Patent application number | Description | Published |
20120250994 | IMAGE PROCESSING DEVICE, AND IMAGE PROCESSING METHOD AND PROGRAM - Disclosed is an image processing device which is provided with a determination section which determines texture direction in a vicinity region based on the vicinity region which includes a target pixel in the image and a detection section which detects whether or not the target pixel is a defective pixel based on a plurality of pixels including the target pixel which are lined up in the texture direction in the image. | 10-04-2012 |
20130033616 | IMAGING DEVICE, IMAGE PROCESSING METHOD AND PROGRAM - Provided is an imaging device including an image sensor for outputting a high-sensitivity pixel signal from a long-time exposure pixel and a low-sensitivity pixel signal from a short-time exposure pixel; and a blooming correction processing unit for receiving the output pixel signal from the image sensor and executing blooming correction for the pixel signal. The blooming correction processing unit executes pixel value correction of the input pixel from the image sensor according to a difference between or a ratio of an input pixel value from the image sensor and an ideal pixel value not affected by blooming. | 02-07-2013 |
20130051665 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - Provided is an image processing apparatus including an image signal correction section that performs an image correction process. The image signal correction section performs a direction determination process of detecting a direction having a minimum pixel value gradient as a pixel value gradient direction in a pixel area including a target pixel; a defect detection process of calculating a Laplacian based on a pixel value of a reference pixel in a minimum gradient direction detected in the direction determination process with respect to the target pixel, and determining presence or absence of a defect of the target pixel; and a defect correction process of performing calculation of a corrected pixel value, which is obtained by applying the pixel value of the reference pixel in the direction detected in the direction determination process, with respect to a target pixel from which a defect has been detected in the defect detection process. | 02-28-2013 |
20150049223 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - Provided is an image processing apparatus including an image signal correction section that performs an image correction process. The image signal correction section performs a direction determination process of detecting a direction having a minimum pixel value gradient as a pixel value gradient direction in a pixel area including a target pixel; a defect detection process of calculating a Laplacian based on a pixel value of a reference pixel in a minimum gradient direction detected in the direction determination process with respect to the target pixel, and determining presence or absence of a defect of the target pixel; and a defect correction process of performing calculation of a corrected pixel value, which is obtained by applying the pixel value of the reference pixel in the direction detected in the direction determination process, with respect to a target pixel from which a defect has been detected in the defect detection process. | 02-19-2015 |
20150288935 | IMAGING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - A defective pixel of an imaging device is detected. An output pixel value of the defective pixel is corrected to generate an output image. An imaging device, and a signal processing unit for analyzing an output signal from the imaging device and detecting a defective pixel are included. The imaging device receives incident light via, for example, a microlens placed in front of a pixel, inputs the same subject light on a local area basis including a plurality of pixels of the imaging device, and acquires an image signal lower than a pixel resolving power corresponding to the pixel density of the imaging device. The signal processing unit compares the pixel values of the same color pixels included in a local area on a local area basis including a cluster of the plurality of pixels of the imaging device, detects the defective pixel based on the comparison result, and corrects and outputs a pixel value of a pixel determined to be a defective pixel. | 10-08-2015 |
20150348301 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - An in-image capturing unit captures an image of a subject in a direction facing a front surface of an image processing apparatus, as an in-image, and an out-image capturing unit captures an image of a subject in a direction facing a back surface of the image processing apparatus, as an out-image. A signal processing unit obtains a binary image as additional information, the binary image being obtained by binarizing the in-image, for example, and adds the additional information to image data of the out-image. Additionally, the signal processing unit combines the binary image serving as the additional information with the out-image when the out-image is reproduced, and displays the resultant image. In such a manner, information obtained from the in-image is added to the out-image as additional information, and thus it is possible to more effectively display an image and improve convenience. | 12-03-2015 |
20150365593 | IMAGE PROCESSING DEVICE, PHOTOGRAPHING CONTROL METHOD, AND PROGRAM - An information processing system that acquires first image data captured by a first camera unit disposed on a first side of a housing; acquires second image data captured by a second camera unit disposed on a second side of the housing, which is opposite to the first side of the housing; and modifies the second image data based on the first image data. | 12-17-2015 |
Patent application number | Description | Published |
20090305612 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 12-10-2009 |
20100311309 | DRESSING APPARATUS, DRESSING METHOD, AND POLISHING APPARATUS - A dressing apparatus for use in a polishing apparatus for polishing a substrate to planarize a surface of the substrate is disclosed. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to press the dresser disk against the polishing pad through the dresser drive shaft, a pressure-measuring device configured to measure pressure of the gas supplied to the pneumatic cylinder, a load-measuring device configured to measure a load acting on the dresser drive shaft, and a pressure controller configured to control the pressure of the gas supplied to the pneumatic cylinder. The pressure controller is configured to establish a relationship between the pressure of the gas and a pressing force of the dresser disk against the polishing pad, based on measurement values of the pressure-measuring device and the load-measuring device. | 12-09-2010 |
20120309267 | METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS - The present invention provides a method capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface. | 12-06-2012 |
20140041687 | DRESSER DISK CLEANING BRUSH, CLEANING APPARATUS, AND CLEANING METHOD - The present invention provides a cleaning brush and a cleaning apparatus that can effectively discharge dust, removed from a dresser disk of a CMP apparatus upon cleaning the dresser disk, to the outside of the cleaning system in order to prevent the dust from being again deposited on the dresser disk. A cleaning brush includes a large number of brushes formed to protrude on its top surface, vertical through-holes and into which a nozzle for ejecting a cleaning fluid is inserted, and a recessed groove formed on a lower surface that lower ends of the through-holes and face. It is configured such that dust deposited onto the brushes upon cleaning the dresser disk is discharged to outside from the recessed groove through a gap between the surrounding of the nozzle and the inner surface of the through-holes and together with the cleaning fluid. | 02-13-2014 |
20140065931 | METHOD OF MONITORING A DRESSING PROCESS AND POLISHING APPARATUS - A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient. | 03-06-2014 |
20140083468 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus has a cleaning section for cleaning a substrate such as a semiconductor wafer and can be used as a polishing apparatus. The substrate processing apparatus includes a first cleaning chamber which houses at least one first cleaning module and two second cleaning modules arranged in a vertical array, a second cleaning chamber which houses two third cleaning modules arranged in a vertical array, and a first transport robot housed in a first transport chamber disposed between the first cleaning chamber and the second cleaning chamber. The first transport robot is configured to transfer substrates between the first cleaning module, the second cleaning modules, and the third cleaning modules. | 03-27-2014 |
20140094098 | POLISHING APPARATUS - To provide a polishing apparatus capable of more accurately determining a polishing end point. The polishing apparatus includes a turntable | 04-03-2014 |
20140120725 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring. | 05-01-2014 |
20140134924 | SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS - A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount. | 05-15-2014 |
20140179204 | DRESSER - A dresser includes an attachment secured to a dresser shaft for rotating the dresser, a disk holder removably attached to the attachment by a magnetic force, and a dresser disk removably attached to the disk holder. The dresser disk has a dressing surface. Each of the attachment and the disk holder has magnet for generating the magnetic force. | 06-26-2014 |
20140302676 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 10-09-2014 |
20140358280 | ROBOT ARM CONTROL APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING APPARATUS, ROBOT ARM CONTROL METHOD, AND PROGRAM - A robot arm control apparatus for controlling the operation of a robot arm device having at least two arm portions and at least two rotational joints configured to rotate the arm portions includes a control unit configured to control rotation of the joints to move generally rectilinearly the distal end of a predetermined arm portion of the arm portions except the most proximal arm portion thereof. The control unit controls the rotation of the joints so that the motion acceleration of the distal end of the predetermined arm portion when the distal end is moved generally rectilinearly results in coincidence with a predetermined temporal transition. The motion acceleration with the predetermined temporal transition is such that, when the motion acceleration is expressed as a function of time, a derivative obtained by differentiating the function with respect to the time shows a continuous transition with respect to changes in the time. | 12-04-2014 |
20140373884 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus configured to rotate a substrate, such as a wafer, is disclosed. The substrate processing apparatus includes: a substrate holder configured to hold and rotate a substrate; a natural frequency calculator configured to determine a natural frequency of the substrate; and a processing controller configured to control a rotational speed of the substrate based on the natural frequency of the substrate. The processing controller is configured to control the rotational speed of the substrate such that the substrate is rotated at a rotational speed that is different from a rotational speed corresponding to the natural frequency of the substrate. | 12-25-2014 |
20150042028 | WET TREATMENT APPARATUS AND SUBSTRATE TREATMENT APPARATUS PROVIDED WITH THE SAME - The present invention provides a wet treatment apparatus having divided base frames and waterproofing pans, which has an enhanced waterproofing property and can be easily assembled. A wet treatment apparatus | 02-12-2015 |
20150050863 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 02-19-2015 |
20150065019 | DRESSING DEVICE, CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME, AND DRESSER DISC USED IN THE SAME - A dressing device capable of remedying wobbly rotation of a dresser disc, a CMP apparatus, and a dresser disc. The dressing device is capable of dressing a polishing pad and includes a holder which can be coupled to a dresser driving shaft capable of rotating and moving upward and downward, a dresser disc which can be mounted to the holder and has a dressing surface to be rubbed against a polishing pad, a set of concave and convex torque transmitting sections extending in a disc radial direction which are formed at the holder and the dresser disc and fit together when the dresser disc is mounted to the holder, and a set of contact surfaces in the shapes of flat surfaces which are formed as one surfaces around the set of torque transmitting sections and come into surface-to-surface contact at the time of transmitting torque of the dresser driving shaft. | 03-05-2015 |
20150082613 | LIFTING DEVICE, SUBSTRATE PROCESSING APPARATUS HAVING LIFTING DEVICE, AND UNIT TRANSFERRING METHOD - [Problem] An object of the present invention is to facilitate height level adjustment of a substrate processing apparatus regardless of size thereof. | 03-26-2015 |
20150090351 | Exhaust flow rate control apparatus and substrate processing apparatus provided therewith - The present invention is intended to set the temperature of a predetermined location inside a processing space in which a polishing pad and the like are disposed to within a predetermined temperature range, for example, a temperature range in which a polishing rate is maximum. A substrate processing apparatus | 04-02-2015 |
20150151401 | POLISHING APPARATUS - A polishing apparatus capable of stably controlling a pressure in a pressure chamber of a top ring is disclosed. The polishing apparatus includes: a rotatable polishing table for supporting a polishing pad; a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad; a pressure regulator configured to regulate a pressure of a gas in the pressure chamber; and a buffer tank provided between the pressure chamber and the pressure regulator. The pressure regulator includes a pressure-regulating valve, a pressure gauge configured to measure the pressure of the gas at a downstream side of the pressure-regulating valve, and a valve controller configured to control an operation of the pressure-regulating valve so as to minimize a difference between a target value of the pressure in the pressure chamber and a pressure value measured by the pressure gauge. | 06-04-2015 |
20150258654 | FILM THICKNESS MEASURING DEVICE AND POLISHING DEVICE - The present invention improves versatility of a film thickness measuring device. The trigger sensor | 09-17-2015 |
20150314416 | METHOD AND APPARATUS FOR MONITORING A POLISHING SURFACE OF A POLISHING PAD USED IN POLISHING APPARATUS - A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface. | 11-05-2015 |
20150314418 | SUBSTRATE POLISHING APPARATUS - A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36. | 11-05-2015 |
20150343593 | POLISHING APPARATUS - A polishing apparatus capable of correcting an inclination of a polishing head is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad thereon; a polishing head configured to press a substrate against the polishing pad; a rotational shaft coupled to the polishing head; a self-aligning rolling bearing that tiltably supports the rotational shaft; a radial rolling bearing that receives a radial load of the rotational shaft; a detector configured to detect an inclination of the rotational shaft; and an inclination adjusting device configured to adjust the inclination of the rotational shaft. | 12-03-2015 |
20150343594 | POLISHING APPARATUS - A polishing apparatus includes: a polishing table | 12-03-2015 |
20160074994 | Polishing Method - A polishing method which can prevent a contamination of a release nozzle for releasing a substrate, such as a wafer, from a polishing head, is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing pad on a polishing table by a polishing head while moving the polishing table and the polishing head relative to each other; moving the polishing head, holding the substrate, to a predetermined position above a substrate transfer device; cleaning the substrate by ejecting a cleaning fluid onto the substrate held by the polishing head located at the predetermined position; during cleaning of the substrate, discharging a fluid from a release nozzle located at the substrate transfer device; and after cleaning of the substrate, releasing the substrate from the polishing head by ejecting a releasing shower from the release nozzle into a gap between the polishing head and the substrate. | 03-17-2016 |
Patent application number | Description | Published |
20110171486 | COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL - A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same. | 07-14-2011 |
20120258281 | COPPER FOIL AND METHOD FOR PRODUCING COPPER FOIL - Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm | 10-11-2012 |
20130108922 | ELECTROLYTIC COPPER FOIL, ELECTROLYTIC COPPER FOIL FOR LITHIUM ION SECONDARY BATTERY, ELECTRODE FOR LITHIUM ION SECONDARY BATTERY USING THE ELECTROLYTIC COPPER FOIL, AND LITHIUM ION SECONDARY BATTERY USING THE ELECTRODE | 05-02-2013 |
20130115510 | ANODE FOR SECONDARY BATTERY, ANODE CURRENT COLLECTOR, PRODUCTION METHOD THEREOF, AND SECONDARY BATTERY - A chargeable and dischargeable secondary battery for use in electronic devices, industrial machines, electric-powered vehicles, is provided, along with an anodic electrode and a copper foil for anode current collector. It is an anode for secondary battery that utilizes non-aqueous electrolyte, which comprises a silicon-type active material film formed on one side or both sides of a current collector made of copper foil or copper alloy foil, wherein 1 g/m | 05-09-2013 |
20140017564 | LITHIUM-ION SECONDARY BATTERY, ELECTRODE FOR THE SECONDARY BATTERY, AND ELECTROLYTIC COPPER FOIL FOR ELECTRODE FOR THE SECONDARY BATTERY - To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm | 01-16-2014 |
20140045061 | ELECTROLYSIS COPPER-ALLOY FOIL, METHOD OF THE SAME, ELECTROLYTIC-SOLUTION USING THE PRODUCTION, NEGATIVE ELECTRODE AGGREGATION USED THE SAME, SECONDARY BATTERY, AND ELECTRODE OF THE SAME - The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition. | 02-13-2014 |
20140199588 | ELECTROLYTIC COPPER FOIL, METHOD OF PRODUCING ELECTROLYTIC COPPER FOIL, LITHIUM ION SECONDARY CELL USING ELECTROLYTIC COPPER FOIL AS COLLECTOR - The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2. The electrodeposited copper foil is produced with an electrolyte in which from 3 to 20 ppm of organic additives of one or more compounds selected from compounds having a structure with an SH group binding to a heterocycle containing N or thiourea-based compounds is added to a copper sulfate-based electrolyte, and then from 0 to 12 ppm of hydroxyethyl cellulose or a low-molecular weight glue, and from 10 to 80 ppm of chlorine ions are added thereto. | 07-17-2014 |
20140291156 | HIGH STRENGTH, HIGH HEAT RESISTANCE ELECTRODEPOSITED COPPER FOIL AND MANUFACTURING METHOD FOR SAME - Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C. | 10-02-2014 |
Patent application number | Description | Published |
20090262569 | SEMICONDUCTOR MEMORY DEVICE WITH STACKED MEMORY CELL STRUCTURE - A semiconductor device including: a first memory cell including a non-volatile first variable resistance element that stores data by varying a resistance value and a selection transistor that selects the first variable resistance element; a first memory layer provided with more than one such first memory cell arranged in a plane; a second memory cell including a non-volatile second variable resistance element that stores data by varying a resistance value and a selection diode that selects the second variable resistance element; and a second memory layer provided with more than one such second memory cell arranged in a plane; wherein more than one such second memory layer is stacked over the first memory layer. | 10-22-2009 |
20100277987 | SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF - Systems and methods for programming data to a memory device (MD). The methods involve receiving the data at MD ( | 11-04-2010 |
20110051529 | MEMORY DEVICE - Systems and methods for reading data from or writing data to a memory device. The methods involve receiving a first pulse signal having a first pulse frequency at the memory device. The methods also involve generating, at the memory device, a second pulse signal using the first pulse signal. The second pulse signal is a compliment of the first pulse signal. The second pulse signal has a second pulse frequency that is equal to the first frequency. The first pulse signal is used to control first read/write operations so that first data is output from or input to the memory device at a first data rate. The first and second pulse signals are used to control second read/write operations so that second data is output from or input to the memory device at a second data rate. The second data rate is twice the first data rate. | 03-03-2011 |
20110157978 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF READING DATA FROM NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - At the time of reading, an unselected word line voltage is fixed to a first predetermined voltage (0 V or 3 V), and when selecting a word line, a selected word line voltage is set to a second predetermined voltage (−3.5 V or 0 V). This configuration eliminates an application of a pulsed voltage to the word line at the time of reading, making it possible to reduce an influence of read disturbance. In addition, even when a voltage in a range from a power source voltage to a ground voltage or a voltage over the power source voltage is required at the time of reading, it becomes a voltage about 1.5 times an absolute value of the power source voltage. Therefore, a voltage step-up circuit having a large number of stages is not required, and as a result, it is possible to achieve a reduced operation time with a low power consumption. | 06-30-2011 |
20110261622 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile semiconductor memory device includes a first string including a first number of memory cells connected in series each storing therein information in a nonvolatile manner; and a second string including a second number of memory cells connected in series each storing therein information in a nonvolatile manner, wherein the second number is smaller than the first number. | 10-27-2011 |
20130016552 | SEMICONDUCTOR MEMORY DEVICE FEATURING SELECTIVE DATA STORAGE IN A STACKED MEMORY CELL STRUCTURE - A semiconductor device including: a first memory cell including a non-volatile first variable resistance element that stores data by varying a resistance value and a selection transistor that selects the first variable resistance element; a first memory layer provided with more than one such first memory cell arranged in a plane; a second memory cell including a non-volatile second variable resistance element that stores data by varying a resistance value and a selection diode that selects the second variable resistance element; and a second memory layer provided with more than one such second memory cell arranged in a plane; wherein more than one such second memory layer is stacked over the first memory layer. | 01-17-2013 |
20140177339 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile semiconductor memory device includes a first string including a first number of memory cells connected in series each storing therein information in a nonvolatile manner; and a second string including a second number of memory cells connected in series each storing therein information in a nonvolatile manner, wherein the second number is smaller than the first number. | 06-26-2014 |
Patent application number | Description | Published |
20110056899 | RACK ASSEMBLY - An assembly shelf ( | 03-10-2011 |
20120234784 | Assembly shelf - An assembly shelf includes a post that includes two main post sections and a connection section that connects the main post sections, a plurality of through-holes being formed in the connection section along a longitudinal direction, a pair of connection members, each of the pair of connection members including a first engagement section that engages the post, and a second engagement section that engages a shelf board member, and a shelf board member that includes a third engagement section that is formed approximately at each corner and engages the second engagement section, the pair of connection members and the shelf board member being positioned within the range that corresponds to half of the post in the lateral direction. | 09-20-2012 |
20120234785 | RACK ASSEMBLY - An assembly shelf includes a post that includes two main post sections and a connection section that connects the main post sections, a plurality of through-holes being formed in the connection section along a longitudinal direction, a pair of connection members, each of the pair of connection members including a first engagement section that engages the post, and a second engagement section that engages a shelf board member, and a shelf board member that includes a third engagement section that is formed approximately at each corner and engages the second engagement section, the pair of connection members and the shelf board member being positioned within the range that corresponds to half of the post in the lateral direction. | 09-20-2012 |
20120234786 | RACK ASSEMBLY - An assembly shelf includes a post that includes two main post sections and a connection section that connects the main post sections, a plurality of through-holes being formed in the connection section along a longitudinal direction, a pair of connection members, each of the pair of connection members including a first engagement section that engages the post, and a second engagement section that engages a shelf board member, and a shelf board member that includes a third engagement section that is formed approximately at each corner and engages the second engagement section, the pair of connection members and the shelf board member being positioned within the range that corresponds to half of the post in the lateral direction. | 09-20-2012 |
20130026122 | COUPLING MEMBER, AND ASSEMBLED RACK PROVIDED WITH SAME - A coupling member includes two members that are fitted to each other to hold a post from either side, each of the two members including a first tapered section that gradually increases in diameter in a downward direction, and a second tapered section that gradually slopes inward in the downward direction, and the first tapered section of one member among the two members and the second tapered section of another member among the two members being disposed within the half area of the coupling member in the diametrical direction when viewed from the front side when the coupling member is fitted to the post. An assembly shelf includes the coupling member. Since the assembly shelf is configured so that one shelf board member is supported within the half area of the coupling member in the diametrical direction when viewed from the front side, the assembly shelf can be easily assembled, and a middle shelf board member can be removed from the assembly shelf. | 01-31-2013 |