Patent application number | Description | Published |
20090057928 | Semiconductor Chip with Stratified Underfill - Various semiconductor chip underfills and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate to leave a gap therebetween, and forming an underfill layer in the gap. The underfill layer includes a first plurality of filler particles that have a first average size and a second plurality of filler particles that have a second average size smaller than the first average size such that the first plurality of filler particles is concentrated proximate the substrate and the second plurality of filler particles is concentrated proximate the semiconductor chip so that a bulk modulus of the underfill layer is larger proximate the substrate than proximate the semiconductor chip. | 03-05-2009 |
20100015762 | Solder Interconnect - Various solder interconnect methods and apparatus are disclosed. In aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a circuit board with plural solder joints whereby an interstitial space is left between the semiconductor chip and the circuit board. The semiconductor chip and the circuit board are heated at a first temperature lower than a melting point of constituents of the plural solder joints to liberate contaminants from the interstitial space. The semiconductor chip and the circuit board are heated again at a second temperature higher than a melting point of at least one the constituents but not all of the constituents of the plural solder joints to shrink grain sizes of the at least one constituent. An underfill is placed in the interstitial space. | 01-21-2010 |
20100052188 | Semiconductor Chip with Solder Joint Protection Ring - Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metallic ring is coupled to the first side of the substrate. The first metallic ring has an internal peripheral wall that frames the semiconductor chip and is separated from the external peripheral wall by a gap. The first metallic ring has a coefficient of thermal expansion less than about 6.0 10 | 03-04-2010 |
20100301460 | SEMICONDUCTOR DEVICE HAVING A FILLED TRENCH STRUCTURE AND METHODS FOR FABRICATING THE SAME - Methods are provided for packaging a semiconductor die having a first surface. In accordance with an exemplary embodiment, a method comprises the steps of forming a trench in the first surface of the die, electrically and physically coupling the die to a packaging substrate, forming a sealant layer on the first surface of the die, forming an engagement structure within the trench, and infusing underfill between the sealant layer and the engagement structure and the packaging substrate. | 12-02-2010 |
20150261901 | RELIABILITY AWARE THERMAL DESIGN - Embodiments are disclosed that relate to implementing semiconductor device cooling systems that leverage awareness of regional voltage and temperature reliability risk considerations. For example, one disclosed embodiment provides a method of implementing a cooling system configured to cool an integrated circuit. The method involves first determining a heat dissipation factor that would reduce each region of the integrated circuit to a reduced temperature in order to maintain an overall failure rate. An analysis is then performed, using an insight about the relative reliability risk of elevated voltage and temperatures, to identify a region of the integrated circuit whose temperature can be permitted to rise without exceeding the overall failure rate, thereby permitting implementation of a cooling system with a reduced heat dissipation factor. | 09-17-2015 |
Patent application number | Description | Published |
20150046502 | MIGRATING DATA FROM LEGACY STORAGE SYSTEMS TO OBJECT STORAGE SYSTEMS - One or more techniques and/or systems are provided for migrating a dataset from a file storage system to an object storage system. That is, a snapshot of a file system may be received from the file storage system. The snapshot may comprise file data associated with a file of the file system. The file may be converted into an object using the file data. The object may be stored within a data constituent volume of the object storage system. A namespace volume, used to track objects, may be populated with a redirector that maps a front-end data path (e.g., a path used by clients to reference the object) to a back-end data path that specifies a path to the object within the data constituent volume. In this way, a dataset of one or more files may be migrated from the file storage system to the object storage system. | 02-12-2015 |
20150269032 | BACKING UP DATA TO CLOUD DATA STORAGE WHILE MAINTAINING STORAGE EFFICIENCY - Technology is disclosed for backing up data to and recovering data from a destination storage system that stores data in a format different form that of a primary storage system (“the technology”). A replication stream having the data of multiple files, metadata of the files, and reference maps including a mapping of the corresponding file to a portion of the data of the corresponding file is generated at the primary storage system. The replication stream is sent to a parser to map or convert the data, the files, and the reference maps to multiple storage objects in a format the destination storage system is configured to store. Various types of storage objects are generated, including a first type of the storage objects having the data, a second type of storage objects storing the reference maps, and a third type of the storage objects storing metadata of the files. | 09-24-2015 |
Patent application number | Description | Published |
20090006848 | Secure credential management - Apparatus and methods associated with providing secure credential management are described. One apparatus embodiment includes a data store to store authentication data and an authentication supplicant (AS) logic to provide a response to an authentication communication (ACM) received from an authentication process. An authentication management (AM) logic may receive the ACM from a connection management (CM) logic associated with a host operating system (HOS), provide the ACM to the AS logic, and provide the response back to the CM logic. The apparatus may include a device management (DM) client logic to provide a secure connection to an operator DM server associated with the authentication process and to store authentication data provided by the operator DM server in the data store. The AS logic, AM logic, and DM logic may reside in firmware that is not accessible to the HOS. | 01-01-2009 |
20090249463 | METHOD AND APPARATUS FOR SECURED EMBEDDED DEVICE COMMUNICATION - In a computing device that includes a host operating system and a management engine separate from the host operating system, if the primary operating system is not operating, a management engine may obtain from a credential server via a first network connection logon information for a secured network and the management engine connects to the secure network through a secured connection using the logon information. If the operating system is operating the operating system provides the logon information to the management engine. Certificate verification may be performed by a remote server on behalf of the management engine. Other embodiments are disclosed and claimed. | 10-01-2009 |
20120272057 | Method and Apparatus for Secured Embedded Device Communication - In a computing device that includes a host operating system and a management engine separate from the host operating system, if the primary operating system is not operating, a management engine may obtain from a credential server via a first network connection logon information for a secured network and the management engine connects to the secure network through a secured connection using the logon information. If the operating system is operating the operating system provides the logon information to the management engine. Certificate verification may be performed by a remote server on behalf of the management engine. Other embodiments are disclosed and claimed. | 10-25-2012 |
20140196111 | SECURED ELECTRONIC DEVICE - Methods, systems, and apparatus for communicatively pairing and securing an electronic device to a vehicle based electronic system. The pairing can enable the electronic device to seamlessly communicate with the electronic device and can provide infotainment to users of the vehicle. | 07-10-2014 |
Patent application number | Description | Published |
20080292492 | Solder Alloy - An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities. | 11-27-2008 |
20140199115 | SOLDER COMPOSITIONS - A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal. | 07-17-2014 |
20140219711 | HIGH IMPACT TOUGHNESS SOLDER ALLOY - High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities. | 08-07-2014 |
20150224604 | LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES - A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities. | 08-13-2015 |
20150266137 | LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES - A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities. | 09-24-2015 |
Patent application number | Description | Published |
20100266696 | Organic Compounds - A process of preparing a particulate and substantially crystalline drug substance. The process involves suspending a substantially crystalline drug substance in an anti-solvent to give a suspension, homogenising the suspension at elevated pressure to give drug particles that have a mean particle size of less than about 10 μm, and drying the drug particles to remove any residual anti-solvent. | 10-21-2010 |
20110086097 | Manufacture process for the preparation of an iron containing phosphate adsorbent - The present invention relates to a new manufacture process for producing an iron containing phosphate adsorbent, in particular to a process for manufacturing and isolating an iron(III)-based phosphate adsorbent which exhibits valuable pharmacological properties. | 04-14-2011 |
20110112121 | Pharmaceutical Compositions and Solid Forms - The present invention relates to pharmaceutical compositions of 6-(6-hydroxymethyl-pyrimidin-4-yloxy)-naphthalene-1-carboxylic acid (3-trifluoromethyl-phenyl)-amide, to the use of 6-(6-hydroxymethyl-pyrimidin-4-yloxy)-naphthalene-1-carboxylic acid (3-trifluoromethyl-phenyl)-amide and compositions of 6-(6-hydroxymethyl-pyrimidin-4-yloxy)-naphthalene-1-carboxylic acid (3-trifluoromethyl-phenyl)-amide in therapeutic applications, especially indications with a dysregulation/overexpression of VEFG, (neo)-vascularisation and VEGF driven angiogenesis and to methods for manufacturing such compositions, the invention further relates to specific forms of 6-(6-hydroxymethyl-pyrimidin-4-yloxy)-naphthalene-1-carboxylic acid (3-trifluoromethyl-phenyl)-amide and to the manufacturing and use of such forms. The present invention also relates to a new process to produce 6-(6-hydroxymethyl-pyrimidin-4-yloxy)-naphthalene-1-carboxylic acid (3-trifluoromethyl-phenyl)-amide. | 05-12-2011 |
20120245160 | POLYMORPHOUS FORMS III AND IV OF N-BENZOYL - STAUROSPORINE - The present invention relates to a crystalline form III and a crystalline form IV of N-benzoyl staurosporine. N-benzoyl staurosporine is also known as Midostaurin or PKC412. | 09-27-2012 |
20130039984 | Manufacture process for the preparation of an iron containing phosphate adsorbent - The present invention relates to a new manufacture process for producing an iron containing phosphate adsorbent, in particular to a process for manufacturing and isolating an iron(III)-based phosphate adsorbent which exhibits valuable pharmacological properties. | 02-14-2013 |
20130316018 | Manufacture process for the preparation of an iron containing phosphate adsorbent - The present invention relates to a new manufacture process for producing an iron containing phosphate adsorbent, in particular to a process for manufacturing and isolating an iron(III)-based phosphate adsorbent which exhibits valuable pharmacological properties. | 11-28-2013 |