Patent application number | Description | Published |
20090090543 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode. | 04-09-2009 |
20100089982 | MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD - A member having a coating film capable of suppressing whisker generation is provided. The coating film ( | 04-15-2010 |
20100170804 | Plating film and forming method thereof - Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper: 2 mass %), tin-bismuth alloy (content of bismuth: 2 mass %) and the like can be cited. The substrate is composed of, for example, Cu alloy or the like. Within the tin plating film, plural crystal grains are arranged irregularly. Further, plural gap portions exist within the tin plating film. An external stress is reduced even if a bending process or the like are performed subsequently, because the gap portions exist within the tin plating film. Consequently, growths of whiskers accompanied by the external stress are suppressed. | 07-08-2010 |
20100218853 | SOLDERING FLUX AND METHOD FOR BONDING SEMICONDUCTOR ELEMENT - The method for bonding a semiconductor element comprises the step of applying to solder bumps | 09-02-2010 |
20100270362 | COMPOSITION - A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component. | 10-28-2010 |
20100315796 | CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal. | 12-16-2010 |
20110031002 | PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION - A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction. | 02-10-2011 |
20110163261 | COMPOSITION - A composition for controlling a temperature elevation of an electronic component when soldering the electronic component on a substrate, includes a first resin for providing the composition with adhesion to the electronic component, a curing agent for curing the first resin by heat treatment for soldering, and a second resin for facilitating removal of the composition from the electronic component. | 07-07-2011 |
20110220398 | METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component. | 09-15-2011 |
20110244133 | MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD - A member having a coating film capable of suppressing whisker generation is provided. The coating film ( | 10-06-2011 |
20110244261 | MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, COATING FILM FORMING METHOD AND SOLDERING METHOD - A member having a coating film capable of suppressing whisker generation is provided. The coating film ( | 10-06-2011 |
20120193800 | SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE - A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight. | 08-02-2012 |
20140008114 | METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component. | 01-09-2014 |
20140103097 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode. | 04-17-2014 |
20140140030 | CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal. | 05-22-2014 |