Patent application number | Description | Published |
20140020934 | CIRCUIT BOARD ASSEMBLY WITH FLEXIBLE CIRCUIT BOARD AND REINFORCING PLATE - A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive. | 01-23-2014 |
20140027158 | CIRCUIT BOARD ASSEMBLY WITH FLEXIBLE PRINTED CIRCUIT BOARD AND REINFORCING PLATE - A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive. | 01-30-2014 |
20140036116 | FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY WITH STIFFENER AND CAMERA MODULE - A flexible printed circuit board (FPCB) assembly includes a FPCB, a dielectric layer, a stiffener, and a conductive adhesive layer. The FPCB includes a surface and a conductive layer positioned on the surface of the FPCB. The conductive layer includes a circuit portion and a grounding portion connected to the circuit portion. The circuit portion is entirely covered by the dielectric layer and the grounding portion is exposed outside the dielectric layer. The conductive adhesive is positioned on the stiffener and includes a first adhering portion and a second adhering portion. A thickness of the second adhering portion is greater than the first adhering portion. A thickness difference between the second adhering portion and the first adhering portion is substantially equal to a thickness the dielectric layer. The first adhering portion is adhered to the dielectric layer and the second adhering portion is adhered to the grounding portion. | 02-06-2014 |
20140049671 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a metal layer. The rigid-flex board defines a through hole penetrating its upper surface and its lower surface. An upper pad is positioned on an upper side surface of the rigid-flex board. The image sensor is positioned on the lower surface, and includes an image surface facing the through hole. A metal layer covers on a top surface and/or a bottom surface of the supporting plate, and a lower pad is positioned on a lower side surface of the supporting plate and connects to the metal layer. The supporting plate is positioned on the lower surface, and the image sensor is received between the rigid-flex board and the supporting plate. The metal sheet is electrically connected between the lower pad and the upper pad. | 02-20-2014 |
20140049684 | CIRCUIT BOARD ASSEMBLY AND CAMERA MODULE USING SAME - A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. | 02-20-2014 |
20140049685 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a rigid-flex board, an image sensor, a supporting plate, and a glue. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate defines a receiving recess. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is received in the receiving recess. The glue fills between the supporting plate and the rigid-flex board. | 02-20-2014 |
20140049686 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a rigid-flex board, an image sensor, and a supporting plate. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is positioned between the supporting plate and the rigid-flex board. | 02-20-2014 |
20140053986 | STAMPING HEAD USED FOR PRESSING ANISOTROPIC CONDUCTIVE FILM ONTO CERAMIC SUBSTRATE - A stamping head includes a stamping portion and a connection portion connected to the stamping portion. The stamping portion includes a top surface and four side surfaces. The stamping head defines a jag extending from a junction between a specific one of the side surfaces and the top surface toward a centre of the top surface. The jag passes through the specific side surface. When the stamping head presses a ACF onto a ceramic substrate, a residual air between the ACF and the ceramic substrate flows outside through the jag. | 02-27-2014 |
20140055651 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a ceramic substrate, an image sensor, a conductive film, a flexible print circuit board (FPCB), and a stiffening plate. The ceramic substrate includes an upper surface and a lower surface opposite to the upper surface, the ceramic substrate defines a transparent hole on the upper surface and a receiving recess on the lower surface. The transparent hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The FPCB is electrically connected to the lower surface of the ceramic substrate by the conductive film. The stiffening plate is positioned on one side of the FPCB opposite to the ceramic substrate. | 02-27-2014 |
20140055669 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film. | 02-27-2014 |
20140059822 | APPARATUS FOR ASSEMBLING CAMERA MODULES - An apparatus for assembling camera modules to flexible printed circuit boards (PCBs) includes a number of trays, a surface mounting device used in surface mount technology (SMT) for PCBs, and a hot pressing device. Workpieces, each of which includes a flexible PCB (FPCB) and a lens module positioned on the FPCB, are received in the trays. Each tray is sent to the surface mounting device. The surface mounting device loads and pastes a stiffener onto a FBCB, opposite to a lens module. The hot pressing device hot presses each stiffener to the respective workpiece, which is received in each tray sent from the surface mounting device, to fixedly secure the stiffener to the respective workpiece to form a camera module. | 03-06-2014 |
20140113097 | SMT TAPE - A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves. | 04-24-2014 |
20140139710 | IMAGE SENSOR MODULE AND CAMERA MODULE USING SAME - An image sensor module includes a substrate, an image sensor, and a connecting plate. The substrate includes a supporting portion and an extending portion extending from one side of the supporting portion. The supporting portion includes an upper surface and a lower surface opposite to the upper surface. The supporting portion defines a through hole penetrating the upper surface and the lower surface and a receiving recess communicating the through hole on the lower surface. The thickness of the extending portion is less than the thickness of the supporting portion. The image sensor is received in the receiving recess and is electrically connected to the substrate. The connecting plate is electrically connected to the extending portion, the thickness of the connecting plate is less than or equal to the thickness difference between the extending portion and the supporting portion. | 05-22-2014 |
20140184902 | IMAGE SENSOR MODULE WITH SUBSTRATE DEFINING GAS PRESSURE RELIEVING HOLE AND CAMERA MODULE USING SAME - An image sensor module includes a ceramic substrate, an image sensor, and a filter. The ceramic substrate defines a light transmitting hole and a receiving recess communicating with the light transmitting hole. The image sensor is received in the receiving recess. The filter is positioned on the ceramic substrate. | 07-03-2014 |
20140210504 | TESTING DEVICE FOR ELECTRONIC DEVICE TESTING - A testing device includes a test board, a number of locating pins, a pin holder, a number of metal pins, a connector holder, a connector, a number of elastic elements, and a pressure block. The test board is electrically connected with a testing circuit. The locating pins are fixed on the testing board to guide the connector holder. Bottoms of the number of metal pins are vertically fixed in the pin holder. The elastic elements are arranged between the pin holder and the connector holder for pushing the connector holder back to its original position after testing. The connector is set in the connector holder and connected with an electronic device to be tested. The pressure block is positioned above the connector holder and used to push the connector holder down to the pin holder to make the testing contacts in the connector contact the metal pins. | 07-31-2014 |
20140293124 | CAMERA MODULE WITH AMBIENT LIGHT SENSOR - A camera module includes a shell, an ambient light sensor, and a lens module having a printed circuit board. The shell has a seat in its front surface, a first connector on its back surface, and circuits connecting the first connector to the seat by a laser direct structure technology. The ALS is soldered to the seat. The PCB is attached to the back surface of the shell and includes a second connector connected to the first connector. | 10-02-2014 |
20140310952 | DEVICE FOR ASSEMBLING CAMERA MODULE HAVING ANISOTROPIC CONDUCTIVE FILM - A device for assembling a camera module includes a support base, a pressing head, a buffer tape, a winding device, a driver, and a controller. The support base is for supporting the camera module. The camera module includes a ceramic substrate positioned on the support base and an anisotropic conductive film (ACF) pasted on the ceramic substrate. The pressing head is positioned above the ACF and is configured to pressing the ACF. The buffer tape is positioned between the pressing head and the ACF. The winding device includes a winding-out roller and a winding-in roller. The buffer tape is wound on the winding-out roller. The controller is configured to control the driver to drive the winding device to wind the buffer tape out from the winding-out roller and into the winding-in roller in a predetermined manner. | 10-23-2014 |
20140313403 | CAMERA MODULE HAVING AMBIENT LIGHT SENSOR - A camera module facilitating the assembly therewith of an ambient light sensor includes a flexible printed circuit board (FPCB), a lens module, and a case. The FPCB includes a ground layer. The lens module is positioned on and connected to the FPCB. The case includes a front surface and a rear surface opposite to the front surface, and defines a receiving recess running through the front surface and the rear surface. A metal layer is coated on an inner surface of the receiving recess and the rear surface to isolate an image sensor of the camera module from the incident light experienced by the ambient light sensor. The case is supported on the FPCB and the lens module is received in the receiving recess. The metal layer is electrically connected to the ground layer. | 10-23-2014 |
20150015779 | CAMERA MODULE - A camera module includes an image sensor, a circuit board, and a stiffener. The stiffener is located one side of the circuit board and includes a bottom plate grounded. The image sensor is located on another side of the circuit board. The stiffener includes a sidewall extending from the bottom plate. The sidewall and the bottom plate cooperatively hold the circuit board. An insulative coating is coated on the sidewall to avoid short circuiting. | 01-15-2015 |
20150021730 | CAMERA MODULE - A camera module includes an image sensor, a packaging substrate, a lens holder, and a lens unit. The image sensor is positioned on a surface of the packaging substrate. The lens holder includes a base portion and a holding portion connected to the base portion. The base portion includes a number of protrusions protruding from a bottom surface thereof away from the holding portion. The lens holder is connected to the packaging substrate with the protrusions in contact with the packaging substrate. The lens unit is received in the lens holder and optical aligned with the image sensor. | 01-22-2015 |
20150059167 | ATTACHMENT DEVICE - An attachment device includes an exhaust, a connecting pipe, and an adhering head. The adhering head includes an adhering surface, and the adhering surface defines a number of evenly spaced adhering holes for adhering a conductive adhesive film. The connecting pipe air-tightly connects the exhaust to the adhering head. | 03-05-2015 |
20150062424 | CAMERA MODULE AND METHOD FOR ASSEMBLING SAME - A camera module includes a substrate, an image sensor electrically connected to a surface of the substrate, a lens holder connected to the substrate and covering the image sensor, a lens holder received into the lens holder, a connecting board, and an ACF positioned between the substrate and the connecting board. The image sensor includes a sensing surface and a number of side surfaces connecting to the sensing surface. The substrate is electrically and mechanically connected with each other by the ACF. An adhesive is distributed on each corner of the image sensor, and the adhesive connects the side surfaces of the image sensor to the substrate. | 03-05-2015 |