Patent application number | Description | Published |
20090121729 | System and Method for Current Measurement - Load current of a circuit is determined across a component of the circuit by calibrating the resistance of the component with a reference current having a distinguishable characteristic. For example, a reference current with swept frequency modulation is applied to the component so that the resistance of the component is determined from voltage drop associated with the reference current across the component. The component resistance is applied to a voltage drop associated with the load current to determine the load current. For example, a filter matched to the reference current frequency modulation isolates the reference current voltage drop so that a ratio of the reference current voltage drop and the load current voltage drop provides a ratio of the reference current and load current. | 05-14-2009 |
20100097019 | System and Method for Providing Cooling Fan Characteristic Feedback - A device comprising a fan controller, an encoder, a driver, a resistor/capacitor filter, and a baseboard management controller. The fan controller is configured to output a cooling fan status signal, and to output a cooling fan information data signal. The encoder is configured to encode the cooling fan status signal and the cooling fan information data signal together into a combined signal. The driver is configured to invert the combined signal and to output an inverted signal. The resistor/capacitor filter is configured to filter out the cooling fan information data signal from the inverted signal, and to output a filtered signal. The baseboard management controller is configured to determine a status of a cooling fan in response to the filtered signal, and to output a control signal to the fan controller module for the cooling fan based on the cooling fan information data signal within the inverted signal. | 04-22-2010 |
20140108692 | System and Method for Integrating Multiple Servers into Single Full Height Bay of a Server Rack Chassis - An information handling system includes a server rack chassis, an adaptor assembly, and second and third servers. The server rack chassis includes a bay adapted to receive a first server that has a height that is substantially equal to a height of the bay. The adaptor assembly is inserted within the bay and includes first, second, third, and fourth slots to receive servers. The adaptor assembly is substantially the same size and dimension as the first server. The second server is inserted within the first slot of the adaptor assembly, and includes a first communication fabric. The height of the second server is substantially equal to a quarter of the height of the bay. The third server is inserted within the second slot of the adaptor assembly, and includes a second communication fabric. The height of the third server is substantially equal to a quarter of the height of the bay. | 04-17-2014 |
20140233165 | FLEX CIRCUIT - A flex circuit including a plurality of layers folded on a first fold line and folded on a second fold line is disclosed. The plurality of layers may include a first conductive layer, an insulating layer adjacent the first conductive layer, and a second conductive layer adjacent the insulating layer. The flex circuit may include a plurality of slits extending through each layer of the plurality of layers, the plurality of slits disposed on the first fold line and the second fold line. | 08-21-2014 |
20140238733 | SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD - In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location. | 08-28-2014 |
20140326489 | SYSTEMS AND METHODS FOR DECREASING STUB RESONANCE OF PLATING FOR CIRCUIT BOARDS - In accordance with embodiments of the present disclosure, a circuit board may include a stub corresponding to a portion of a trace running proximate to an edge of the circuit board, wherein the stub is configured to electrically couple to a plating bar for plating electrical paths of the circuit board with a conductive metal and a termination pad electrically coupled to the stub and configured to electrically couple to a termination resistor for resistively terminating the stub. | 11-06-2014 |
20140340784 | Preventing Damage to Storage Devices within a Storage System Due to Movement of the Storage System - A method implemented in a storage system that has moveable storage devices includes a motion controller receiving movement related data of a storage device from at least one sensor associated with the storage device. The method further includes determining if the received movement related data indicates presence of at least one pre-identified movement related condition that can result in damage to the storage device. In response to the received movement related data indicating at least one pre-identified condition, a park command is issued that triggers the reading head of the storage device to enter a parked state in which the storage device is protected from damage that can occur due to motion of the reading head while the pre-identified condition exists. | 11-20-2014 |
20150195910 | BALL GRID ARRAY SYSTEM - Systems and methods for providing a ball grid array connection include providing a circuit board having a circuit board surface including a plurality of pads. A ball grid array component includes a plurality of solder balls. The ball grid array component is coupled to the circuit board to position each of the plurality of solder balls adjacent a respective one of the plurality of pads. A solder reflow process is then performed to produce a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads. At least one spacer member is provided between the ball grid array component and the circuit board during the solder reflow process to provide a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections. | 07-09-2015 |