Patent application number | Description | Published |
20100096674 | METHODS AND SYSTEMS OF THICK SEMICONDUCTOR DRIFT DETECTOR FABRICATION - Gray-tone lithography technology is used in combination with a reactive plasma etching operation in the fabrication method and system of a thick semiconductor drift detector. The thick semiconductor drift detector is based on a trench array, where the trenches in the trench array penetrate the bulk with different depths. These trenches form an electrode. By applying different electric potentials to the trenches in the trench array, the silicon between neighboring trenches fully depletes. Furthermore, the applied potentials cause a drifting field for generated charge carriers, which are directed towards a collecting electrode. | 04-22-2010 |
20100264502 | METHODS AND SYSTEMS OF CURVED RADIATION DETECTOR FABRICATION - Gray tone lithography is used to form curved silicon topographies for semiconductor based solid-state imaging devices. The imagers are curved to a specific curvature and shaped directly for the specific application; such as curved focal planes. The curvature of the backside is independent from the front surface, which allows thinning of the detector using standard semiconductor processing. | 10-21-2010 |
20120161266 | METHODS AND SYSTEMS OF ISOLATING SEGMENTED RADIATION DETECTORS USING ALUMINA - Radiation detectors can be made of n-type or p-type silicon. All segmented detectors on p-type silicon and double-sided detectors on n-type silicon require an “inter-segment isolation” to separate the n-type strips from each other; an alumina layer for isolating the strip detectors is applied, and forms negative charges at the silicon interface with appropriate densities. When alumina dielectric is deposited on silicon, the negative interface charge acts like an effective p-stop or p-spray barrier because electrons are “pushed” away from the interface due to the negative interface charge. | 06-28-2012 |
20120193551 | APPARATUS SYSTEMS AND METHODS OF SENSING CHEMICAL BIO-CHEMICAL AND RADIOLOGICAL AGENTS USING ELECTROPHORETIC DISPLAYS - Caesium-137 irradiates electronic paper. An incoming gamma-ray from the Cs-137 interacts with a particle inside a micro-container by generating a recoil electron and/or a hole. Because the recoil electron physically leaves the particle, the particle is charged depending on the dose from the radiation source. And, the charge of the particles change, which results in a movement of the particles within the micro-container. After refreshing the electronic paper, a visible difference in the gray-scale can be seen. Thus, the visible difference in the gray-scale is an effect caused by the irradiation of the electronic paper, showing sensitivity to high energy radiation--thus, non-optimized electronic paper is sensitive to high energy radiation and can be used as a radiation dosimeter. In addition, electronic paper can be used for sensing chemical and bio-chemical agents, as well as detecting high energy radiation. | 08-02-2012 |
20130203239 | METHODS FOR SCRIBING OF SEMICONDUCTOR DEVICES WITH IMPROVED SIDEWALL PASSIVATION - A method of singulating semi-conductor devices in the close proximity to active structures by controlling interface charge of semiconductor device sidewalls is provided that includes forming a scribe on a surface of a semi-conductor devices, where the scribe is within 5 degrees of a crystal lattice direction of the semi-conductor device, cleaving the semiconductor device along the scribe, where the devices are separated, using a coating process to coat the sidewalls of the cleaved semiconductor device with a passivation material, where the passivation material is disposed to provide a fixed charge density at a semiconductor interface of the sidewalls, and where the fixed charge density interacts with charge carriers in the bulk of the material. | 08-08-2013 |
20140327099 | NANOMETER-SCALE LEVEL STRUCTURES AND FABRICATION METHOD FOR DIGITAL ETCHING OF NANOMETER-SCALE LEVEL STRUCTURES - A ramped etalon cavity structure and a method of fabricating same. A bi-layer stack is deposited on a substrate. The bi-layer stack includes a plurality of bi-layers. Each bi-layer of the plurality of bi-layers includes an etch stop layer and a bulk layer. A three dimensional photoresist structure is formed by using gray-tone lithography. The three dimensional photoresist is plasma etched into the bi-layer stack, thereby generating an etched bi-layer stack. The etched bi-layer stack is chemically etched with a first chemical etchant to generate a multiple-step structure on the substrate, wherein the first chemical etchant stops at the etch stop layer. | 11-06-2014 |