Patent application number | Description | Published |
20090044054 | DYNAMIC CRITICAL PATH DETECTOR FOR DIGITAL LOGIC CIRCUIT PATHS - Method for correcting timing failures in an integrated circuit and device for monitoring an integrated circuit. The method includes placing a first and second latch near a critical path. The first latch has an input comprising a data value on the critical path. The method further includes generating a delayed data value from the data value, latching the delayed data value in the second latch, comparing the data value with the delayed data value to determine whether the critical path comprises a timing failure condition, and executing a predetermined corrective measure for the critical path. | 02-12-2009 |
20090044160 | DYNAMIC CRITICAL PATH DETECTOR FOR DIGITAL LOGIC CIRCUIT PATHS - Method for correcting timing failures in an integrated circuit and device for monitoring an integrated circuit. The method includes placing a first and second latch near a critical path. The first latch has an input comprising a data value on the critical path. The method further includes generating a delayed data value from the data value, latching the delayed data value in the second latch, comparing the data value with the delayed data value to determine whether the critical path comprises a timing failure condition, and executing a predetermined corrective measure for the critical path. The invention is also directed to a design structure on which a circuit resides. | 02-12-2009 |
20090058457 | REDUNDANT CRITICAL PATH CIRCUITS TO MEET PERFORMANCE REQUIREMENT - Method, system, IC and design structure for meeting a performance requirement using redundant critical path circuits, are disclosed. In one embodiment, the IC includes a plurality of redundant critical path circuits, wherein at least one of the plurality of redundant critical path circuits meeting a performance requirement is operational and the others are non-operational. | 03-05-2009 |
20090058504 | SELF-POWERED VOLTAGE ISLANDS ON AN INTEGRATED CIRCUIT - The present disclosure is directed to self-powered voltage islands on an integrated circuit. A structure in accordance with an embodiment includes: an integrated circuit including a power source; a voltage island; and an on-board power source provided on the voltage island for powering the voltage island independently of the power source of the integrated circuit. | 03-05-2009 |
20090091351 | CHIP IDENTIFICATION SYSTEM AND METHOD - Disclosed are embodiments of on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors. In each embodiment the resulting pattern of shorts and opens, can be used as an on-chip identifier or private key. | 04-09-2009 |
20090094566 | DESIGN STRUCTURE FOR CHIP IDENTIFICATION SYSTEM - Disclosed is a design structure for an on-chip identification circuitry. In one embodiment, pairs of conductors (e.g., metal pads, vias, lines) are formed within one or more metallization layers. The distance between the conductors in each pair is predetermined so that, given known across chip line variations, there is a random chance (i.e., an approximately 50/50 chance) of a short. In another embodiment different masks form first conductors (e.g., metal lines separated by varying distances and having different widths) and second conductors (e.g., metal vias separated by varying distances and having equal widths). The first and second conductors alternate across the chip. Due to the different separation distances and widths of the first conductors, the different separation distances of the second conductors and, random mask alignment variations, each first conductor can short to up to two second conductors. In each embodiment the resulting pattern of shorts and opens, can be used as an on-chip identifier or private key. | 04-09-2009 |
20090113358 | MECHANISM FOR DETECTION AND COMPENSATION OF NBTI INDUCED THRESHOLD DEGRADATION - The embodiments of the invention provide a design structure for detection and compensation of negative bias temperature instability (NBTI) induced threshold degradation. A semiconductor device is provided comprising at least one stress device having a voltage applied to its gate node and at least one reference device having a zero gate-to-source voltage. A controller is also provided to configure node voltages of the device and/or the reference device to reflect different regions of device operations found in digital and analog circuit applications. Moreover, the controller measures a difference in current between the stress device and the reference device to determine whether NBTI induced threshold degradation has occurred in the stress device. The controller also adjusts an output power supply voltage of the stress device until a performance of the stress device matches a performance of the reference device to account for the NBTI induced threshold degradation. | 04-30-2009 |
20090119625 | Structure for System Architectures for and Methods of Scheduling On-Chip and Across-Chip Noise Events in an Integrated Circuit - A design structure integrated circuit (IC) system architectures that allow for the reduction of on-chip or across-chip transient noise budgets by providing a means to avoid simultaneous high current demand events from at least two functional logic blocks, i.e., noise contributors, are disclosed. Embodiments of the IC system architectures include at least one noise event arbiter and at least two noise contributor blocks. A method of scheduling on-chip noise events to avoid simultaneous active transient noise events may include, but is not limited to: the noise event arbiter receiving simultaneously multiple requests-to-operate from multiple noise contributors; the noise event arbiter determining when each noise contributor may execute operations based on a pre-established dI/dt budget; and the noise event arbiter notifying each noise contributor as to when permission is granted to execute its operations. | 05-07-2009 |
20090144673 | PARTIAL GOOD SCHEMA FOR INTEGRATED CIRCUITS HAVING PARALLEL EXECUTION UNITS - Processing engines (PE's) disposed on the substrate. Each processing engine includes a measurement and storage unit, and a PE controller coupled to each of the processing engines. The processing engines perform self-tests and store the results of the self-tests in the measurement and storage unit. The PE controller reads the results and selects a sub-set of processing engines based on the results and an optimization algorithm. | 06-04-2009 |
20090150726 | METHOD AND SYSTEM FOR EXTENDING THE USEFUL LIFE OF ANOTHER SYSTEM - Disclosed are embodiments of a method and an associated first system for extending product life of a second system in the presence of phenomena that cause the exhibition of both performance degradation and recovery properties within system devices. The first system includes duplicate devices incorporated into the second system (e.g., on a shared bus). These duplicate devices are adapted to independently perform the same function within that second system. Reference signal generators, a reference signal comparator, a power controller and a state machine, working in combination, can be adapted to seamlessly switch performance of that same function within the second system between the duplicate devices based on a measurement of performance degradation to allow for device recovery. A predetermined policy accessible by the state machine dictates when and whether or not to initiate a switch. | 06-11-2009 |
20090152591 | Design Structure for an On-Demand Power Supply Current Modification System for an Integrated Circuit - A design structure for a circuit that selectively connects an integrated circuit to elements external to the integrated circuits. The circuit includes and input/output element that selectively connects an input/output pin as a function of a power requirement or a signal bandwidth requirement of the integrated circuit. The input/output element includes one or more switching devices that connect the input/output pin to an external element, such as a power supply or external signal path. The input/output element also includes one or more switching devices that connect the input/output pin to an internal element, such as a power network or internal signal line. | 06-18-2009 |
20090152594 | On-Demand Power Supply Current Modification System and Method for an Integrated Circuit - A circuit that selectively connects an integrated circuit to elements external to the integrated circuits. The circuit includes an input/output element that selectively connects an input/output pin as a function of a power requirement or a signal bandwidth requirement of the integrated circuit. The input/output element includes one or more switching devices that connect the input/output pin to an external element, such as a power supply or external signal path. The input/output element also includes one or more switching devices that connect the input/output pin to an internal element, such as a power network or internal signal line. | 06-18-2009 |
20090249091 | SECONDARY POWER UTILIZATION DURING PEAK POWER TIMES - The invention generally relates to the utilization of electric power, and more particularly to systems and methods for selectively utilizing secondary power sources during peak power times. A method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification. | 10-01-2009 |
20090273239 | SEMICONDUCTOR POWER DISTRIBUTION AND CONTROL SYSTEMS AND METHODS - A system for dynamic integrated circuit power distribution and control is disclosed. The system includes an external power consumption target generator configured to generate a power dissipation target for one or more integrated circuits. The system also includes a first integrated circuit that includes an IC power control unit coupled to the external power consumption target generator. The first integrated circuit also includes a first plurality of functional units, each functional unit of the first plurality including a unit power level control and a first power control grid coupling the IC power control unit to one or more of the first plurality of functional units. The IC power control unit is configured to generate a mode control signal which places at least one of plurality of functional units into a first mode of operation based upon the power consumption target. | 11-05-2009 |
20090276178 | WARRANTY MONITORING AND ENFORCEMENT FOR INTEGRATED CIRCUIT AND RELATED DESIGN STRUCTURE - An integrated circuit (IC) including a warranty and enforcement system, and a related design structure and HDL design structure are disclosed. In one embodiment, an IC includes a parameter obtainer for obtaining a value of a parameter of the IC; a warranty data storage system for storing warranty limit data regarding the IC; a comparator for determining whether a warranty limit has been exceeded by comparing the value of the parameter to a corresponding warranty limit; and an action taker for taking a prescribed action in response to the warranty limit being exceeded. | 11-05-2009 |
20090276232 | WARRANTY MONITORING AND ENFORCEMENT FOR INTEGRATED CIRCUIT - An integrated circuit (IC) including a warranty and enforcement system and a method are disclosed. In one embodiment, an IC includes a parameter obtainer for obtaining a value of a parameter of the IC; a warranty data storage system for storing warranty limit data regarding the IC; a comparator for determining whether a warranty limit has been exceeded by comparing the value of the parameter to a corresponding warranty limit; and an action taker for taking a prescribed action in response to the warranty limit being exceeded. | 11-05-2009 |
20090276644 | STRUCTURE FOR SEMICONDUCTOR POWER DISTRIBUTION AND CONTROL - A design structure for dynamic integrated circuit power distribution and control is disclosed. The design structure includes an external power consumption target generator configured to generate a power dissipation target for one or more integrated circuits. The design structure also includes a first integrated circuit that includes an IC power control unit coupled to the external power consumption target generator. The first integrated circuit also includes a first plurality of functional units, each functional unit of the first plurality including a unit power level control and a first power control grid coupling the IC power control unit to one or more of the first plurality of functional units. The IC power control unit is configured to generate a mode control signal which places at least one of plurality of functional units into a first mode of operation based upon the power consumption target. | 11-05-2009 |
20090291533 | System-On-Chip (SOC), Design Structure and Method - Disclosed is a system-on-chip (SOC) structure that allows for automated integration of multiple intellectual cores. The SOC structure incorporates a plurality of cells connected to a common bus on a chip. Each cell incorporates a functional core and an automated integration unit (AIU) connected to the functional core. Each AIU communicates integration information for its functional core over the common bus to the AIUs in the other cells. The exchange of information between the AIUs is controlled either by the integration units themselves or by a controller. Based on received integration information, each AIU can automatically make any required configuration adjustments for integration. Furthermore, based on this exchange of information, the functional cores can interact, as necessary, during SOC operation. Also disclosed are an associated method of forming such a SOC structure and a design structure for such an SOC structure. | 11-26-2009 |
20090292828 | System-On-Chip (SOC), Design Structure and Method - Disclosed is a system-on-chip (SOC) structure that allows for automated integration of multiple intellectual cores. The SOC structure incorporates a plurality of cells connected to a common bus on a chip. Each cell incorporates a functional core and an automated integration unit (AIU) connected to the functional core. Each AIU communicates integration information for its functional core over the common bus to the AIUs in the other cells. The exchange of information between the AIUs is controlled either by the integration units themselves or by a controller. Based on received integration information, each AIU can automatically make any required configuration adjustments for integration. Furthermore, based on this exchange of information, the functional cores can interact, as necessary, during SOC operation. Also disclosed are an associated method of forming such a SOC structure and a design structure for such an SOC structure. | 11-26-2009 |
20100191385 | SYSTEM FOR PREDICTION AND COMMUNICATION OF ENVIRONMENTALLY INDUCED POWER USEAGE LIMITATION - Disclosed are a power management system and associated method that not only initiate a “greenout” to avoid the negative impact of high loads (i.e., to avoid high power cost, negative environmental impact, brownouts, and ultimately blackouts), but can also predict the initiation of such a “greenout”. Predicting the initiation of a “greenout” and communicating the prediction to one or more of the various electronic devices connected to the power grid allows the electronic device(s) to take preparatory action to avoid and/or limit any negative impact that may be caused by the “greenout”. | 07-29-2010 |
20120126836 | MICROELECTROMECHANICAL STRUCTURE (MEMS) MONITORING - A MEMS component is monitored to determine its status. Sensors are deployed to sense the MEMS component and produce detection signals that are analyzed to determine the MEMS component state. An indicator device alerts a user of the status, particularly if the MEMS component has failed. Additionally, the MEMS component monitoring system may be practiced as a design structure encoded on computer readable storage media as part of a circuit design system. | 05-24-2012 |
20120146684 | SWITCH TO PERFORM NON-DESTRUCTIVE AND SECURE DISABLEMENT OF IC FUNCTIONALITY UTILIZING MEMS AND METHOD THEREOF - Structures and methods are provided for performing non-destructive and secure disablement of integrated circuit (IC) functionality. A structure for enabling non-destructive and secure disablement and re-enablement of the IC includes a micro-electrical mechanical structure (MEMS) initially set to a chip enable state. The structure also includes an activation circuit operable to set the MEMS device to an error state based on a detected predetermined condition of the IC. The IC is disabled when the MEMS device is in the error state. | 06-14-2012 |
20120324255 | SECONDARY POWER UTILIZATION DURING PEAK POWER TIMES - Systems and methods for selectively utilizing secondary power sources during peak power times are provided for. The method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification. | 12-20-2012 |
20140166461 | THREE-DIMENSIONAL INTER-CHIP CONTACT THROUGH VERTICAL DISPLACEMENT MEMS - An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position. | 06-19-2014 |
20150077173 | THREE-DIMENSIONAL CHIP STACK FOR SELF-POWERED INTEGRATED CIRCUIT - Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure. | 03-19-2015 |