2012 |
Shuji Tanaka, Shizuoka JP
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20080286597 | Process of Forming Ultrafine Crystal Layer, Machine Component Having Ultrafine Crystal Layer Formed by the Ultrafine Crystal Layer Forming Process, Process of Producing the Machine Component, Process of Forming Nanocrystal Layer, Machine Component Having Nanocrystal Layer Formed by the Nanocrystal Layer Forming Process, and Process of Producing the Machine Component - An ultrafine crystal layer forming process of forming an ultrafine crystal layer in a workpiece constituted by a metallic material. The process includes: performing a machining operation on a surface of the workpiece using a machining tool, so as to impart a large local strain to the machined surface of the workpiece, where the machining operation using the machining tool causes the machined surface of the workpiece to be subjected to a plastic working that causes to have large local strain in the form of a true strain of at least 1, such that the ultrafine crystal layer is formed in a surface layer portion of the workpiece that defines the machined surface of the workpiece. Also disclosed are a nanocrystal layer forming process, a machine component having the ultrafine crystal layer or the nanocrystal layer, and a machine component producing process of producing the machine component. | 11-20-2008 |
Shuji Tanaka, Ube-Shi JP
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20120296063 | PROCESS FOR PREPARING DIARYL OXALATE - Disclosed is a process for preparing a diaryl oxalate which comprises the step of transesterifying a dialkyl oxalate or/and an alkylaryl oxalate with an aryl alcohol in the presence of a tetra(aryloxy)titanium as a catalyst, wherein the tetra(aryloxy)titanium is fed into a reaction system of the transesterification as an aryl alcohol solution of the tetra(aryloxy)titanium which is prepared by reacting a tetraalkoxy titanium and an excess amount of the aryl alcohol and removing a by-producing alkyl alcohol. | 11-22-2012 |
Shuji Tanaka, Niigata JP
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20130001063 | METHOD FOR PRODUCING TRICHLOROSILANE - A mixture containing methyldichlorosilane, tetrachlorosilane, and trichlorosilane is distilled to fractionate a fraction with a higher content of methyldichlorosilane than the mixture before distillation. Subsequently, the fraction thus fractionated is heated to disproportionate chlorine between methyldichlorosilane and tetrachlorosilane to disproportionate methyldichlorosilane into methyltrichlorosilane. Subsequently, the fraction after disproportionation containing methyltrichlorosilane is purified by distillation to separate high-purity trichlorosilane. Having a close boiling point to that of trichlorosilane (32° C.), which is a target product to be purified by distillation, removal of methyldichlorosilane (boiling point of 41° C.) has been difficult. The present invention removes methyldichlorosilane more easily by converting it into methyltrichlorosilane (boiling point of 66° C.) through disproportionation of chlorine between methyldichlorosilane and tetrachlorosilane. | 01-03-2013 |
20130177492 | METHOD FOR PURIFYING CHLOROSILANES - The method comprises at least three steps of a hydrogenation step ( | 07-11-2013 |
Shuji Tanaka US
Patent application number | Description | Published |
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20150333046 | INTEGRATED DEVICE - An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole. | 11-19-2015 |