Patent application number | Description | Published |
20090157373 | Analyzing model creating apparatus and method, and computer-readable storage medium - An analyzing model creating apparatus includes an interval acquiring part to acquire intervals of a plurality of parts that are mounted on a PCB for an electronic equipment, from design data of the PCB, a comparing part to compare a minimum part interval between the parts and a first mesh size which is preset, and a computing part to compute a value which is ½ the minimum part interval between the parts as a second mesh size if the minimum part interval between the parts is less than 2 times the first mesh size. A generating part is provided to generate an analyzing model of the printed circuit board based on the second mesh size. | 06-18-2009 |
20090171637 | Analyzing model creating apparatus and method, and computer-readable storage medium - An analyzing model creating apparatus obtains a three-dimensional analyzing model (3D mode) of an analyzing target and regions of the 3D model, obtains a reference point on an impact surface from a normal vector of the impact surface represented by a unit vector and minimum and maximum values of each coordinate obtained from the regions of the 3D model to generate the impact surface having an impact attitude of the 3D model with respect to the impact surface defined by an arbitrary rotary position of the impact surface. The apparatus further generates an analysis input file which includes information related to the 3D model, the impact surface and an impact velocity with which the 3D model and the impact surface collide, and analyzes a strength of the 3D model based on the analysis input file. | 07-02-2009 |
20090248382 | Design support system and design support method - A design support system for supporting a design of an electronic device having an input device through which an input is made by utilizing elasticity is provided. The system includes a simulation unit for executing structural simulation of an input device based on structural data of the electronic device including the input device. The support system can include a re-design determining unit for notifying a need for re-design to a designer based on reactive characteristic data of the input device output from the simulation unit. The support system can include an examining unit for examining the reactive characteristic data, and a selecting unit for selecting another input device to replace the current input device. | 10-01-2009 |
20110045882 | WATERPROOF-TYPE ELECTRONIC EQUIPMENT - A waterproof-type electronic equipment includes first and second case parts together forming a housing. A seal material is provided between the first and second case parts. The seal material has a first surface including a fixed portion fixed to an inner surface of the first case part. The seal material has a contacting portion that makes a convex shape on a side opposite to the first surface to contact with the second case part. A recessed portion is provided on the inner surface of the first case part and outer side of the fixed portion of the seal material. The recessed portion is located at a position where the first surface of the seal material covers an opening of the recessed portion. A passage connects the recessed portion of the first case part and an exterior of the first case part to each other. | 02-24-2011 |
20110054877 | ANALYSIS SUPPORT COMPUTER PRODUCT, ANALYSIS SUPPORT APPARATUS, AND ANALYSIS SYSTEM - A non-transitory, computer-readable recording medium stores therein an analysis support program that causes a computer to execute receiving disposal position information indicative of respective disposal positions for jigs in information indicative of disposal positions set on a surface of an object model modeling an object; creating, using the object model and a jig model modeling a jig, an analytic model by modeling a state where the jigs are disposed respectively at the disposal positions that are on the surface of the object and indicated by the disposal position information; obtaining an analysis result for each of the disposal positions by executing strength analysis of the object using the analytic model; producing, by correlating the disposal positions and the analysis results for the disposal positions based on the obtained analysis results, a chart that displays at each of the disposal positions, a correlated analysis result; and outputting the chart. | 03-03-2011 |
20140310677 | BOARD DESIGN AID DEVICE, BOARD DESIGN AID METHOD, AND BOARD DESIGN AID PROGRAM - A board design aid device includes a calculating and correcting units. The calculating unit groups a plurality of layers in a multi-layer board into a plurality of pairs of layers based on design information of the multi-layer board, the plurality of layers being stacked and derives a difference of total amounts in respect to a board design element, each of the total amounts being related to each layer of a pair of layers of the plurality of pairs of layers, the board design element being related to a warp of the multi-layer board. The correcting units, based on the difference of the total amounts, corrects an amount of the board design element for at least one of layers among at least one of the plurality of the pairs of layers so that the difference of the total amounts of the board design element is maintained within a certain range. | 10-16-2014 |
20140358494 | DEFORMATION SIMULATION APPARATUS, DEFORMATION SIMULATION METHOD, AND DEFORMATION SIMULATION PROGRAM - A deformation simulation apparatus includes a simulation unit configured to simulate a deformation of an elastic body to determine a plurality of simulated results, the plurality of simulated results being simulated at respective a plurality of positions in the elastic body, a display unit configured to display a graph that is indicative of the plurality of simulated results in a manner that each of the plurality of simulated results is associated with a corresponding one of the plurality of positions over a range indicative of a whole of the elastic body. | 12-04-2014 |
Patent application number | Description | Published |
20080211002 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - This semiconductor device includes: a first cylinder interlayer insulating film; a second cylinder interlayer insulating film; a cylinder hole including a first cylinder hole and a second cylinder hole communicating with the first cylinder hole; and a capacitor including a lower electrode and an upper electrode. The first cylinder interlayer insulating film has an etching rate for etchant, which is two to six times as high as an etching rate for the second cylinder interlayer insulating film, a hole diameter of the first cylinder hole is larger than that of the second cylinder hole, and the hole diameter of the second cylinder hole near an interface between the first cylinder interlayer insulating film and the second cylinder interlayer insulating film increases as the second cylinder hole approaches the interface. | 09-04-2008 |
20080251920 | Dielectric film forming method - In a film forming sequence for a HDP-CVD oxide film, Ar gas is introduced into a reactive chamber and then source power (or RF power) is applied to excite plasma. After that, a carrier gas (He) is introduced into the reactive chamber. After a semiconductor substrate is heated by plasma of the Ar and He gasses, introduction of the Ar gas is stopped. Subsequently, SiH | 10-16-2008 |
20100078773 | Semiconductor device and method of forming semiconductor device - A semiconductor device includes a substrate, a semiconductor device structure over the substrate, an insulating film that covers the semiconductor device structure, and a stress-compensation film over the insulating film. The stress-compensation film has a first stress that compensates a second stress working to bend the substrate. | 04-01-2010 |
20100279485 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device may include, but is not limited to the following processes. A first contact plug is formed in a first insulating film. A barrier film is formed on the first insulating film. A second insulating film is formed on the barrier film. A support film is formed on the second insulating film. A first electrode is formed so as to penetrate the support film and the second insulating film. The first electrode is electrically connected to the first contact plug. A portion of the support film is removed. A remaining portion of the support film mechanically supports the first electrode. The second insulating film is removed by a wet etching to expose an outside surface of the first electrode while the barrier film prevents the first insulating film from being etched. At least one of the barrier film and the support film is formed by using high density plasma chemical vapor deposition. | 11-04-2010 |