Patent application number | Description | Published |
20080272386 | Light Emitting Devices for Light Conversion and Methods and Semiconductor Chips for Fabricating the Same - Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped substrate suitable for light extraction through the substrate and a cavity in the substrate proximate the light emitting element. For example, a trench adjacent the light emitting element may be provided. The cavity/trench is configured to contain light conversion material such that light extracted from sidewalls of the cavity/trench passes through the light conversion material contained in the cavity/trench. Methods of fabricating such devices and/or chips are also provided. | 11-06-2008 |
20090014731 | LED Chip Design for White Conversion - A light emitting diode is disclosed, together with associated wafer structures, and fabrication and mapping techniques. The diode includes an active portion, a raised border on the top surface of the active portion and around the perimeter of the top surface of the active portion, a resin in the space defined by the border and the top surface of the active portion, and phosphor particles in the resin that convert the frequencies emitted by the active portion. | 01-15-2009 |
20090039365 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH APPLIED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME - A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer. | 02-12-2009 |
20100006883 | LIGHT EMITTING DIODES INCLUDING BARRIER LAYERS/SUBLAYERS AND MANUFACTURING METHODS THEREFOR - Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers. | 01-14-2010 |
20110037080 | METHODS FOR COMBINING LIGHT EMITTING DEVICES IN A PACKAGE AND PACKAGES INCLUDING COMBINED LIGHT EMITTING DEVICES - Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected. | 02-17-2011 |
20110056734 | ELECTRONIC DEVICE SUBMOUNTS WITH THERMALLY CONDUCTIVE VIAS AND LIGHT EMITTING DEVICES INCLUDING THE SAME - A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed. | 03-10-2011 |
20110089456 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH APPLIED WAVELENGTH CONVERSION MATERIALS AND METHODS FOR FORMING THE SAME - A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer. | 04-21-2011 |
20110121333 | Solid State Light Emitting Apparatus with Thermal Management Structures and Methods of Manufacturing - Provided are apparatus and methods corresponding to a solid state light emitting element. Such methods include mounting, to a thermally conductive component, a solid state light emitting element that includes first and second electrical connection points that are configured to be conductively engaged on a first side of a circuit structure. The solid state light emitting element is electrically insulated from the thermally conductive component to provide that electrical connections are arranged on the first side of the circuit structure and heat is conducted to a second side of the circuit structure that is opposite the first side of the circuit structure. | 05-26-2011 |
20110260199 | SOLID STATE LIGHT EMITTING DIODE PACKAGES WITH LEADFRAMES AND CERAMIC MATERIAL AND METHODS OF FORMING THE SAME - Solid state light emitting diode packages can be provided including a ceramic material and a leadframe structure, on the ceramic material, the leadframe structure including a portion thereof that integrates the leadframe structure with the ceramic material. | 10-27-2011 |
20120007117 | Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids - A packaged electronic device includes a submount, a bonding pattern on the submount, and an electronic chip on the bonding pattern. A periphery of the electronic chip defines a die mounting region of the submount. The bonding pattern includes a bonding area within the die mounting region and at least one channel that extends from within the die mounting region to a region of the submount outside the die mounting region. | 01-12-2012 |
20120061702 | Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants - A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed. | 03-15-2012 |
20120068209 | Semiconductor Light Emitting Devices with Optical Coatings and Methods of Making Same - A method of making a semiconductor light emitting device having one or more light emitting surfaces includes positioning a stencil on a substrate such that a chip disposed on the substrate is positioned within an opening in the stencil. Phosphor-containing material is deposited in the opening to form a coating on one or more light emitting surfaces of the chip. The opening may or may not substantially conform to a shape of the chip. The phosphor-containing material is cured with the stencil still in place. After curing, the stencil is removed from the substrate and the coated chip is separated from the substrate. The chip may then be subjected to further processing. | 03-22-2012 |
20120068594 | Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface - An LED includes a chip having a light emitting surface, and a coating of phosphor-containing material on the light emitting surface. Phosphor particles are arranged in a densely packed layer within the coating at the light emitting surface, and such that the light emitting surface is in contacting relationship with the phosphor particles. | 03-22-2012 |
20120086024 | MULTIPLE CONFIGURATION LIGHT EMITTING DEVICES AND METHODS - Multiple configuration light emitting diode (LED) devices and methods are disclosed wherein LEDs within the device can be selectively configured for use in higher voltage, or variable voltage, applications. Variable arrangements of LEDs can be configured. Arrangements can include one or more LEDs connected in series, parallel, and/or a combination thereof. A surface over which one or more LEDs may be mounted can comprise one or more electrically and/or thermally isolated portions. | 04-12-2012 |
20120193648 | CONFORMALLY COATED LIGHT EMITTING DEVICES AND METHODS FOR PROVIDING THE SAME - Methods are disclosed including applying a conformal coating to multiple light emitters. The conformal coating forms in gap areas between adjacent ones of the light emitters. The plurality of light emitters are separated into individual light emitters. The individual light emitters include the conformal coating that extends to a space corresponding to respective gap areas. Light emitting structures are disclosed including a semiconductor light emitting diode (LED) having an active region and a conformal coating including a first portion and a second portion, the first portion corresponding to at least one surface of the LED and the second portion extending from the first portion. | 08-02-2012 |
20120193649 | LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES - An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die. | 08-02-2012 |
20120193659 | STRUCTURES AND SUBSTRATES FOR MOUNTING OPTICAL ELEMENTS AND METHODS AND DEVICES FOR PROVIDING THE SAME BACKGROUND - Methods are disclosed including generating a substrate surface topography that includes a mounting portion that is higher than a relief portion that defines a perimeter of the mounting portion. | 08-02-2012 |
20120305939 | LIGHT EMITTING DIODES INCLUDING BARRIER SUBLAYERS - Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers. | 12-06-2012 |
20120306351 | LED-Array Light Source with Aspect Ratio Greater Than 1 - An LED light source for use in LED lighting fixtures, the LED light source comprising a submount including an LED-populated area which has an aspect ratio greater than 1, an array of LEDs on the LED-populated area, and a lens on the submount over the LED-populated area. Various embodiments facilitating preferential-side lighting, such as for roadway uses, are also disclosed. | 12-06-2012 |
20120307503 | Multi-Lens LED-Array Optic System - Lighting apparatus having a first lens over the LED emitter and a second lens over the first lens, and including: a first optical surface which is a first-lens outer surface configured to refract light from the emitter; a second optical surface which is a second-lens inner surface spaced from the first optical surface; and a third optical surface which is a second-lens outer surface configured to refract light from the second optical surface toward a preferential side. One embodiment includes asymmetric primary and secondary lenses. | 12-06-2012 |
20130092960 | Multi-Die LED Package - A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads. | 04-18-2013 |
20130119418 | METHODS OF FORMING OPTICAL CONVERSION MATERIAL CAPS AND LIGHT EMITTING DEVICES INCLUDING PRE-FORMED OPTICAL CONVERSION MATERIAL CAPS - A method of forming can be provided by applying an optical conversion material to a mold to form a unitary layer of optical conversion material and removing the unitary layer of optical conversion material from the mold. | 05-16-2013 |
20130178127 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH DENSELY PACKED PHOSPHOR LAYER AT LIGHT EMITTING SURFACE - An LED includes a chip having a light emitting surface, and a coating of phosphor-containing material on the light emitting surface. Phosphor particles are arranged in a densely packed layer within the coating at the light emitting surface, and such that the light emitting surface is in contacting relationship with the phosphor particles. | 07-11-2013 |
20130256710 | MULTI-CHIP LIGHT EMITTER PACKAGES AND RELATED METHODS - Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array. | 10-03-2013 |
20130273238 | Inverted Curing of Liquid Optoelectronic Lenses - A method of forming a lens over an optoelectronic element includes providing the optoelectronic element on a support substrate, dispensing a quantity of encapsulant onto the support substrate over the optoelectronic element, inverting the support substrate so that the support substrate is above the optoelectronic element and the encapsulant is suspended from the support substrate, and curing the encapsulant while maintaining the support substrate in the inverted position. | 10-17-2013 |
20140048822 | LIGHT EMITTING DIODES INCLUDING CURRENT SPREADING LAYER AND BARRIER SUBLAYERS - Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a current spreading layer, on the epitaxial region. A barrier layer is provided on the current spreading layer and extending on a sidewall of the current spreading layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers. | 02-20-2014 |
20140161147 | SEMICONDUCTOR LIGHT EMITTING DEVICES WITH DENSELY PACKED PHOSPHOR LAYER AT LIGHT EMITTING SURFACE - An LED includes a chip having a light emitting surface, and a coating of phosphor-containing material on the light emitting surface. The phosphor-containing material comprises at least two quantities of different phosphor particles and are arranged in a densely packed layer within the coating at the light emitting surface. The densely packed layer of phosphor particles does not extend all the way through the coating. | 06-12-2014 |
20140217436 | SUBMOUNT-FREE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME - Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described. | 08-07-2014 |