Patent application number | Description | Published |
20090091346 | CIRCUITS AND METHODS FOR CHARACTERIZING DEVICE VARIATION IN ELECTRONIC MEMORY CIRCUITS - A circuit includes a comparator circuit configured such that its output toggles from a first digital logical level to a second digital logical level when its first and second inputs transition between a first state wherein the first input has an applied voltage greater than an applied voltage at the second input and a second state wherein the first input has an applied voltage less than an applied voltage at the second input. A plurality of cells each have at least one series-connected pair of field effect transistors interconnected at an output node intermediate the field effect transistors. Decoding logic is configured to select a given one of the cells for measurement, and selectively interconnect the output node of the given one of the cells to the first input of the comparator circuit. Voltage supply circuitry is configured to (i) apply voltages to the gates of the pair of transistors of the given one of the cells selected for measurement, such that the pair of transistors operate in a linear region, and have a variable voltage difference, Δ, between their gate-to-source voltages, and (ii) vary the Δ until the comparator circuit output toggles from the first digital logical level to the second digital logical level. | 04-09-2009 |
20090189703 | CIRCUITS AND DESIGN STRUCTURES FOR MONITORING NBTI (NEGATIVE BIAS TEMPERATURE INSTABILITY) EFFECT AND/OR PBTI (POSITIVE BIAS TEMPERATURE INSTABILITY) EFFECT - A ring oscillator has an odd number of NOR-gates greater than or equal to three, each with first and second input terminals, a voltage supply terminal, and an output terminal. The first input terminals of all the NOR-gates are interconnected, and each of the NOR-gates has its output terminal connected to the second input terminal of an immediately adjacent one of the NOR-gates. During a stress mode, a voltage supply and control block applies a stress enable signal to the interconnected first input terminals, and an increased supply voltage to the voltage supply terminals. During a measurement mode, this block grounds the interconnected first input terminals, and applies a normal supply voltage to the voltage supply terminals. Also included are an analogous NAND-gate based circuit, a circuit combining the NAND- and NOR-aspects, a circuit with a ring oscillator where the inverters may be coupled directly or through inverting paths, and circuits for measuring the bias temperature instability effect in pass gates. | 07-30-2009 |
20090190426 | CIRCUITS, METHODS AND DESIGN STRUCTURES FOR ADAPTIVE REPAIR OF SRAM ARRAYS - The circuit includes a static random access memory array having a plurality of cells, in turn having a plurality of devices; as well as a global sensor having at least one output, coupled to the static random access memory array, and configured to sense at least one of global readability and global write-ability. Also included is a decision-making circuit coupled to the at least one output of the global sensor. The decision-making circuit is configured to determine, from the at least one output of the global sensor, whether adaptation signals are required to correct global readability and/or write-ability. An adaptation signal generation block is also included and is coupled to the decision-making circuit and the array, and configured to supply the adaptation signals to the array, responsive to the decision-making circuit determining that the adaptation signals are required. At least the array and the global sensor, and preferably the decision-making circuit and the adaptation signal generation block as well, are implemented on a single integrated circuit chip. An associated method and design structure(s) are also provided. | 07-30-2009 |
20090310430 | METHODS FOR CHARACTERIZING DEVICE VARIATION IN ELECTRONIC MEMORY CIRCUITS - A circuit includes a comparator circuit configured such that its output toggles from a first digital logical level to a second digital logical level when its first and second inputs transition between a first state wherein the first input has an applied voltage greater than an applied voltage at the second input and a second state wherein the first input has an applied voltage less than an applied voltage at the second input. A plurality of cells each have at least one series-connected pair of field effect transistors interconnected at an output node intermediate the field effect transistors. Decoding logic is configured to select a given one of the cells for measurement, and selectively interconnect the output node of the given one of the cells to the first input of the comparator circuit. Voltage supply circuitry is configured to (i) apply voltages to the gates of the pair of transistors of the given one of the cells selected for measurement, such that the pair of transistors operate in a linear region, and have a variable voltage difference, Δ, between their gate-to-source voltages, and (ii) vary the Δ until the comparator circuit output toggles from the first digital logical level to the second digital logical level. | 12-17-2009 |
20100269079 | Analyzing Multiple Induced Systematic and Statistical Layout Dependent Effects On Circuit Performance - A method for implementing systematic, variation-aware integrated circuit extraction includes inputting a set of processing conditions to a plurality of variation models, each model corresponding to a separate systematic, parametric variation associated with semiconductor manufacturing of an integrated circuit layout; generating, for each variation model, a netlist update attributable to the associated variation, wherein the netlist update is an update with respect to an original netlist extracted from the integrated circuit layout; and storing the netlist updates generated for each of the processing conditions. | 10-21-2010 |
20110173577 | Techniques for Pattern Process Tuning and Design Optimization for Maximizing Process-Sensitive Circuit Yields - Techniques for improving circuit design and production are provided. In one aspect, a method for virtual fabrication of a process-sensitive circuit is provided. The method comprises the following steps. Based on a physical layout diagram of the circuit, a virtual representation of the fabricated circuit is obtained that accounts for one or more variations that can occur during a circuit production process. A quality-based metric is used to project a production yield for the virtual representation of the fabricated circuit. The physical layout diagram and/or the production process are modified. The obtaining, using and modifying steps are repeated until a desired projected production yield is attained. | 07-14-2011 |
20120144356 | ANALYZING MULTIPLE INDUCED SYSTEMATIC AND STATISTICAL LAYOUT DEPENDENT EFFECTS ON CIRCUIT PERFORMANCE - A method for implementing systematic, variation-aware integrated circuit extraction includes inputting a set of processing conditions to a plurality of variation models, each model corresponding to a separate systematic, parametric variation associated with semiconductor manufacturing of an integrated circuit layout; generating, for each variation model, a netlist update attributable to the associated variation, wherein the netlist update is an update with respect to an original netlist extracted from the integrated circuit layout; and storing the netlist updates generated for each of the processing conditions. | 06-07-2012 |
20130185045 | ANALYZING A PATTERNING PROCESS USING A MODEL OF YIELD - Techniques are presented that include accessing results of forward simulations of circuit yield, the results including at least circuit yield results including simulated device shapes. Using the circuit yield results, high-level traits of at least the simulated device shapes are determined. Based on the determined high-level traits and using the circuit yield results, a compact model for predicted yield is constructed, the compact model including a plurality of adjustable parameters, and the constructing the compact model for predicted yield including adjusting the adjustable parameters until at least one first predetermined criterion is met. An optimization problem is constructed including at least the compact model for yield, an objective, and a plurality of constraints. Using the optimization problem, the objective is modified subject to the plurality of constraints until at least one second predetermined criterion is met. | 07-18-2013 |
20130185046 | Analyzing A Patterning Process Using A Model Of Yield - Techniques are presented that include accessing results of forward simulations of circuit yield, the results including at least circuit yield results including simulated device shapes. Using the circuit yield results, high-level traits of at least the simulated device shapes are determined. Based on the determined high-level traits and using the circuit yield results, a compact model for predicted yield is constructed, the compact model including a plurality of adjustable parameters, and the constructing the compact model for predicted yield including adjusting the adjustable parameters until at least one first predetermined criterion is met. An optimization problem is constructed including at least the compact model for yield, an objective, and a plurality of constraints. Using the optimization problem, the objective is modified subject to the plurality of constraints until at least one second predetermined criterion is met. | 07-18-2013 |