Patent application number | Description | Published |
20090230563 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device capable of preventing a crack from occurring in an electrode layer exposed through a through hole which is formed in a semiconductor substrate and a method of manufacturing the semiconductor device. In exemplary embodiments, a through via and an opening in a passivation film are disposed so that an opening diameter of the through via is larger than an opening diameter of the opening of the passivation film, and an opening edge of the through via is located outside an opening edge of the opening of the passivation film. In other embodiments, the through via and the opening of the passivation film are disposed so that the opening edge of the through via is disposed at a location which does not overlap with the opening edge (opening edge of a portion in contact with a pad electrode) of the opening of the passivation film. | 09-17-2009 |
20090294987 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To improve connection reliability of a through electrode in a semiconductor device, and prevent deterioration of electrical characteristics due to a residue generated from a pad at the time of forming the through electrode. A contact area between a pad | 12-03-2009 |
20100009491 | Joined wafer, fabrication method thereof, and fabrication method of semiconductor devices - A method of fabricating a joined wafer has an exposure process which comprises a device formed-area exposure process of exposing by a stepper such that parts of the photosensitive adhesive layer formed over a surface of the transparent wafer or the device formed wafer are removed, the parts corresponding to the device formed areas when the transparent wafer and the device formed wafer are stuck together; and a wafer periphery exposure process of exposing such that a portion of the photosensitive adhesive layer over the periphery of the transparent wafer is left. | 01-14-2010 |
20100025710 | Semiconductor device and fabrication method thereof - There is provided a semiconductor device including: a semiconductor chip having a penetrating electrode penetrating through from a first main surface of the semiconductor chip to a second main surface on the opposite side thereof, a photoreceptor portion formed on the first main surface, and a first wire at a periphery of the photoreceptor portion; a light transmitting chip adhered to the first main surface at the periphery of the light transmitting chip, with a bonding layer interposed between the light transmitting chip and the first main surface, the light transmitting chip covering the light transmitting chip; and a light blocking resin layer formed only on the side surfaces of the light transmitting chip and the bonding layer. | 02-04-2010 |
20100197079 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE - A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder. | 08-05-2010 |
20110287585 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENTS MOUNTED ON BASE PLATE - A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder. | 11-24-2011 |
20120286385 | SEMICONDUCTOR DEVICE, CAMERA MODULE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element forming surface, and a light transmissive protective member laminated over the element forming surface via an adhering portion. The semiconductor device includes a region exposed from the protective member at the outer peripheral end portion of the semiconductor element, when viewed from the protecting member in a laminating direction. | 11-15-2012 |
Patent application number | Description | Published |
20090103964 | Key switch arrangement having an illuminating function - A key switch arrangement is able to accomplish the compatibility with a normal keyboard in respect of profile without increasing the height of the keyboard and reduce the cost without adding new members for a light source. The key switch arrangement includes a key-top having an optically transparent key-top having a cutout letter part formed thereon, an optically transparent membrane sheet having a contact, an optically transparent plate member arranged under the membrane sheet, and a light source arranged in the membrane sheet. The light source emits light to pass the plate member and the membrane sheet to illuminate the cutout letter part on the key-top. | 04-23-2009 |
20090133999 | Key switch arrangement excellent in waterproofing property - A key switch arrangement is able to prevent liquid such as water from entering a membrane sheet and staying therein. The key switch arrangement includes a waterproof sheet arranged above the membrane sheet, a first fixing member arranged in above the waterproof sheet and having a first projection protruding on the side of the waterproof sheet, and a second fixing member arranged below the membrane sheet and having a second projection protruding on the side of the membrane sheet. In the waterproof sheet and the second projection, holes are formed to which the first projection enters, while in the membrane sheet, a hole is formed to which the second projection enters so as to adhere the waterproof sheet closely to the second projection. | 05-28-2009 |
20110155551 | KEYBOARD STRUCTURE - There is provided a keyboard structure capable of preventing a fingernail of a user from being inserted between key tops and achieving uniform illumination without illumination leakage. A key top body portion ( | 06-30-2011 |
20110168537 | KEY SWITCH STRUCTURE - A key switch structure capable of reducing the height of a key switch, reducing the number of components, and reducing manufacturing costs. | 07-14-2011 |
20130043113 | KEY SWITCH STRUCTURE - A key switch structure can include a key top, a link structure, a back plate, a membrane sheet, an elastic member, an arm bar, and a pushing member. The link structure can guide the key top in the pushing direction while the key top is pushed. The back plate can support the link structure. The membrane sheet can include a contact portion arranged on the membrane sheet and connectable, in response to a predetermined pressure, to an electrical contact to form a closed circuit. The elastic member can push and separate the key top from the back plate, and be elastically deformable. The arm bar can movably support the key top, and the arm bar can be supported movably at the back plate. The pushing member can push the link structure while the key top is pushed. | 02-21-2013 |
20130078023 | KEY SWITCH STRUCTURE - A key switch structure which enables a reduction in the width of the key switch. A key switch structure comprises a first support member ( | 03-28-2013 |
20140138225 | KEY SWITCH STRUCTURE - A link mechanism detachably supporting a key top against a back sheet provides a first link member; one end side of the first link member is rotatably held at the obverse surface of the back plate, and the other end side is slidably held at the reverse surface of the key top. A second link member is rotatably connected to the first link member. One end side of the second link member engages rotatably with a rotation support part provided to the reverse surface of the key top and the other end side of the second link member is slidably held at the obverse surface of the back plate. A recess is provided to the second link member, and a protrusion is formed on the rotation support part. The protrusion engages with the recess and restricts detachment of the key top from the second link member. | 05-22-2014 |
Patent application number | Description | Published |
20090002748 | USAGE STATUS MANAGEMENT DEVICE, RECORDING MEDIUM STORING USAGE STATUS PROCESSING PROGRAM, USAGE STATUS MANAGEMENT SYSTEM, AND USAGE STATUS MANAGEMENT METHOD - A usage status management device, which includes a collection section that collects usage history information of an image forming device, the usage history information including information on a usage of a display operation section of the image forming device, an analysis section that analyzes a usage status of the image forming device based on the usage history information collected by the collection section, and an output control section that controls to output the usage status of the image forming device analyzed by the analysis section. | 01-01-2009 |
20130153477 | LIQUID WASTE TREATMENT APPARATUS - An inner tube is provided with a protruding portion protruding from an outer peripheral surface of the tube, in a position extending throughout the entire area of the outer peripheral surface of the tube, in a region located outside an outer tube, of the entire area in a longitudinal direction of the inner tube inserted into a through-hole of a discharge side wall of the outer tube, and the protruding portion of the inner tube is pressed by an outlet joint toward the discharge side wall along an axial direction of the outer tube, and thereby, the inner tube is cantilevered by the discharge side wall. | 06-20-2013 |
20140048464 | FLUID PURIFYING APPARATUS - A fluid purifying apparatus that purifies fluid containing organic matter has a reactor including a first transfer part that receives the fluid from outside and transfers the fluid in a vertical direction from an upper side to a lower side while heating and pressurizing the fluid and mixing the fluid with an oxidant, a second transfer part that receives the fluid that has passed through the first transfer part and transfers the fluid in the vertical direction from the lower side to the upper side, and a partition member that partitions an upper part of the reactor into the first transfer part and the second transfer part, and a solid storage part that communicates with the first transfer part and the second transfer part below the partition member and receives solid matter contained in the fluid that settles while the fluid is transferred. | 02-20-2014 |
Patent application number | Description | Published |
20120006592 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion. | 01-12-2012 |
20120008295 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor. | 01-12-2012 |
20140231990 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads. | 08-21-2014 |