Patent application number | Description | Published |
20130015773 | ILLUMINATING APPARATUS AND METHOD THEREOFAANM TAI; SHIH-NENGAACI TAOYUAN COUNTYAACO TWAAGP TAI; SHIH-NENG TAOYUAN COUNTY TWAANM CHUNG; CHIA-TINAACI MIAOLI COUNTYAACO TWAAGP CHUNG; CHIA-TIN MIAOLI COUNTY TW - An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power. | 01-17-2013 |
20130076239 | ILLUMINATION DEVICE FOR ENHANCING PLANT GROWTH - An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module. The control unit includes a first PWM control module electrically connected to the first current-limiting chip, a second PWM control module electrically connected to the second current-limiting chip, and a third PWM control module electrically connected to the third current-limiting chip. | 03-28-2013 |
20130076247 | ILLUMINATING APPARATUS CAPABLE OF DETECTING POWER SUPPLY AND METHOD USING THE SAME - An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply. | 03-28-2013 |
20130088867 | LAMP MODULE - A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure. | 04-11-2013 |
20130106290 | ILLUMINATING APPARATUS CAPABLE OF MINIMIZING OCCURRENCE OF FLICKS AND METHOD USING THE SAME | 05-02-2013 |
20130181601 | LIGHT-MIXING MULTICHIP PACKAGE STRUCTURE - A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body. | 07-18-2013 |
20130264954 | ENERGY-SAVING ILLUMINATION APPARATUS AND METHOD THEREOF - An energy-saving illumination apparatus adapted to receive an input power includes a light unit, a detection unit, a dimming unit, and a control unit. The light unit has a plurality of light sets and a switch unit connecting the light sets in parallel and/or serial connections. The detection unit is for detecting the status of the input power. The dimming unit is for controlling the current of the light unit. The control unit is for controlling the switch unit according to the detection result of the detection unit and making the turn-on voltage of the light unit be changed along with the input power. The control unit controls duty cycle of pulse width modulation (PWM) signal and transmits the PWM signal to the dimming unit. The dimming unit adjusts the current which conducts and makes the light unit emit light to be changes along with the duty cycle. | 10-10-2013 |
20150061513 | MULTICHIP PACKAGE STRUCTURE - A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased. | 03-05-2015 |