Patent application number | Description | Published |
20110142948 | Nanoparticle Carrier Systems based on Human Serum Albumin for Photodynamic Therapy - Compositions, which are stable in storage, and a method of production of pharmaceutical based nanoparticulate formulations for photodynamic therapy comprising a hydrophobic photosensitizer, human serum albumin (HSA) and stabilizing agent are provided. These nanoparticulate formulations provide therapeutically effective amounts of photosensitizer (PS) for parenteral administration. In particular, tetrapyrrole derivatives can be used as photosensitizers whose efficacy and safety are enhanced by such nanoparticulate formulations. A method of preparing the HSA-based nanoparticles under sterile conditions is also provided. In one of the preferred embodiments of the present invention temoporfin, a hydrophobic PS, is formulated as a nanoparticle for parenteral administration. The formulations are useful for treating hyperplasic and neoplasic conditions, inflammatory problems, and more specifically to target tumor cells. | 06-16-2011 |
20110275686 | NANOPARTICLE CARRIER SYSTEMS BASED ON POLY(DL-LACTIC-CO-GLYCOLIC ACID) (PLGA) FOR PHOTODYNAMIC THERAPY (PDT) - Compositions, which are stable in storage, and a method of production of pharmaceutical based nanoparticulate formulations for clinical use in photodynamic therapy comprising a hydrophobic photosensitizer, poly(lactic-co-glycolic) acid and stabilizing agents are provided. These nanoparticulate pharmaceutical formulations provide therapeutically effective amounts of photosensitizer for parenteral administration. In particular, tetrapyrrole derivatives can be used as photosensitizers, whose efficacy and safety are enhanced by such nanoparticulate formulations. It also teaches the method of preparing PLGA-based nanoparticles under sterile conditions. In one of the preferred embodiments of the present invention PLGA-based nanoparticles have a mean particle size less than 500 nm and the photosensitizer is temoporfin, 5,10,15,20-tetrakis(3-hydroxyphenyl)-chlorin (mTHPC). In another embodiment, the photosensitizer 2,3-dihydroxy-5,10,15,20-tetrakis(3-hydroxyphenyl)-chlorin (mTHPD-OH) is formulated as a nanoparticle for parenteral administration. Yet, in another embodiment preferred photosensitizer is 5,10,15,20-tetrakis(3-hydroxyphenyl)-porphyrin (mTHPP). The formulations can be used for treating hyperplasic and neoplasic conditions, inflammatory problems, and more specifically to target tumor cells. | 11-10-2011 |
Patent application number | Description | Published |
20110149349 | METHOD FOR PRODUCING A MULTI-LAYERED FILM - A method for producing a multi-layered film wherein an engraving layer is partially printed onto a support film. Said engraving layer may be made of a UV-cured printing ink and a cover layer is applied to the entire surface above the partial engraving layer, optionally, directly to the partial engraving layer. The cover layer may be made of a UV-curable printing ink and may be printed over the engraving layer. A film produced by such method is also disclosed. | 06-23-2011 |
20110151210 | METHOD FOR PRODUCING A LASER-INSCRIBABLE FILM WITH METALLIC SURFACE LUSTER - The invention relates to a method for producing a laser-inscribable film with metallic surface luster, wherein at least one laser-inscribable layer, i.e. an engraving layer, is applied to a support, in particular directly onto the support. According to the invention, a gloss layer is applied to the engraving layer, said gloss layer containing metal gloss pigments. | 06-23-2011 |
20110206916 | METHOD FOR PRODUCING A MULTI-COLORED LASER-INSCRIBABLE FILM - The invention relates to a method for producing a multi-coloured laser-inscribable film, wherein a first lacquer layer is applied to a support and at least one other lacquer layer is applied to the first lacquer layer. The colours of two lacquer layers that are superimposed differ from each other. According to the invention, the first and the other lacquer layers are respectively formed from a printing lacquer, the printing lacquer layers are designed such that they have absorption rates which differ up to 20% and the printing lacquers are printed thereon to form the lacquer layers. | 08-25-2011 |
Patent application number | Description | Published |
20140204971 | Method for performing a differential thermal analysis - A method for conducting a differential thermal analysis, in which a sample disposed in a temperable sample space is tempered according to an essentially linear temperature program extending from a start temperature to an end temperature, such that, from the result of a measurement of the sample temperature conducted during tempering at a number of measurement time points, a DTA signal is calculated as the difference between a measured sample temperature and a reference temperature calculated according to a temperature curve model. According to the invention, for every measurement time point, the relevant reference temperature is calculated by the following steps: (a) establish a time interval containing the relevant measurement time point; (b) calculate a non-linear adjustment function for the measured sample temperature curve in the time interval; and (c) calculate the reference temperature as a value of the adjustment function for the measurement time point. | 07-24-2014 |
20150013479 | METHOD AND MAGAZINE FOR HOLDING IN READINESS, TRANSPORTING, PROCESSING AND ARCHIVING THERMOANALYTICAL SAMPLES - A method and a device for holding in readiness, transporting, processing and archiving thermoanalytical samples are disclosed. The sample containers, into which the thermoanalytical samples to be investigated are to be introduced, are provided in a magazine. | 01-15-2015 |
20150019157 | Method For Evaluating A Measurement Result Of A Thermal Analysis, As Well As Use Of The Method, Computer Unit, Computer Program Product And System For Performing The Method - A method for evaluating a measurement result of a thermal analysis. A program-controlled computer unit is used to calculate at least one probability of the agreement of the measurement result with at least one dataset previously stored in the computer unit, wherein this calculation is based on a comparison of effect data previously extracted from a measurement curve of the thermal analysis with corresponding stored effect data of the dataset. The evaluation can advantageously include, an automatic recognition and classification of measurement curves and can be carried out in particular more efficiently, more economically and more quickly than previously, with at the same time a high quality of evaluation. | 01-15-2015 |
Patent application number | Description | Published |
20090222104 | ASYMMETRIC FORMATION OF PROSTHETIC COMPONENTS FOR THE MANIPULATION AND SUPPRESSION OF NATURAL FREQUENCIES - A hip joint prosthesis for implantation in the femur of a patient, wherein the shaft can be coupled with a ball head which in turn can be inserted rotatably in the hemispherical recess of a socket insert. To avoid squeaking the shaft is formed asymmetrically in its outer and/or inner geometry and/or material composition. | 09-03-2009 |
20090259318 | ASYMMETRIC FORMATION OF SOCKETS AND/OR SOCKET INSERTS FOR THE MANIPULATION AND SUPRESSION OF NATURAL FREQUENCIES - A socket or socket insert for a hip joint prosthesis, the shaft of which can be coupled with a ball head which in turn can be inserted in a rotatable manner in the hemispherical recess of the socket insert wherein the shaft can be implanted in the femur and the socket insert can be implanted directly or via a hip socket in the pelvic bone. To avoid squeaking, the socket and/or the socket insert are asymmetrically in their inner or outer geometries. | 10-15-2009 |
20090287311 | ASYMMETRIC DESIGN OF HIP SOCKET FOR REDUCING SOCKET DEFORMATIONS - A hip socket for use in a hip joint prosthesis comprising a shaft on which a ball head may be fixed, the ball head may be rotatably inserted in a socket insert and the socket insert may be inserted and fixed in the hip socket the shaft and the hip socket being implantable in the thigh bone and the pelvic bone respectively. Damages to the socket insert and/or limitation of the function of the sliding pair of ball head/socket insert may be avoided by local reduction of the calotte diameter of the socket insert, such that the hip socket has an asymmetrical design with regard to the stiffness and/or geometry thereof in two different directions (x, y) orthogonal to each other and to the symmetry axis (z) of the hip socket. | 11-19-2009 |
20090299484 | DEVICE FOR ASSEMBLY OF BALL HEADS AND ADAPTER SLEEVES AS INTEGRATED COMPONENT PART OF THE PACKAGE - The invention relates to a package for receiving an adapter sleeve for a hip endoprosthesis, the hip endoprosthesis comprising a ball head which has to be pushed onto the adapter sleeve with a defined pushing-on force. For simplification and secure fastening of the ball head on the adapter sleeve, it is proposed according to the invention that a device for the mounting of the ball head on the adapter sleeve is integrated in the package and this device comprises indicating elements which indicate that the defined pushing-on force has been reached when the ball head is pressed onto the adapter sleeve. | 12-03-2009 |
20090326669 | INSERTION OF VIBRATION-DAMPING ELEMENTS IN PROSTHETIC SYSTEMS FOR THE MANIPULATION AND DAMPING OF NATURAL FREQUENCIES - A hip joint prosthesis with a shaft fastened on the shaft head of which there is a ball head which in turn is inserted in a rotatable manner in the spherical recess of a socket insert and the socket insert is coupled with a hip socket wherein the shaft can be implanted in the femur and the hip socket can be implanted in the pelvic bone. To avoid transmission of vibrations, damping elements of a vibration-damping material are arranged at the coupling points of the shaft head with the ball head and/or of the socket insert with the hip socket. | 12-31-2009 |
20100161071 | REDUCTION OF THE DEVELOPMENT OF STRIPE WEAR ON INSERTS FOR HIP JOINT PROSTHESES BY MODIFYING THE GEOMETRY OF THE TRANSITION BETWEEN THE FACE AND SPHERICAL RECESS - A socket insert of a hip joint prosthesis having a spherical-identation-shaped recess in which a spherical head of a femur is mounted . The spherical indentation has a run-in zone which ends on one side with a circular arc tangentially in an end face of the socket insert and extends on another side as far as the run-in edge. Between a start of the circular arc with a radius of the length (R | 06-24-2010 |
20150209148 | DEVICE FOR ASSEMBLY OF BALL HEADS AND ADAPTER SLEEVES AS INTEGRATED COMPONENT PART OF THE PACKAGE - A package for receiving an adapter sleeve for a hip endoprosthesis, the hip endoprosthesis comprising a ball head which has to be pushed onto the adapter sleeve with a defined pushing-on force. For simplification and secure fastening of the ball head on the adapter sleeve, it is proposed according to the invention that a device for the mounting of the ball head on the adapter sleeve is integrated in the package and this device comprises indicating elements which indicate that the defined pushing-on force has been reached when the ball head is pressed onto the adapter sleeve. Preferably the package has indicating elements. | 07-30-2015 |
Patent application number | Description | Published |
20120126279 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip. | 05-24-2012 |
20130113010 | Optoelectronic Component and Method for Producing an Optoelectronic Component - An optoelectronic component comprising an optoelectronic semiconductor chip ( | 05-09-2013 |
20130200417 | RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT - A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer. | 08-08-2013 |
20130210181 | PROCESS FOR PRODUCING A LAYER COMPOSITE CONSISTING OF A LUMINESCENCE CONVERSION LAYER AND A SCATTERING LAYER - A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer. | 08-15-2013 |
20130228799 | METHOD FOR PRODUCING A SILICONE FOIL, SILICONE FOIL AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT COMPRISING A SILICONE FOIL - A method of producing a silicone foil for use in an optoelectronic semiconductor component by molding including introducing a mold foil into a mold, introducing a carrier foil into the mold, wherein the carrier foil is fitted on a substrate foil and the substrate foil projects laterally beyond the carrier foil at least in places within a cavity of the mold, providing and applying a silicone base composition to the mold foil or to the carrier foil, molding the silicone base composition for the silicone foil in the mold between the mold foil and the carrier foil, wherein the silicone base composition is brought into contact with the substrate foil in at least one overlap region laterally alongside the carrier foil, removing the mold foil from the silicone foil, and separating the overlap region. | 09-05-2013 |
20130334558 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT - A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip. | 12-19-2013 |
20140168988 | OPTICAL ELEMENT, OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method. | 06-19-2014 |
20150187685 | LEADFRAME ASSEMBLY, HOUSING ASSEMBLY, MODULE ASSEMBLY AND METHOD OF DETERMINING AT LEAST ONE VALUE OF A MEASUREMENT VARIABLE OF AN ELECTRONIC MODULE - A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections. | 07-02-2015 |
20150333232 | Method for Producing an Optoelectronic Semiconductor Device, and Optoelectronic Semiconductor Device - A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated. | 11-19-2015 |