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Sergey Savastiouk, Saratoga US
Sergey Savastiouk, Saratoga, CA US
Patent application number
Description
Published
20120228778
SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES
- A through via (
09-13-2012
20130015585
STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERSAANM Kosenko; ValentinAACI Mountain ViewAAST CAAACO USAAGP Kosenko; Valentin Mountain View CA USAANM Savastiouk; SergeyAACI SaratogaAAST CAAACO USAAGP Savastiouk; Sergey Saratoga CA US
- A through via contains a conductor (
01-17-2013
20130177274
STRUCTURES FORMED USING MONOCRYSTALLINE SILICON AND/OR OTHER MATERIALS FOR OPTICAL AND OTHER APPLICATIONS
- An interposer includes grooves (
07-11-2013
20130177281
OPTICAL INTERPOSER
- An optical interposer includes grooves (
07-11-2013
20130214429
STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS
- A through via contains a conductor (
08-22-2013
20140346646
STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS
- A through via contains a conductor (
11-27-2014
20150228570
SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES
- A through via (
08-13-2015
20150348843
STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR
- A through via contains a conductor (
12-03-2015
Patent applications by Sergey Savastiouk, Saratoga, CA US