Patent application number | Description | Published |
20090107835 | Rapidly Cleanable Electroplating Cup Assembly - Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom. | 04-30-2009 |
20090107836 | Closed Contact Electroplating Cup Assembly - Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup. | 04-30-2009 |
20090211900 | Convenient Replacement of Anode in Semiconductor Electroplating Apparatus - The convenient replacement of an anode in a semiconductor electroplating apparatus is disclosed. For example, in one disclosed embodiment, an electroplating system comprises an electroplating cell having an anode chamber, a cathode chamber, a selective transport barrier separating the anode chamber and the cathode chamber, and an anode disposed within the anode chamber. The anode comprises a plurality of pieces of anode material disposed within a removable anode holder. | 08-27-2009 |
20100147679 | Electroplating Apparatus with Vented Electrolyte Manifold - Embodiments related to increasing a uniformity of an electroplated film are disclosed. For example, one disclosed embodiment provides an electroplating apparatus comprising a plating chamber, a work piece holder, a cathode contact configured to electrically contact a work piece, and an anode contact configured to electrically contact an anode disposed in the plating chamber. A diffusing barrier is disposed between the cathode contact and the anode contact to provide a uniform electrolyte flow to the work piece, and electrolyte delivery and return paths are provided for delivering electrolyte to and away from the plating chamber. Additionally, a vented electrolyte manifold is disposed in the electrolyte delivery path immediately upstream of the plating chamber, the vented electrolyte manifold comprising one or more electrolyte delivery openings that open to the plating chamber and one or more vents that open to a location other than the plating chamber. | 06-17-2010 |
20100155254 | WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS - Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings. | 06-24-2010 |
20110181000 | RAPIDLY CLEANABLE ELECTROPLATING CUP SEAL - Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom. | 07-28-2011 |
20110226613 | ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM - An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber. | 09-22-2011 |
20110226614 | ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM - An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber. | 09-22-2011 |
20110233056 | ELECTROPLATING CUP ASSEMBLY - Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup. | 09-29-2011 |
20120181170 | WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS - Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings. | 07-19-2012 |
20120258408 | ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE - Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area. | 10-11-2012 |
20130171833 | METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST METAL PLATING - Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute. | 07-04-2013 |
20130292254 | METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS - Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle. | 11-07-2013 |
20130313123 | CROSS FLOW MANIFOLD FOR ELECTROPLATING APPARATUS - The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity. | 11-28-2013 |
20140131211 | ELECTROLYTE LOOP WITH PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM - An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber. | 05-15-2014 |
20140166476 | BUBBLE AND FOAM SOLUTIONS USING A COMPLETELY IMMERSED AIR-FREE FEEDBACK FLOW CONTROL VALVE - The embodiments disclosed herein relate to methods and apparatus for promoting bubble-free circulation of processing fluids in a recirculation system. Certain disclosed techniques involve passive, mechanical valve designs that promote variable resistance to flow in a drain. Other techniques involve automated flow control schemes that utilize feedback from flow meters, level sensors, etc. to achieve a balanced and bubble-free flow. The disclosed embodiments greatly reduce the incorporation of gas into a processing fluid, in particular as the processing fluid returns from a processing cell to a reservoir. | 06-19-2014 |
20140183049 | ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING - The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity. | 07-03-2014 |
20140299477 | CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DURING ELECTROPLATING - Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for plating highly uniform metal layers. In specific embodiments, the apparatus includes a flow-shaping element made of an ionically resistive material and having a plurality of channels made through the flow shaping element. The channels allow for transport of the electrolyte through the flow shaping element during electroplating. The channel openings are arranged in a spiral-like pattern on the substrate-facing surface of the flow shaping element such that the center of the spiral-like pattern is offset from the center of the flow shaping element. | 10-09-2014 |
20150060291 | ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE - Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area. | 03-05-2015 |
20150096883 | APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING - Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer. | 04-09-2015 |
Patent application number | Description | Published |
20140214752 | DATA STREAM SPLITTING FOR LOW-LATENCY DATA ACCESS - Techniques for facilitating and accelerating log data processing by splitting data streams are disclosed herein. The front-end clusters generate large amount of log data in real time and transfer the log data to an aggregating cluster. The aggregating cluster is designed to aggregate incoming log data streams from different front-end servers and clusters. The aggregating cluster further splits the log data into a plurality of data streams so that the data streams are sent to a receiving application in parallel. In one embodiment, the log data are randomly split to ensure the log data are evenly distributed in the split data streams. In another embodiment, the application that receives the split data streams determines how to split the log data. | 07-31-2014 |
20140215007 | MULTI-LEVEL DATA STAGING FOR LOW LATENCY DATA ACCESS - Techniques for facilitating and accelerating log data processing are disclosed herein. The front-end clusters generate a large amount of log data in real time and transfer the log data to an aggregating cluster. When the aggregating cluster is not available, the front-clusters write the log data to local filers and send the data when the aggregating cluster recovers. The aggregating cluster is designed to aggregate incoming log data streams from different front-end servers and clusters. The aggregating cluster further sends the aggregated log data stream to centralized NFS filers or a data warehouse cluster. The local filers and the aggregating cluster stage the log data for access by applications, so that the applications do not wait until the data reach the centralized NFS filers or data warehouse cluster. | 07-31-2014 |
20140280126 | CACHING SLIDING WINDOW DATA - Disclosed are methods, systems, paradigms and structures for caching data associated with a sliding window in computer systems. A sliding window can include a time window that progresses with time, and the data can include time series data. As time progresses, the sliding window changes bringing in new data. The cache is updated with new data as and when the sliding window moves. The sliding window data is cached at various granularity levels. The method includes storing a first portion of the data at a first granularity level and a second portion at a second granularity level. The data is cached at various granularity levels in order to effectively use the cache considering at least cache updating criteria such as (i) number of times a storage unit is queried to retrieve the data for updating the cache, (ii) the day/date/time at which the storage unit is queried. | 09-18-2014 |
20140310470 | INTELLIGENT CACHING - Disclosed are methods, systems, paradigms and structures for managing cache memory in computer systems. Certain caching techniques anticipate queries and caches the data that may be required by the anticipated queries. The queries are predicted based on previously executed queries. The features of the previously executed queries are extracted and correlated to identify a usage pattern of the features. The prediction model predicts queries based on the identified usage pattern of the features. The disclosed method includes purging data from the cache based on predefined eviction policies that are influenced by the predicted queries. The disclosed method supports caching time series data. The disclosed system includes a storage unit that stores previously executed queries and features of the queries. | 10-16-2014 |
20140317140 | QUERY PREDICTION - Disclosed here are methods, systems, paradigms and structures for predicting queries, creating tables to store data for the predicted queries, and selecting a particular table to obtain the data from in response to a query. The methods include determining various combinations of a finite set of columns users may query on, based on (i) a list of columns users are interested in obtaining data for, and (ii) cardinality information of a column or combinations of columns in the list of columns. The methods further includes creating various tables based on the determined combinations of the columns using a meta query language. A query is responded to by selecting a table that has least number of rows, among the tables that satisfy query parameters. The methods include selecting a table that has a longest sequence of columns matching with a portion of the query parameters. | 10-23-2014 |
20140317448 | INCREMENTAL CHECKPOINTS - A method and system on failure recovery in a storage system are disclosed. In the storage system, user data streams (e.g., log data) are collected by a scribeh system. The scribeh system may include a plurality of Calligraphus servers, HDFS and Zookeeper. The Calligraphus servers may shard the user data streams based on keys (e.g., category and bucket pairs) and stream the user data streams to Puma nodes. Sharded user data streams may be aggregated according to the keys in memory of a specific Puma node. Periodically, aggregated user data streams cached in memory of the specific Puma node, together with a Incremental checkpoint, are persisted to HBase. When a specific process on the specific Puma node fails, Ptail retrieves the Incremental checkpoint from HBase and then restores the specific process by requesting user data streams processed by the specific process from the scribeh system according to the Incremental checkpoint. | 10-23-2014 |
Patent application number | Description | Published |
20140281196 | PROCESSORS, METHODS, AND SYSTEMS TO RELAX SYNCHRONIZATION OF ACCESSES TO SHARED MEMORY - A processor of an aspect includes a plurality of logical processors. A first logical processor of the plurality is to execute software that includes a memory access synchronization instruction that is to synchronize accesses to a memory. The processor also includes memory access synchronization relaxation logic that is to prevent the memory access synchronization instruction from synchronizing accesses to the memory when the processor is in a relaxed memory access synchronization mode. | 09-18-2014 |
20140281236 | SYSTEMS AND METHODS FOR IMPLEMENTING TRANSACTIONAL MEMORY - Systems and methods for implementing transactional memory access. An example method may comprise initiating a memory access transaction; executing a transactional read operation, using a first buffer associated with a memory access tracking logic, with respect to a first memory location, and/or a transactional write operation, using a second buffer associated with the memory access tracking logic, with respect to a second memory location; executing a non-transactional read operation with respect to a third memory location, and/or a non-transactional write operation with respect to a fourth memory location; responsive to detecting, by the memory access tracking logic, access by a device other than the processor to the first memory location or the second memory location, aborting the memory access transaction; and completing, irrespectively of the state of the third memory location and the fourth memory location, the memory access transaction responsive to failing to detect a transaction aborting condition. | 09-18-2014 |
20140281398 | INSTRUCTION EMULATION PROCESSORS, METHODS, AND SYSTEMS - A processor of an aspect includes decode logic to receive a first instruction and to determine that the first instruction is to be emulated. The processor also includes emulation mode aware post-decode instruction processor logic coupled with the decode logic. The emulation mode aware post-decode instruction processor logic is to process one or more control signals decoded from an instruction. The instruction is one of a set of one or more instructions used to emulate the first instruction. The one or more control signals are to be processed differently by the emulation mode aware post-decode instruction processor logic when in an emulation mode than when not in the emulation mode. Other apparatus are also disclosed as well as methods and systems. | 09-18-2014 |
20140281399 | INSTRUCTION EMULATION PROCESSORS, METHODS, AND SYSTEMS - A processor of an aspect includes decode logic to receive a first instruction and to determine that the first instruction is to be emulated. The processor also includes emulation mode aware post-decode instruction processor logic coupled with the decode logic. The emulation mode aware post-decode instruction processor logic is to process one or more control signals decoded from an instruction. The instruction is one of a set of one or more instructions used to emulate the first instruction. The one or more control signals are to be processed differently by the emulation mode aware post-decode instruction processor logic when in an emulation mode than when not in the emulation mode. Other apparatus are also disclosed as well as methods and systems. | 09-18-2014 |
20140283032 | INTER-PROCESSOR ATTESTATION HARDWARE - Embodiments of an invention for inter-processor attestation hardware are disclosed. In one embodiment, an apparatus includes first attestation hardware associated with a first portion of a system. The first attestation hardware is to attest to a second portion of the system that the first portion of the system is secure. | 09-18-2014 |