Sang Yul
Sang Yul Kim, Aanyang-Si KR
Patent application number | Description | Published |
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20150072552 | MULTI-OUTLET CAPABLE OF CONVENIENTLY ORGANIZING CABLES CONNECTED TO ELECTRIC APPLIANCES - Provided is a multi-outlet capable of conveniently organizing cables connected to electric appliances. The provided multi-outlet capable of conveniently organizing cables connected to electric appliances comprises: a plug housing comprising an upwardly opened housing space formed inside for accommodating cables and plugs of electric appliances, downwardly opened cable entry roads formed at a lower portion, inducing holes formed on the bottom for connecting the housing space and the entry roads, and curved arc-shaped apertures formed at the upper ends; a finishing cover insertedly connected to the upper end of the plug housing for finishing the housing space, and having a cable winding drum projected at a lower portion; and a power connection portion embedded in the finishing cover so as to supply electric power to the electric appliances, and comprising a plurality of plug terminals for power supply at all times which is opened toward the housing space to be electrically connected to the plugs accommodated in the housing space, and a plug terminal for power supply at any time which is opened outwardly, individual switches formed at the plug terminals for power supply at all times for controlling the power supplied thereto, a power input cable formed at the outside of the cable winding drum so as to be electrically connected to the terminals for supplying external power, and a main switch formed at the upper portion of the finishing cover to be connected to the power input cable for controlling the power supplied therethrough. It is possible to make the surroundings of a multi-output be neat and improve user convenience. | 03-12-2015 |
Sang Yul Lee, Busan KR
Patent application number | Description | Published |
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20120153473 | LEAD PIN FOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin. | 06-21-2012 |
Sang Yul Park, Seoul KR
Patent application number | Description | Published |
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20150072092 | MICROCAPSULAR QUANTUM DOT-POLYMER COMPOSITE, METHOD FOR PRODUCING THE COMPOSITE, OPTICAL ELEMENTS, AND METHOD FOR PRODUCING THE OPTICAL ELEMENTS - There are provided a microcapsular quantum dot-polymer composite, a method for producing the composite, optical elements, and a method for producing the optical elements. In order to produce the microcapsular quantum dot-polymer composite, a polymer having a functional group in the side chain is firstly heated in a first solvent to form a polymer solution. A quantum dot suspension consisting of quantum dots capped by a capping layer dispersed in a second solvent is added to the polymer solution to form a mixed solution. The mixed solution is cooled to form the quantum dot-polymer composite consisting of the quantum dots dispersed in the polymer matrix. | 03-12-2015 |