Seung Youl
Seung Youl Choi, Seoul KR
Patent application number | Description | Published |
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20140264936 | SEMICONDUCTOR PACKAGE - A semiconductor package including a first connection terminal group configured to receive a first signal group from the outside of the semiconductor package, a second connection terminal group configured to transmit a second signal group to the outside, a first chip connected to the first connection terminal group, and a second chip connected to the second connection terminal group and configured to receive the first and second signal groups from the first chip. Degradation of the performance of the semiconductor package, caused by the differences between signal delay times in a plurality of chips therein may be minimized. | 09-18-2014 |
Seung Youl Heo, Gwangmyeong-Si KR
Patent application number | Description | Published |
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20130222519 | MOBILE DEVICE CAPABLE OF MULTI-PARTY VIDEO CONFERENCING AND CONTROL METHOD THEREOF - A mobile device to control a multi-party video conferencing including a processor to process video data to be sent to a counterpart mobile device participating in the multi-party video conferencing and to transmit the processed video data to the counterpart mobile device, and a control unit to select a counterpart mobile device to authorize a main control right for controlling the multi-party video conferencing among counterpart mobile devices participating in the multi-party video conferencing. A method that uses a processor to determine a main controller of a video conferencing session including determining mobile devices for the video conferencing session, receiving check packet data from the mobile devices, and selecting, using the processor, a mobile device to control the video conferencing as a main controller. | 08-29-2013 |
Seung Youl Kang, Deajeon KR
Patent application number | Description | Published |
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20110092032 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - Provided is a manufacturing methods of a semiconductor device. The methods includes: forming an active layer on a first substrate; bonding a top surface of the active layer with a second substrate and separating the active layer from the first substrate; forming conductive impurity regions corresponding to source and drain regions of the active layer bonded on the second substrate; bonding a third substrate on a bottom surface of the active layer and removing the second substrate; and forming a gate electrode on a top between the conductive impurity regions of the active layer bonded on the third substrate and forming source and drain electrodes on the conductive impurity regions. | 04-21-2011 |
20110122480 | METHOD OF FABRICATING ELECTROPHORETIC INK, ELECTROPHORETIC INK FORMED USING THE METHOD, AND ELECTROPHORETIC DISPLAY HAVING THE SAME - Provided are a method of fabricating an electrophoretic ink, the electrophoretic ink formed using the method, and an electrophoretic display having the same. The method of fabricating the electrophoretic ink includes dispersing a pigment particle into a dielectric fluid for the electrophoretic ink and adding at least monomer and initiator to the dielectric fluid to form a polymeric membrane surrounding the pigment particle. Since the pigment particle surrounded by the polymeric membrane and the dielectric fluid in which the pigment particle is dispersed can be utilized as the electrophoretic ink as they are, the method of fabricating the electrophoretic ink is simplified. | 05-26-2011 |
20110136296 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a method for manufacturing a semiconductor device. The method includes: providing a first substrate where an active layer is formed on a buried insulation layer; forming a gate insulation layer on the active layer; forming a gate electrode on the gate insulation layer; forming a source/drain region on the active layer at both sides of the gate electrode; exposing the buried insulation layer around a thin film transistor (TFT) including the gate electrode and the source/drain region; forming an under cut at the bottom of the TFT by partially removing the buried insulation layer; and transferring the TFT on a second substrate. | 06-09-2011 |
Seung Youl Lee, Gyeonggi-Do KR
Patent application number | Description | Published |
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20100151855 | METHOD FOR PROVIDING ROAMING SERVICE OF INTERNATIONAL CALL AND MOBILE TERMINAL FOR THE SAME - The present invention relates to a method for providing a roaming service of an international call, as a roaming method of a mobile terminal, comprises, in an international roaming mode, checking TON (Type Of Number) of an incoming number attempted to originate a call; in the case that the TON of the incoming number is not an international call, checking whether the incoming number is a telephone number of a home network or a telephone number of a visited network; and in the case that the incoming number is checked as a telephone number of a home network, changing the incoming number into an international call number using a home country code (CC) stored in a storing unit, changing the TON of the incoming number into an international call, and requesting call origination to the incoming number, and in the case that the incoming number is checked as a telephone number of a visited network, requesting local call origination without number change. | 06-17-2010 |
20100330987 | CALL PROCESSING SYSTEM FOR MOBILE AND METHOD THEREOF - Disclosed herein is a call processing system and method for mobile communication terminals. The call processing system for mobile communication terminals according to the present invention includes a gateway location register ( | 12-30-2010 |