Patent application number | Description | Published |
20120102498 | RESOURCE MANAGEMENT USING ENVIRONMENTS - Apparatus, systems, and methods may operate to receive time-based reservation requests for predefined resource environments comprising resource types that include hardware, software, and data, among others. Additional activities may include detecting a conflict between at least one of the resource types in a first one of the predefined resource environments and at least one of the resource types in a second one of the predefined resource environments, and resolving the conflict in favor of the first one of the predefined resource environments by reserving additional resource elements in a cloud computing architecture and/or reserving a less capable version of the second one of the predefined resource environments. Additional apparatus, systems, and methods are disclosed. | 04-26-2012 |
20120232914 | MARKETPLACE FOR MARKET INFORMATION - Apparatus, systems, and methods may operate to receive raw provider data in machine-readable form, where the raw provider data is associated with and provided by data contributors according to incentives made available to the data contributors. Additional activity may include filtering the raw provider data to provide filtered provider data, verifying that data taken from the filtered provider data meets a predefined level of trustworthiness, transforming at least some of the trustworthy data by formatting the data as is, or in summary analysis form according to one of multiple reporting formats to provide formatted data, and publishing the formatted data to at least one subscriber. Additional apparatus, systems, and methods are disclosed. | 09-13-2012 |
Patent application number | Description | Published |
20100112305 | CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING - New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process. | 05-06-2010 |
20100170868 | SPIN-ON SPACER MATERIALS FOR DOUBLE- AND TRIPLE-PATTERNING LITHOGRAPHY - Novel double- and triple-patterning methods are provided. The methods involve applying a shrinkable composition to a patterned template structure (e.g., a structure having lines) and heating the composition. The shrinkable composition is selected to possess properties that will cause it to shrink during heating, thus forming a conformal layer over the patterned template structure. The layer is then etched to leave behind pre-spacer structures, which comprise the features from the pattern with remnants of the shrinkable composition adjacent the feature sidewalls. The features are removed, leaving behind a doubled pattern. In an alternative embodiment, an extra etch step can be carried out prior to formation of the features on the template structure, thus allowing the pattern to be tripled rather than doubled. | 07-08-2010 |
20110086955 | CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING - New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process. | 04-14-2011 |
20120034437 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 02-09-2012 |
20120291938 | CYCLIC OLEFIN COMPOSITIONS FOR TEMPORARY WAFER BONDING - New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process. | 11-22-2012 |
20130288058 | DEVELOPMENT OF HIGH-VISCOSITY BONDING LAYER THROUGH IN-SITU POLYMER CHAIN EXTENSION - New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments. | 10-31-2013 |
20140162034 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 06-12-2014 |
20140174627 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 06-26-2014 |
20140239453 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 08-28-2014 |
20150122426 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 05-07-2015 |
Patent application number | Description | Published |
20110230441 | STABLE BORTEZOMIB FORMULATIONS - Multi-dose formulations for bortezomib are presented in which bortezomib has significantly improved stability. Especially preferred formulations include those in which bortezomib is in a liquid form suitable for injection, wherein the solvent system predominantly comprises propylene glycol. In other preferred aspects, bortezomib is present as a Lewis donor-acceptor complex with a hetero-bifunctional Lewis base. | 09-22-2011 |
20120172808 | Stable Bortezomib Formulations - Multi-dose formulations for bortezomib are presented in which bortezomib has significantly improved stability. Especially preferred formulations include those in which bortezomib is in a liquid form suitable for injection, wherein the solvent system predominantly comprises propylene glycol. In other preferred aspects, bortezomib is present as a Lewis donor-acceptor complex with a hetero-bifunctional Lewis base. | 07-05-2012 |
20120322762 | Stable Bortezomib Formulations - Multi-dose formulations for bortezomib are presented in which bortezomib has significantly improved stability. Especially preferred formulations include those in which bortezomib is in a liquid form suitable for injection, wherein the solvent system predominantly comprises propylene glycol. In other preferred aspects, bortezomib is present as a Lewis donor-acceptor complex with a hetero-bifunctional Lewis base. | 12-20-2012 |
20120322763 | Stable Bortezomib Formulations - Multi-dose formulations for bortezomib are presented in which bortezomib has significantly improved stability. Especially preferred formulations include those in which bortezomib is in a liquid form suitable for injection, wherein the solvent system predominantly comprises propylene glycol. In other preferred aspects, bortezomib is present as a Lewis donor-acceptor complex with a hetero-bifunctional Lewis base. | 12-20-2012 |
Patent application number | Description | Published |
20150317194 | PERIODIC VALIDATION AND HEALTH REPORTS OF DISASTER RECOVERY PLAN - Techniques are described for validating a disaster recovery plan. In an embodiment, a request is received to perform a validation of a disaster recovery operation plan that includes a set of instructions for performing a disaster recovery operation with respect to a first site and a second site. In response to receiving the request to perform the validation of the disaster recovery operation plan, a set of one or more validation operations is performed with respect to the disaster recovery operation plan. Based on the set of one or more validation operations, a report is generated that identifies one or more issues that may prevent the disaster recovery operation plan from executing properly. | 11-05-2015 |
20150317220 | DYNAMIC GENERATION OF DISASTER RECOVERY PLAN WHICH REACT TO CHANGES TO AN UNDERLYING TOPOLOGY - Techniques are described for dynamically generating a disaster recovery plan. In an embodiment, a set of topology metadata is determined for a first site on which a multi-tier application is deployed and a second site where the multi-tier application will be activated in the event of switchover/failover. The topology metadata may include metadata that identifies a set of targets associated with a plurality of tiers on the first site on which the multi-tier application is deployed and also on the second site where the multi-tier application would be activated in the event of disaster recovery operation like switchover or failover. Based, at least in part, on the topology metadata for the first site and second site, a disaster recovery plan is generated. The disaster recovery plan includes an ordered set of instructions for deactivating the multi-tier application at the first site and activating the multi-tier application at a second site. | 11-05-2015 |
20150317221 | COMPREHENSIVE ERROR MANAGEMENT CAPABILITIES FOR DISASTER RECOVERY OPERATIONS - Techniques are described for providing error management capabilities for disaster recovery operations. In an embodiment, first user input is received that identifies a first error mode to assign to a particular step of a disaster recovery plan that includes a set of steps for performing a disaster recovery operation. In response to receiving the first user input, the particular step is associated with the first error mode. In response to determining that an error occurred while processing the particular step of the disaster recovery plan, the error mode that is associated with the particular step is determined. Error handling is performed for the particular step based, at least in part, on the error mode that is associated with the particular step of the disaster recovery plan. | 11-05-2015 |
Patent application number | Description | Published |
20090093031 | Ketoreductase Polypeptides for the Production of (R)-3-Hydroxythiolane - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize chiral compounds. | 04-09-2009 |
20090162909 | Ketoreductase Polypeptides for the Production of Azetidinone - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize a variety of chiral compounds. | 06-25-2009 |
20100055751 | KETOREDUCTASE POLYPEPTIDES AND USES THEREOF - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme including the capability of stereo specifically reducing (R)-2-methylpentanal to (R)-2-methylpentanol. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to produce (R)-2-methylpentanol and related compounds. | 03-04-2010 |
20110159567 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF AZETIDINONE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize a variety of chiral compounds. | 06-30-2011 |
20110217754 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF (R)-3-HYDROXYTHIOLANE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize chiral compounds. | 09-08-2011 |
20120276599 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF (R)-3-HYDROXYTHIOLANE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize chiral compounds. | 11-01-2012 |
20130005018 | Polynucleotides Encoding Engineered Ketoreductase Polypeptides - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme including the capability of stereospecifically reducing (R)-2-methylpentanal to (R)-2-methylpentanol. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to produce (R)-2-methylpentanol and related compounds. | 01-03-2013 |
20130034895 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF AZETIDINONE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize a variety of chiral compounds. | 02-07-2013 |
20140057330 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF AZETIDINONE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize a variety of chiral compounds. | 02-27-2014 |
20150125910 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF (R)-3-HYDROXYTHIOLANE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize chiral compounds. | 05-07-2015 |
20150197731 | KETOREDUCTASE POLYPEPTIDES FOR THE PRODUCTION OF AZETIDINONE - The present disclosure provides engineered ketoreductase enzymes having improved properties as compared to a naturally occurring wild-type ketoreductase enzyme. Also provided are polynucleotides encoding the engineered ketoreductase enzymes, host cells capable of expressing the engineered ketoreductase enzymes, and methods of using the engineered ketoreductase enzymes to synthesize a variety of chiral compounds. | 07-16-2015 |