Patent application number | Description | Published |
20140361279 | ORGANIC LIGHT-EMITTING DIODE - In at least one embodiment, the organic light-emitting diode ( | 12-11-2014 |
20140367666 | ORGANIC LIGHT-EMITTING DIODE, CONNECTOR AND LUMINAIRE - An organic light-emitting diode has a carrier substrate. The light-emitting diode also contains an active layer that generates and emits electromagnetic radiation at a carrier front face. The active layer is mounted on the carrier substrate. At least one contacting device is located on a carrier rear face and is arranged simultaneously for electrical contacting and for mechanical attachment of the light-emitting diode. The contacting device includes a contact region. The contact region and/or the contacting device, seen in a side view parallel to the carrier rear face, are elevated in a U-shape or L-shape above the carrier rear face and/or extend in a lateral direction away from the active layer. | 12-18-2014 |
20140374729 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT - Various embodiments relate to a method for producing an optoelectronic component includes applying a planarization medium to a surface of a substrate, wherein the planarization medium comprises a material which absorbs electromagnetic radiation having wavelengths of a maximum of 600 nm, applying a first electrode on or above the material, forming an organic functional layer structure on or above the first electrode, and forming a second electrode on or above the organic functional layer structure. | 12-25-2014 |
20150091435 | Organic Light-Emitting Diode and Device Comprising an Organic Light-Emitting Diode - In at least one embodiment, a light-emitting diode includes a carrier and an organic layer sequence with an active layer. A mirror layer and electrical contact regions are located on a connection side of the carrier. The contact regions are provided for electrically contacting the organic layer sequence. Electrical dummy regions are located on the connection side. The dummy regions are electrically insulated from the contact regions. The mirror layer is present in the dummy regions and in the contact regions. At least two of the dummy regions are arranged in such a way that base areas of these dummy regions cannot be congruently superimposed merely by arbitrary rotation of the carrier relative to a center axis of the carrier perpendicular to the connection side. | 04-02-2015 |
20150099313 | METHOD AND DEVICE FOR PRODUCING A PLURALITY OPTOELECTRONIC ELEMENTS - A method for producing a plurality of optoelectronic components may include measuring at least one measurement parameter for a first optoelectronic component and a second optoelectronic component, and processing the first optoelectronic component and the second optoelectronic component taking account of the measured measurement parameter value of the first optoelectronic component and the measured measurement parameter value of the second optoelectronic component, such that the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component are changed in a different way toward at least one common predefined optoelectronic target property. The processing of at least one value of a measurement parameter of the optoelectronic properties of the first optoelectronic component or of the optoelectronic properties of the second optoelectronic component toward the optoelectronic target property is formed by means of a compensation element. The compensation element is formed as a film. | 04-09-2015 |
20150108445 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT - An electronic component may include an electrically active region, having a first contact pad, a second contact pad, an organic functional layer structure between the first contact pad and the second contact pad, at least one electrical terminal which is coupled to the first contact pad or to the second contact pad. The first contact pad and/or the second contact pad may include an encapsulation and an electrically conductive region. The encapsulation partly covers the electrically conductive region in such a way that a part of the first contact pad or of the second contact pad is exposed. The exposed region is completely laterally surrounded by encapsulation. | 04-23-2015 |
20150115237 | LIGHT-EMITTING COMPONENT ARRANGEMENT - A light-emitting component arrangement may include at least one flexible printed circuit board, at least one light-emitting component coupled to the flexible printed circuit board, at least one electromechanical connecting part, wherein the connecting part is mechanically fixed to the flexible printed circuit board and is electrically coupled to the light-emitting component, and wherein the connecting part has an electromechanical connection for mechanically and electrically connecting a connecting element which is external to the printed circuit board. | 04-30-2015 |
20150211718 | FLEXIBLE PRINTED CIRCUIT BOARD FOR ELECTRICALLY CONTACTING AND MECHANICALLY FIXING A LAMP IN A LUMINAIRE - A printed circuit board which at least in sections is formed as a flexible printed circuit board may include: a first flat side at least one conductor track extending on the first flat side, and an electrically insulating cover layer partially coating the first flat side, wherein the at least one conductor track has an exposed contact section, for electrical contacting of the conductor track, wherein a through-hole, which extends fully through the printed circuit board in the thickness direction of the printed circuit board, and is formed in the printed circuit board, and wherein the exposed contact section of the conductor track is arranged next to the through-hole so that a mechanical fastening means, which has a shaft and a head, can be fitted with its shaft into the through-hole, the head directly contacting the exposed contact section. | 07-30-2015 |
20150228923 | Optoelectronic component and method for producing an optoelectronic component - Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component. | 08-13-2015 |
20150236294 | Organic optoelectronic component, method for producing an organic optoelectronic component and method for cohesive electrical contacting - An organic optoelectronic component may include at least one contact pad with a first electrical contact region and a second electrical contact region. The first electrical contact region and the second electrical contact region are electrically connected to the contact pad. The second electrical contact region is designed in such a way that it has a higher adhesion than the first electrical contact region in respect of a cohesive connection means with the contact pad. The contact pad is designed in such a way that the first electrical contact region is free of cohesive connection means. | 08-20-2015 |
20150263284 | METHOD FOR CLOSELY CONNECTING AN ORGANIC OPTOELECTRONIC COMPONENT TO A CONNECTION PIECE, CONNECTION STRUCTURE FOR FORCE-LOCKING CONNECTING, AND OPTOELECTRONIC COMPONENT DEVICE - Various embodiments relate to a method for closely connecting an organic optoelectronic component to a connection piece, including forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least a first opening, introducing a connecting structure through the first opening into the first cavity, wherein the connecting structure has a first fixing area, wherein the first fixing area is configured partially complementarily to the form of the first cavity, forming a second cavity in a connection piece, wherein the second cavity has at least a second opening, wherein the second cavity is configured partially complementarily to the form of the second fixing area, and introducing a second fixing area through the second opening into the second cavity, and forming a friction-fitting connection of the organic optoelectronic component with the connecting piece once the connecting structure has been introduced into the first and the second cavity. | 09-17-2015 |
20150318430 | Organic Optoelectronic Component with Infrared Detector - An organic optoelectronic component includes a substrate, an organic light-emitting element which has an organic light-emitting layer between two electrodes, and an organic radiation-detecting element which has an organic radiation-detecting layer. The organic light-emitting element and the organic radiation-detecting element are arranged on the substrate. The organic light-emitting element is designed to emit visible light during operation and the organic radiation-detecting element is designed to detect infrared radiation during operation. | 11-05-2015 |
20150349027 | Organic Optoelectronic Component - An organic optoelectronic component includes a substrate embodied in a light-transmissive fashion, an organic light-emitting element having an organic light-emitting layer between two electrodes, and an organic light-detecting element having an organic light-detecting layer. The organic light-emitting element and the organic light-detecting element are arranged on the substrate. Part of the light generated by the organic light-emitting element during operation enters into the substrate, emerges from the substrate and is detected by the organic light-detecting element. | 12-03-2015 |