Patent application number | Description | Published |
20090045416 | Optical Element Coupled to Low Profile Side Emitting LED - A low profile, side-emitting LED with one or more optical elements, such as a reflector or lens, optically coupled to each light emitting sidewall is described. In one embodiment, a reflector is used to redirect the light emitted from each sidewall to a forward direction, e.g., in a flash configuration. In another embodiment, a lens is used to collimate the side emitted light in the horizontal plane, e.g., for backlighting. Each entrance surface of the lens is positioned so that the bottom edge is at or below the bottom of the light emitting sidewall so that the base of the lens does not block light that is emitted by the LED. | 02-19-2009 |
20090046479 | Thin Backlight Using Low Profile Side Emitting LED - Low profile, side-emitting LEDs are described. The LEDs are used in very thin backlights for backlighting an LCD. In one embodiment, the backlight comprises a solid transparent waveguide with at least one opening in the waveguide containing an LED proximate to one edge. To smooth out a clover-shaped or batwing brightness profile inherently generated by a rectangular side-emitting LED within a smooth-sided rectangular opening in the waveguide, depending on the orientation of the LED, the sidewalls of the opening are made to have varying angles along the length of each sidewall to vary the refraction angle of light along the sidewall. Additionally, if a plurality of LEDs are used in the backlight, the orientations of the openings alternate to create a more uniform brightness profile in the waveguide. | 02-19-2009 |
20090050921 | Light Emitting Diode Array - A one-dimensional array of light emitting diodes (LEDs) is configured to place the LEDs in close proximity to each other, e.g., 150 μm or less and to place at least one side of the LEDs in close proximity to the edge of the substrate, e.g., 150 μm or less. With the LEDs close to the edge of the substrate, multiple one-dimensional arrays may be joined together, side by side, to form a two-dimensional array with the LEDs from adjacent one-dimensional arrays positioned close together. By minimizing the gaps between the LEDs on the same one-dimensional arrays and adjacent one-dimensional arrays, the luminance of the device is improved making the device suitable for high radiance applications. Moreover, using a number of one-dimensional arrays to form a larger two-dimensional array increases yield relative to conventional monolithic two-dimensional arrays. | 02-26-2009 |
20090051831 | Light Source For A Projector - A projector includes a plurality of illumination modules. Each illumination module includes a light source, such as a semiconductor light emitting diode, and an optical element configured to receive light from the light source and collimate the light into a beam. Light from the illumination modules is provided to a liquid crystal display panel, then a projection lens. In some embodiments, secondary optics, such as an array of Fresnel lenses or a reflective polarizer, are disposed between the illumination modules and the liquid crystal display panel. In some embodiments, the liquid crystal display panel is a low temperature polysilicon liquid crystal display. | 02-26-2009 |
20090052158 | Light Source Including Reflective Wavelength-Converting Layer - A light source configured to emit first light is combined with a wavelength-converting layer. The wavelength-converting layer is disposed in a path of first light, is spaced apart from the light source, and includes at least one wavelength-converting material such as a phosphor configured to absorb first light and emit second light. The wavelength-converting layer is disposed between a reflective layer and the light source. In some embodiments, the wavelength-converting layer is a thick layer. | 02-26-2009 |
20090141212 | Illumination Module For Sectional Illumination - A backlight for a display includes a plurality of illumination modules, each illumination module including a light source and a reflective member. A portion of the reflective member is disposed over the light source. A liquid crystal display panel is disposed over the plurality of illumination modules. The reflective member is configured such that a majority of light from the light source is directed parallel to the liquid crystal display panel, to provide uniform illumination of the liquid crystal display panel. In some embodiments, the light source is at least one semiconductor light emitting diode. | 06-04-2009 |
20090154137 | Illumination Device Including Collimating Optics - A structure for providing a collimated light beam includes a light source configured to emit light having a first peak wavelength combined with a group of structures configured to direct at least a portion of light exiting the light source in a direction substantially perpendicular to a top surface of the light source and reflect another portion. In some embodiments, a wavelength converting element is positioned in a path of light emitted from the light source, the wavelength converting element configured to absorb at least a portion of the light having a first peak wavelength and emit light having a second peak wavelength. The group of structures may be formed over the wavelength converting element, such that the wavelength converting element is disposed between the group of structures and the light source. | 06-18-2009 |
20100029023 | CONTROLLING EDGE EMISSION IN PACKAGE-FREE LED DIE - Light emitting diode (LED) structures are fabricated in wafer scale by mounting singulated LED dies on a carrier wafer or a stretch film, separating the LED dies to create spaces between the LED dies, applying a reflective coating over the LED dies and in the spaces between the LED dies, and separating or breaking the reflective coating in the spaces between the LED dies such that some reflective coating remains on the lateral sides of the LED die. Portions of the reflective coating on the lateral sides of the LED dies may help to control edge emission. | 02-04-2010 |
20100072488 | LED WITH CONTROLLED ANGULAR NON-UNIFORMITY - A light source that uses a light emitting diode with a wavelength converting element is configured to produce a non-uniform angular color distribution, e.g., Δu′v′>0.015 within an angular distribution from 0° to 90°, that can be used with specific light based device that translate the angular color distribution into a uniform color distribution. The ratio of height and width for the wavelength converting element is selected to produce the desired non-uniform angular color distribution. The use of a controlled angular color non-uniformity in the light source and using it in applications that translate the non-uniformity into a uniform color distribution, e.g., with a uniformity of Δu′v′<0.01, increases the efficiency of the system compared to conventional systems in which a uniform angular light emitting diode is used. | 03-25-2010 |
20100073597 | THIN EDGE BACKLIGHT WITH LEDS OPTICALLY COUPLED TO THE BACK SURFACE - A backlight includes a waveguide with a plurality of light emitting diodes positioned in cavities in the back surface in a center region of the waveguide. The back surface of the waveguide can be tapered from the center region to the edges so that the edges are thinner than the center region. Additionally, with the light emitting diodes in the center region of the waveguide, as opposed to along the edges, the bezel may be eliminated or at least minimized in height, e.g., 1 mm or less. Additionally, multiple waveguides may be used and configured in a “V” shape to minimize the bezel. | 03-25-2010 |
20100252846 | BACKLIGHT INCLUDING SEMICONDUCTIOR LIGHT EMITTING DEVICES - A light source such as a semiconductor light emitting diode is positioned in a first opening in a transparent member, which may function as a waveguide in a display. The transparent member surrounds the light source. No light source is positioned in a second opening in the transparent member. In some embodiments, the first opening is shaped to direct light into the transparent member. In some embodiments, a reflector is positioned over the light source. The reflector includes a flat portion and a shaped portion. The shaped portion extends from the flat portion toward the light source. | 10-07-2010 |
20100277950 | REMOTE WAVELENGTH CONVERTING MATERIAL CONFIGURATION FOR LIGHTING - A device includes a reflector and a wavelength converting material disposed on the reflector. A backlight is disposed between the reflector and a surface to be illuminated, such as a liquid crystal display panel. The backlight includes a light source and a waveguide. The waveguide is configured to direct a majority of light from the light source toward the reflector. At least a portion of the light is converted by the wavelength converted material, reflected by the reflector, and incident on the surface to be illuminated. | 11-04-2010 |
20100279437 | CONTROLLING EDGE EMISSION IN PACKAGE-FREE LED DIE - Light emitting diode (LED) structures are fabricated in wafer scale by mounting singulated LED dies on a carrier wafer or a stretch film, separating the LED dies to create spaces between the LED dies, applying a reflective coating over the LED dies and in the spaces between the LED dies, and separating or breaking the reflective coating in the spaces between the LED dies such that some reflective coating remains on the lateral sides of the LED die. Portions of the reflective coating on the lateral sides of the LED dies may help to control edge emission. | 11-04-2010 |
20100308354 | LED WITH REMOTE PHOSPHOR LAYER AND REFLECTIVE SUBMOUNT - A light emitting device comprises a flip-chip light emitting diode (LED) die mounted on a submount. The top surface of the submount has a reflective layer. Over the LED die is molded a hemispherical first transparent layer. A low index of refraction layer is then provided over the first transparent layer to provide TIR of phosphor light. A hemispherical phosphor layer is then provided over the low index layer. A lens is then molded over the phosphor layer. The reflection achieved by the reflective submount layer, combined with the TIR at the interface of the high index phosphor layer and the underlying low index layer, greatly improves the efficiency of the lamp. Other material may be used. The low index layer may be an air gap or a molded layer. Instead of a low index layer, a distributed Bragg reflector may be sputtered over the first transparent layer. | 12-09-2010 |
20110012147 | WAVELENGTH-CONVERTED SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING A FILTER AND A SCATTERING STRUCTURE - A semiconductor structure comprises a light emitting layer disposed between an n-type region and a p-type region. A wavelength converting material is disposed over the semiconductor structure. The wavelength converting material is configured to absorb light emitted by the semiconductor structure and emit light of a different wavelength. A filter configured to reflect blue ambient light is disposed over the wavelength converting material. A scattering structure is disposed over the wavelength converting layer. The scattering structure is configured to scatter light. In some embodiments, the scattering structure is a transparent material having a rough surface, containing non-wavelength-converting particles that appear substantially white in ambient light, or including both a rough surface and white particles. | 01-20-2011 |
20110012148 | LIGHTING DEVICE WITH LIGHT SOURCES POSITIONED NEAR THE BOTTOM SURFACE OF A WAVEGUIDE - A device according to embodiments of the invention includes a waveguide, typically formed from a first section of transparent material. A light source is disposed proximate a bottom surface of the waveguide. The light source comprises a semiconductor light emitting diode and a second section of transparent material disposed between the semiconductor light emitting diode and the waveguide. Sidewalls of the second section of transparent material are reflective. A surface to be illuminated is disposed proximate a top surface of the waveguide. In some embodiments, an edge of the waveguide is curved. | 01-20-2011 |
20110018016 | REDUCED COLOR OVER ANGLE VARIATION LEDS - A light emitting diode (LED) package includes an LED die includes a stack of semiconductor layers including an active region, and a wavelength converting element over the LED die. The wavelength converting element includes two or more non-flat surfaces that produce a desired angular color distribution pattern. | 01-27-2011 |
20110018017 | LED WITH MOLDED REFLECTIVE SIDEWALL COATING - A submount wafer, having mounted on it an array of LEDs with a phosphor layer, is positioned with respect to a mold having an array of indentions. A mixture of silicone and 10%-50%, by weight, TiO | 01-27-2011 |
20110062470 | REDUCED ANGULAR EMISSION CONE ILLUMINATION LEDS - A light emitting diode (LED) package includes a support, an LED die mounted on the support, a reflector around the LED die, and a lens over the LED die. The reflector has an angled reflective surface that limits the light emission angle from the LED package. The reflector is a part of the lens or the support. | 03-17-2011 |
20110062471 | LED MODULE WITH HIGH INDEX LENS - An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules. | 03-17-2011 |
20110233580 | CARRIER FOR A LIGHT EMITTING DEVICE - A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier. | 09-29-2011 |
20110260178 | LIGHTING SYSTEM INCLUDING COLLIMATORS ALIGNED WITH LIGHT EMITTING SEGMENTS - A light source comprising a semiconductor light emitting device is connected to a mount. The light emitting device comprises a plurality of segments with neighboring segments spaced less than 200 microns apart. In some embodiments, multiple segments are grown on a single growth substrate. Each segment comprises a light emitting layer disposed between an n-type region and a p-type region. A spacer is positioned on a top surface of the mount. The light emitting device is positioned in an opening in the spacer. A plurality of collimators is attached to the spacer, wherein each collimator is aligned with a single segment. | 10-27-2011 |
20130062651 | CARRIER FOR A LIGHT EMITTING DEVICE - A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier. | 03-14-2013 |
20140191254 | HYBRID COMBINATION OF SUBSTRATE AND CARRIER MOUNTED LIGHT EMITTING DEVICES - A multi-chip light emitting device (LED) uses a low-cost carrier structure that facilitates the use of substrates that are optimized to support the devices that require a substrate. Depending upon the type of LED elements used, some of the LED elements may be mounted on the carrier structure, rather than on the more expensive ceramic substrate. In like manner, other devices, such as sensors and control elements, may be mounted on the carrier structure as well. Because the carrier and substrate structures are formed independent of the encapsulation and other after-formation processes, these structures can be tested prior to encapsulation, thereby avoiding the cost of these processes being applied to inoperative structures. | 07-10-2014 |