Patent application number | Description | Published |
20100018748 | Solar cell lead wire and method of manufacturing the same - A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling. | 01-28-2010 |
20100230069 | Method of making copper wire rod with low semi-softening temperature, method of making copper wire and copper wire - A method of making a copper wire rod with low semi-softening temperature includes melting a raw material copper to have a copper melt, adjusting concentrations of oxygen and sulfur included in the copper melt to be not more than 20 ppm and not more than 6 ppm, respectively, continuously casting the adjusted copper melt at temperature not higher than 1120° C. to have a cast bar, and hot-rolling the cast bar in a temperature range of 850° C. to 550° C. | 09-16-2010 |
20100263905 | DILUTE COPPER ALLOY MATERIAL, DILUTE COPPER ALLOY WIRE, DILUTE COPPER ALLOY TWISTED WIRE AND CABLE USING THE SAME, COAXIAL CABLE AND COMPOSITE CABLE, AND METHOD OF MANUFACTURING DILUTE COPPER ALLOY MATERIAL AND DILUTE COPPER ALLOY WIRE - A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance consisting of pure copper and an inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO | 10-21-2010 |
20120097420 | Audio/video cable - An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 μm toward inside of the soft dilute copper alloy material is not more than 20 μm. | 04-26-2012 |
20120097422 | FLEXIBLE FLAT CABLE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-% or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films. | 04-26-2012 |
20120097904 | Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement - A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100° C. and not more than 1320° C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar. | 04-26-2012 |
20120100390 | Weldment and method of manufacturing the same - A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element, | 04-26-2012 |
20120305286 | SOFT-DILUTE-COPPER-ALLOY MATERIAL, SOFT-DILUTE-COPPER-ALLOY WIRE, SOFT-DILUTE-COPPER-ALLOY SHEET, SOFT-DILUTE-COPPER-ALLOY STRANDED WIRE, AND CABLE, COAXIAL CABLE AND COMPOSITE CABLE USING SAME - Provided are a soft dilute copper alloy material, a soft dilute copper alloy wire, a soft dilute copper alloy sheet, a soft dilute copper alloy stranded wire, and a cable, a coaxial cable and a composite cable using same. The disclosed soft-3dilute-copper-alloy material contains: copper; at least one additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr; and inevitable impurities as the remainder. The soft dilute copper alloy material is characterized in that the average grain size is at most 20 μm in the surface layer up to a depth of 50 μm from the surface. | 12-06-2012 |
20130022831 | SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE - A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm. | 01-24-2013 |
20130042949 | METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL - A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%. | 02-21-2013 |
20140000932 | SOFT DILUTE-COPPER ALLOY WIRE, SOFT DILUTE-COPPER ALLOY TWISTED WIRE, AND INSULATED WIRE, COAXIAL CABLE, AND COMPOSITE CABLE USING THESE | 01-02-2014 |
20140202730 | SOFT DILUTE-COPPER ALLOY INSULATED TWISTED WIRE AND COIL - A soft dilute-copper alloy insulated twisted wire includes a plurality of insulated wires twisted together and each including a conductor and an insulating cover layer thereon. The conductor includes a soft dilute-copper alloy wire including a soft dilute-copper alloy material including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr with a balance consisting a copper and an inevitable impurity. An average crystal grain size in a region from a surface of the soft dilute-copper alloy wire to a depth of at least 20% of a wire diameter is not more than 20 μm. | 07-24-2014 |
20140205491 | COPPER ALLOY MATERIAL - A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5. | 07-24-2014 |
20140209349 | HIGH-SPEED TRANSMISSION CABLE CONDUCTOR, AND PRODUCING METHOD THEREOF, AND HIGH-SPEED TRANSMISSION CABLE - A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen. | 07-31-2014 |
20140302342 | COPPER WIRE AND METHOD OF MANUFACTURING THE SAME - A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first crystal including a [111] crystal orientation and at least one twin crystal therein, and a second crystal that includes one or more crystals adjacent to the first crystal, a [111] crystal orientation with a different rotation angle on an atomic plane from the first crystal, and at least one twin crystal therein. | 10-09-2014 |
20140318827 | Audio/Video Cable - An audio/video cable includes an insulated layer including a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti. | 10-30-2014 |