Patent application number | Description | Published |
20130285153 | STRAINED STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE STRAINED STRUCTURE - An exemplary structure for a field effect transistor (FET) comprises a silicon substrate comprising a first surface; a channel portion over the first surface, wherein the channel portion has a second surface at a first height above the first surface, and a length parallel to first surface; and two source/drain (S/D) regions on the first surface and surrounding the channel portion along the length of the channel portion, wherein the two S/D regions comprise SiGe, Ge, Si, SiC, GeSn, SiGeSn, SiSn, or III-V material. | 10-31-2013 |
20150364566 | SEMICONDUCTOR DEVICE HAVING A CHARGED INSULATING LAYER - A semiconductor device comprises a substrate, an active layer over the substrate, and an insulating layer between the substrate and the active layer. The insulating layer is doped with one of positive charge and negative charge and configured to establish an electric field across the active layer when the semiconductor device is powered. | 12-17-2015 |
20160027897 | METHOD OF MAKING A STRAINED STRUCTURE OF A SEMICONDUCTOR DEVICE - A method of fabricating a field effect transistor (FET) includes forming a channel portion over a first surface of a substrate, wherein the channel portion comprises germanium and defines a second surface above the first surface. The method further includes forming cavities that extend through the channel portion and into the substrate. The method further includes epitaxially-growing a strained material in the cavities, wherein the strained material comprises SiGe, Ge, Si, SiC, GeSn, SiGeSn, SiSn or a III-V material. | 01-28-2016 |
Patent application number | Description | Published |
20080303102 | Strained Isolation Regions - An isolation trench having localized stressors is provided. In accordance with embodiments of the present invention, a trench is formed in a substrate and partially filled with a dielectric material. In an embodiment, the trench is filled with a dielectric layer and a planarization step is performed to planarize the surface with the surface of the substrate. The dielectric material is then recessed below the surface of the substrate. In the recessed portion of the trench, the dielectric material may remain along the sidewalls or the dielectric material may be removed along the sidewalls. A stress film, either tensile or compressive, may then be formed over the dielectric material within the recessed portion. The stress film may also extend over a transistor or other semiconductor structure. | 12-11-2008 |
20100022061 | Spacer Shape Engineering for Void-Free Gap-Filling Process - A method of forming a semiconductor device includes providing a semiconductor substrate; forming a gate stack on the semiconductor substrate; forming a gate spacer adjacent to a sidewall of the gate stack; thinning the gate spacer; and forming a secondary gate spacer on a sidewall of the gate spacer after the step of thinning the gate spacer. | 01-28-2010 |
20100291751 | METHOD FOR FABRICATING AN ISOLATION STRUCTURE - The invention relates to integrated circuit fabrication, and more particularly to an electronic device with an isolation structure made having almost no void. An exemplary method for fabricating an isolation structure, comprising: providing a substrate; forming a trench in the substrate; partially filling the trench with a first silicon oxide; exposing a surface of the first silicon oxide to a vapor mixture comprising NH3 and a fluorine-containing compound; heating the substrate to a temperature between 100° C. to 200° C.; and filling the trench with a second silicon oxide, whereby the isolation structure made has almost no void. | 11-18-2010 |
20120025329 | Spacer Shape Engineering for Void-Free Gap-Filling Process - A method of forming a semiconductor device includes providing a semiconductor substrate; forming a gate stack on the semiconductor substrate; forming a gate spacer adjacent to a sidewall of the gate stack; thinning the gate spacer; and forming a secondary gate spacer on a sidewall of the gate spacer after the step of thinning the gate spacer. | 02-02-2012 |
20130056837 | SELF-ALIGNED INSULATED FILM FOR HIGH-K METAL GATE DEVICE - A method of making an integrated circuit includes providing a semiconductor substrate and forming a gate dielectric over the substrate, such as a high-k dielectric. A metal gate structure is formed over the semiconductor substrate and the gate dielectric and a thin dielectric film is formed over that. The thin dielectric film includes oxynitride combined with metal from the metal gate. The method further includes providing an interlayer dielectric (ILD) on either side of the metal gate structure. | 03-07-2013 |
20130099350 | Semiconductor Device and Method of Manufacture - A system and method for forming an isolation trench is provided. An embodiment comprises forming a trench and then lining the trench with a dielectric liner. Prior to etching the dielectric liner, an outgassing process is utilized to remove any residual precursor material that may be left over from the deposition of the dielectric liner. After the outgassing process, the dielectric liner may be etched, and the trench may be filled with a dielectric material. | 04-25-2013 |
20130137251 | Uniform Shallow Trench Isolation Regions and the Method of Forming the Same - A method includes performing a plasma treatment on a first surface of a first material and a second surface of a second material simultaneously, wherein the first material is different from the second material. A third material is formed on treated first surface of the first material and on treated second surface of the second material. The first, the second, and the third materials may include a hard mask, a semiconductor material, and an oxide, respectively. | 05-30-2013 |
20130171803 | METHOD FOR FABRICATING AN ISOLATION STRUCTURE - A method of fabricating an isolation structure including forming a trench in a top surface of a substrate and partially filling the trench with a first oxide, wherein the first oxide is a pure oxide. Partially filling the trench includes forming a liner layer in the trench and forming the first oxide over the liner layer using silane and oxygen precursors at a pressure less than 10 milliTorr (mTorr) and a temperature ranging from about 500° C. to about 1000° C. The method further includes producing a solid reaction product in a top portion of the first oxide. The method further includes sublimating the solid reaction product by heating the substrate in a chamber at a temperature from 100° C. to 200° C. and removing the sublimated solid reaction product by flowing a carrier gas over the substrate. The method further includes filling the trench with a second oxide. | 07-04-2013 |
20130221443 | FINFETS AND METHOD OF FABRICATING THE SAME - The disclosure relates to a fin field effect transistor (FinFET). An exemplary structure for a FinFET comprises a substrate comprising a major surface; a plurality of first trenches having a first width and extending downward from the substrate major surface to a first height, wherein a first space between adjacent first trenches defines a first fin; and a plurality of second trenches having a second width less than first width and extending downward from the substrate major surface to a second height greater than the first height, wherein a second space between adjacent second trenches defines a second fin. | 08-29-2013 |
20130221448 | FIN PROFILE STRUCTURE AND METHOD OF MAKING SAME - A FinFET device may include a first semiconductor fin laterally adjacent a second semiconductor fin. The first semiconductor fin and the second semiconductor fin may have profiles to minimize defects and deformation. The first semiconductor fin comprises an upper portion and a lower portion. The lower portion of the first semiconductor fin may have a flared profile that is wider at the bottom than the upper portion of the first semiconductor fin. The second semiconductor fin comprises an upper portion and a lower portion. The lower portion of the second semiconductor fin may have a flared profile that is wider than the upper portion of the second semiconductor fin, but less than the lower portion of the first semiconductor fin. | 08-29-2013 |
20130277760 | Dummy FinFET Structure and Method of Making Same - A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET. | 10-24-2013 |
20130330906 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION - A method of fabricating a semiconductor IC is disclosed. The method includes receiving a device. The device includes a semiconductor substrate, a plurality of fins and trenches between fins in the semiconductor substrate. The method also includes filling the trenches with a dielectric material to form shallow trench isolations (STI), applying a low-thermal-budget annealing to the dielectric material, and applying a wet-treatment to the dielectric material. | 12-12-2013 |
20140242775 | METHOD OF FABRICATING FINFETS - The disclosure relates to a method of fabricating a semiconductor device including forming a patterned hardmask layer over a substrate comprising a major surface. The method further includes forming a plurality of first trenches and a plurality of second trenches performed at an electrostatic chuck (ESC) temperature between about 90° C. to 120° C. in the substrate. The plurality of first trenches have a first width and extend downward from the substrate major surface to a first height, and the plurality of second trenches have a second width less than first width and extend downward from the substrate major surface to a second height greater than the first height. | 08-28-2014 |
20160064234 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes etching a substrate to form a plurality of first trenches and a plurality of second trenches performed at an electrostatic chuck (ESC) temperature between about 90° C. to 120° C. in the substrate, wherein each trench of the plurality of first trenches extends downward from the substrate major surface to a first height, and each trench of the plurality of second trenches extends downward from the substrate major surface to a second height greater than the first height. The method includes forming a first isolation structure in each of the plurality of first trenches. The method includes forming a second isolation structure in each of the plurality of second trenches, wherein a difference between a height of the first isolation structure and the first height equals a difference between a height of the second isolation structure and the second height. | 03-03-2016 |
Patent application number | Description | Published |
20130237219 | FREQUENCY ADJUSTMENT METHOD - A frequency adjustment method is provided for adjusting a frequency of a reference oscillating signal from an initial oscillation frequency to an adjusted oscillation frequency. The frequency adjustment method includes steps of: dividing a frequency scan section into M scan frequencies; down-converting a signal according to the M scan frequencies to obtain M down-converted signals; performing a correlation calculation operation on the M down-converted signals, respectively, to obtain M correlation results; grouping the M scan frequencies into N frequency groups each containing P selected frequencies, with the P selected frequencies corresponding to P consecutive scan frequencies; performing a group calculation on the N frequency groups, respectively, to obtain N group calculation results; and selecting a target frequency group from the N frequency groups according to the N group calculations results, and obtaining the adjusted oscillation frequency from the target frequency group. | 09-12-2013 |
20140073315 | METHOD FOR ESTIMATING FREQUENCY DIFFERENCE - A method for estimating a frequency difference between a transmission terminal and a reception terminal according to a reception signal is provided. The method includes steps of: in a first period, receiving and storing a first part of the reception signal; in a second period, frequency shifting the first part of the reception signal according to an L number of sweep frequencies, and correspondingly obtaining multiple first part correlation results, where L is a positive integer; in the second period, receiving and storing a second part of the reception signal; in a third period, frequency shifting the second part of the reception signal according to the L number of sweep frequencies, and correspondingly obtaining multiple second part correlation results; and estimating the frequency difference according to the first and second part correlation results. | 03-13-2014 |
Patent application number | Description | Published |
20120244408 | WEARABLE BATTERY SET - A wearable battery set is provided. The wearable battery set comprises a buckle and a flexible battery unit. The buckle has a control circuit. The flexible battery is disposed on the side of the buckle and connects to the control circuit electrically. The flexible battery unit is adapted to be bent into a ring, and the buckle is configured to keep the flexible battery unit in the ring form so that the wearable battery set can be worn by a user. The control circuit of the buckle is configured to control the output power of the flexible battery unit so that the wearable battery set is able to provide the output power to an electronic device via the control circuit of the buckle. | 09-27-2012 |
20120265025 | WEARING STRUCTURE FOR MEASURING PHYSIOLOGICAL SIGNAL - A wearing structure for measuring a physiological signal is provided. The wearing structure includes a sensing layer, a liquid storing layer and a cover layer. The sensing layer has at least one sensor for sensing the physiological signal of a user. The liquid storing layer covers the sensing layer and stores an electrically conductive liquid. The cover layer covers the storing layer for preventing loss of the electrically conductive liquid. The liquid storing layer is disposed between the sensing layer and the cover layer. The electrically conductive liquid is used for enhancing the sensing of the physiological signal of the user by the at least one sensor. | 10-18-2012 |
20130153264 | WOVEN ELECTRICAL CONNECTION STRUCTURE - A woven electrical connection structure including a first conductive yarn, a conductor and a fastening string is provided. The conductor is directly stacked on and electrically connected to the first conductive yarn. The fastening string can be further applied to sew the conductor on the first conductive yarn. Additionally, the conductor can also be replaced by a second conductive yarn. Similarly, the second conductive yarn can be stacked on or wound around the first conductive yarn to make an electrical connection. The fastening wire can be applied to sew the first conductive yarn and the second conductive yarn together. | 06-20-2013 |
20130250604 | LIGHT BAR-COMBINED REMOVABLE ZIPPER - The present invention relates to a light bar-combined removable zipper, which includes a first tape, a second tape, a light bar, and a controller. The second tape has an edge joinable to an edge of the first tape to constitute a removable zipper structure. The light bar is combined to the second tape. The controller is connected to the light bar to supply electrical power to and selectively activate/deactivate the lighting of the light bar. | 09-26-2013 |
20130292172 | ELECTRONICALLY-CONTROLLABLE WOVEN ARTICLE WITH RECEPTACLE STRUCTURE - The present invention relates to an electronically-controllable woven article with receptacle structure for electrically connecting at least one electronic unit. The electronically-controllable woven article includes a first metal yarn strand; a second metal yarn strand, which is arranged at one side of the first metal yarn strand in a side-by-side manner; at least one receptacle structure, which forms a receiving space corresponding to the electronic unit, the first metal yarn strand and the second metal yarn strand extending into the receiving space, the first metal yarn strand having a section corresponding to the receiving space, the second metal yarn strand having a section corresponding to the receiving space, both sections coupled to the receptacle structure; and a power supply unit, which is electrically connected to the first metal yarn strand and the second metal yarn strand. | 11-07-2013 |
20140203912 | RADIO FREQUENCY IDENTIFICATION TAG - A radio frequency identification (RFID) tag includes a substrate; an RFID chip, which is mounted on the substrate; and at least one external communication antenna, which transmits signals with respect to the RFID chip in a wireless manner and is spaced therefrom by a predetermined distance. With the transmission of signals between the external communication antenna and the RFID chip in a wireless manner, the durability and easiness of use of the RFID tag are improved. | 07-24-2014 |
20140242868 | MOISTURE-RETAINING AND ELECTRICALLY CONDUCTIVE STRUCTURE - A moisture-retaining and electrically conductive structure includes at least one electrically conductive textile unit and at least one moisture-retaining textile unit, wherein the electrically conductive textile unit and the moisture-retaining textile unit are interlaced and woven together to form a planar structure. With such a structure, fabric of the same layer can provide both functions of moisture retention and electrical conduction and may improve the lifespan and electrical conductivity. | 08-28-2014 |
20140242869 | STRUCTURE OF THREE-DIMENSIONAL ELECTRICALLY CONDUCTIVE FABRIC - A structure of three-dimensional electrically conductive fabric includes a resilient conductive tissue, a foundation tissue, and a support tissue. The support tissue is arranged between and connects the resilient conductive tissue and the foundation tissue. The resilient conductive tissue, the foundation tissue, and the support tissue are unitarily combined through knitting to form the structure of three-dimensional electrically conductive fabric. | 08-28-2014 |
20140243639 | MOISTURE-RETAINING AND ELECTRICALLY CONDUCTIVE STRUCTURE - An improved moisture-retaining and electrically conductive structure includes a plurality of moisture-retaining and electrically conductive yarns that is woven to form a planar structure, wherein each of the moisture-retaining and electrically conductive yarns is formed by blending a plurality of electrically conductive fibers and a plurality of moisture-retaining fibers. With such a structure, fabric of the same layer can provide both functions of moisture retention and electrical conduction and may improve the lifespan and electrical conductivity. | 08-28-2014 |
Patent application number | Description | Published |
20090026471 | LIGHT-SCATTERING STRUCTURE, LIGHT EMITTING DEVICE COMPRISING THE SAME AND METHOD OF FORMING THE SAME - A light-scattering structure with micron-scale or submicron-scale protruding portions is provided to improve the light extraction efficiency of light emitting devices. The protruding portions function as scattering sites and can be assembled closely. A method of forming a light-scattering structure is also provided, wherein all the conventional substrate materials can be used for the substrate of the light-scattering structure, and scattering sites of submicron-scale, micron-scale or larger size can be fabricated. | 01-29-2009 |
20110149399 | ANTI-REFLECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME - The embodiment provides an antireflection structure and a method for fabricating the same. The antireflection structure includes a substrate having a plurality of protruding structures adjacent to one another, thereby allowing light to transmit through. And a dielectric structural layer covers a plurality of the protruding structures. | 06-23-2011 |
20120194900 | SECOND-HARMONIC GENERATION NONLINER FRENQUENCY CONVERTER - A second-harmonic generation nonlinear frequency converter includes a nonlinear optical crystal. The nonlinear optical crystal includes a plurality of sections. The sections connect to each other in sequence, and each section has a phase different from others. Each of the phases includes a positive domain and a negative domain. Each of the sections includes a plurality of quasi-phase-matching structures. The quasi-phase-matching structures connect to each other in sequence and have the same phase in one section. | 08-02-2012 |
20120228655 | LIGHT EMITTING DIODE WITH LARGE VIEWING ANGLE AND FABRICATING METHOD THEREOF - A light emitting diode includes a substrate, a plurality of pillar structures, a filler structure, a transparent conductive layer, a first electrode, and a second electrode. These pillar structures are formed on the substrate. Each of the pillar structures includes a first type semiconductor layer, an active layer, and a second type semiconductor layer. The first type semiconductor layers are formed on the substrate. The pillar structures are electrically connected with each other through the first type semiconductor layers. The filler structure is formed between the pillar structures. The filler structure and the second type semiconductor layers of the pillar structures are covered with the transparent conductive layer. The first electrode is in contact with the transparent conductive layer. The second electrode is in contact with the first type semiconductor layer. | 09-13-2012 |
Patent application number | Description | Published |
20130234440 | SEA WAVE POWER GENERATION EQUIPMENT - A sea wave power generation equipment includes a floating body, a frame, a plurality of rotating shafts, a plurality of first gear wheels, at least one fixing base, a generator, a transmission shaft, a plurality of second gear wheels, a plurality of collision boards, and a plurality of ratchet structures. Each of the collision boards includes a rotation portion and a board body. Each of the ratchet structures includes a pawl portion and a ratchet portion including a plurality of teeth. When the board bodies are collided with a sea wave in a direction, each of the pawl portions hooks one of the teeth of one of the ratchet portions. When the board bodies are collided with another sea wave in another direction reverse to the direction, each of the pawl portions slides a portion of the teeth of one of the ratchet portions. | 09-12-2013 |
20140083125 | WIND-POWERED FRESH WATER GENERATOR - A wind-powered fresh water generator is provided. The wind-powered fresh water generator includes a wind rotation module disposed on a beam, a cooling and fresh water generating module connected to the wind rotation module, and a water collecting system disposed below the cooling and fresh water generating module. The wind-powered rotation module provides a rotation motive power to the cooling and fresh water generating module. The water generated by the cooling and fresh water generating module is collected by the water collecting system. | 03-27-2014 |
20160029576 | TREE TRIMMING APPARATUS - A tree trimming apparatus includes a movable carrier, a shredder device, a transmission hose, and a support stand. The movable carrier has a container. The shredder device includes a housing, a plurality of cutters, and a motor. The housing has a through hole. The cutters are rotatably positioned in the housing. The motor is located on the housing and is connected to the cutters. The transmission hose has a first end portion and a second end portion. The first end portion is connected to the through hole, and the second end portion is aligned with the container. The support stand is connected between the movable carrier and the shredder device. When the cutters contact a branch, the branch is cut and enters the housing, and falls into the container through the through hole and the transmission hose. | 02-04-2016 |
Patent application number | Description | Published |
20100201638 | OPERATION METHOD OF TOUCH PAD WITH MULTIPLE FUNCTION MODES, INTEGRATION SYSTEM THEREOF, AND COMPUTER PROGRAM PRODUCT USING THE OPERATION METHOD - A touch pad operation method with multiple function modes, an integration system, and a computer program product are provided. A first signal is received and whether the first signal conforms to a trigger condition is determined. If the first signal conforms to the trigger condition and exists continuously, the touch pad is switched from a first function mode to a second function mode and maintained therein. The second function mode includes a plurality of functions of a second kind, and each of these functions is respectively corresponding to an area on the touch pad. When a second signal is received through the touch pad and the first signal still exists, one of the second kind of functions is executed according to a coordinate variation corresponding to the second signal. Thereby, the functionality of the touch pad is not limited by its original settings and the convenience of operation is increased. | 08-12-2010 |
20130264727 | FILM TRANSFER METHOD AND APPEARANCE MEMBER MANUFACTURED BY USING THE SAME - A film transfer method is provided and includes the following steps: A mold apparatus is provided. In a mold cavity of the mold apparatus, a film substrate having a three-dimensional texture layer is provided. A melted plastic is injected into the mold cavity, such that the melted plastic covers the three-dimensional texture layer of the film substrate. The melted plastic is solidified. The solidified plastic is separated from the three-dimensional texture layer of the film substrate. | 10-10-2013 |
20160091927 | ELECTRONIC DEVICE - An electronic device includes a first machine body and a second machine body adapted to be detachably assembled to the first machine body. The first machine body includes a first casing, a first hinge fixed to a side of the first casing, a second hinge pivoted to the first hinge along an axis, and a first connecting member disposed at the side and linked to the second hinge. The first and the second hinges are covered by the first casing. The second machine body includes a second casing and a second connecting member. When the first machine body is assembled to the second machine body, the first connecting member is fixed to the second connecting member, the second hinge is fixed jointly so that the first hinge is rotatable related to the second hinge. Accordingly, the first casing is rotatable related to the second casing. | 03-31-2016 |
Patent application number | Description | Published |
20150039802 | SERIAL-PARALLEL INTERFACE CIRCUIT WITH NONVOLATILE MEMORY - A serial-parallel interface circuit with nonvolatile memories is provided. A control module generates a plurality of control signals, wherein the control signals include readout and write-in control signals and memory programming control signals. An input terminal receives a plurality of digital data from external. The digital data are transmitted to the input terminal serially. Memory modules are coupled to the input terminal and receive the control signals from the control module. The input terminal transmits the digital data to the memory modules. One of the memory modules includes a memory unit, and the memory unit stores or transmits one bit of the digital data based on a high voltage control signal and a memory control signal. A plurality of output signal lines are respectively coupled to the memory modules. The memory unit transmits the one bit of the digital data to one of the output signal lines. | 02-05-2015 |
20150042358 | Dielectric Constant Measurement Circuit and Dielectric Constant Measurement Method - A dielectric constant measurement circuit includes a dielectric constant sensor, an oscillator controlling circuit, a waveform converting circuit, and a counting readout circuit. The oscillator controlling circuit generates an oscillation waveform according to the response of the dielectric constant sensor to a dielectric material. The waveform converting circuit converts the oscillation waveform into frequency division square waves. The counting readout circuit includes a switching counter, a switching circuit, a reference current source, and a current integrator. The reference current source charges the current integrator through the switching circuit controlled by the frequency division square waves, and the switching counter counts the number of the turned-on states of the switching circuit and stops counting the number of the turned-on states when a value of the output voltage from the current integrator reaches a value of the reference voltage, and the number of the turned-on states is related to the oscillation frequency. | 02-12-2015 |
20150200635 | OPERATIONAL TRANSCONDUCTANCE AMPLIFIER, RECONFIGURABLE FULLY DIFFERENTIAL VOLTAGE SENSING AMPLIFIER AND RECONFIGURABLE FULLY DIFFERENTIAL CAPACITIVE SENSING AMPLIFIER - An operational transconductance amplifier includes a cascode differential-pair amplifying circuit, a bias driving circuit, and a common mode feedback circuit. The cascode differential-pair amplifying circuit is configured for receiving a differential input voltage and for providing a differential output voltage. The bias driving circuit is configured for providing a first bias current to drive the cascode differential-pair amplifying circuit and for adjusting the transconductance of the transconductance amplifier. The bias driving circuit includes a first floating-gate transistor. The first floating-gate transistor is configured for adjusting the first bias current. The common mode feedback circuit is configured for adjusting a second bias current of the cascode differential-pair amplifying circuit according to the differential output voltage so that the differential output voltage is stabilized. A reconfigurable fully differential voltage sensing amplifier and a reconfigurable fully differential capacitive sensing amplifier are disclosed herein as well. | 07-16-2015 |
20150200648 | OPERATIONAL TRANSCONDUCTANCE AMPLIFIER, OPERATIONAL TRANSCONDUCTANCE AMPLIFIER-CAPACITOR FILTER AND HIGH ORDER RECONFIGURABLE ANALOG FILTER - An operational transconductance amplifier includes a fully-differential amplifying circuit, a bias driving circuit, and a common mode feedback circuit. The fully-differential amplifying circuit is configured for receiving a differential input voltage and providing a differential output voltage. The fully-differential amplifying circuit includes a plurality of diffusor-differential-pair circuits. The bias driving circuit is configured for providing at least one first bias current to drive the fully-differential amplifying circuit and adjust the transconductance of the transconductance amplifier. The common mode feedback circuit is configured for stabilizing the differential output voltage. An operational transconductance amplifier-capacitor (OTA-C) filter and a high order filter are disclosed herein as well. | 07-16-2015 |
Patent application number | Description | Published |
20120126617 | INDUSTRIAL COMPUTER SET, POWER CABINET AND SYSTEM CABINET - An industrial computer set is provided and includes a power cabinet and a plurality of system cabinets. The power cabinet includes a power conversion module and a power cable distribution tray. The power conversion module is coupled between mains electricity and the power cable distribution tray. The power conversion module is used for converting a high-voltage AC power into a high-voltage DC power. Each of the system cabinets includes a plurality of system units and a shunt module. The shunt module is coupled between the power cable distribution tray and the system units. The shunt module receives the high-voltage AC power from the power cable distribution tray, and shunts the high-voltage AC power to the system units. | 05-24-2012 |
20120134087 | RACK SERVER DEVICE - A rack server device includes a rack, a plurality of servers, and a plurality of power distribution units (PDU). The servers are configured on the rack. Each of the servers includes a power supply, and the power supply includes a plug. The plug includes a positive pin, a negative pin, a ground pin, and a signal pin, wherein the signal pin is shorter than the positive pin, the negative pin and the ground pin. The PDUs are configured on the rack. Each of the PDUs includes a socket. The socket includes a positive connecting port, a negative connecting port, a ground connecting port, and a signal connecting port. The positive connecting port, the negative connecting port, the ground connecting port, and the signal connecting port are operable to connect to the positive pin, the negative pin, the ground pin, and the signal pin respectively. | 05-31-2012 |
20120134090 | SERVER COMPUTER SET - This invention discloses a server computer set, which includes a power cabinet, at least one system cabinet, a first battery backup module and a second battery backup module. The power cabinet provides a high-voltage direct current (DC) power. The system cabinet includes a plurality of system units. The system cabinet shunts the high-voltage DC power to the system units. Each system unit includes a transformer and an internal circuit. The transformer is used for transforming the high-voltage DC power to a low-voltage DC power, which is used for driving the internal circuit. The first battery backup module is coupled between the power cabinet and the at least one system cabinet for providing a backup high-voltage DC power. The second battery backup module is disposed in the system units and coupled between the transformers and the internal circuits for providing a backup low-voltage DC power. | 05-31-2012 |
20140354061 | POWER SUPPLY DEVICE AND SWITCH METHOD THEREOF - A power supply device includes a power supply unit, a switch unit, a discharge unit and a control unit. The power supply unit is for receiving a first power or a second power, for outputting a third power. The switch unit is coupled to the power supply unit, for receiving the first power and the second power and outputting one of them. The discharge unit is coupled to the power supply unit, for performing a discharge to the power supply unit based on a control signal. The control unit controls the switch unit for stopping outputting the first power to the power supply unit. The control unit generates the control signal so the discharge unit performs the discharge to the power supply unit for lowering the voltage of the power supply unit. The control unit controls the switch unit for outputting the second power to the power supply unit. | 12-04-2014 |
Patent application number | Description | Published |
20140010265 | TIRE TEMPERATURE AND TIRE PRESSURE WIRELESS SENSING DEVICE - A tire temperature and tire pressure wireless sensing device is provided, which includes a housing, a valve body, a power supply module, a circuit board and a transmission antenna. The power supply module is disposed on the fixed seat of the housing, and the circuit board includes a wireless transmission module and a sensing module thereon. The sensing module is disposed corresponding to an air-intake through hole of the bottom seat of the housing. The valve body is engaged with the air-intake through hole and one end of the transmission antenna is disposed in an antenna slot. | 01-09-2014 |
20150217606 | Wireless Sensor for Sensing Temperature and Pressure within Dual Passage - Disclosed is a wireless sensor for sensing temperature and pressure within a dual passage shell. The wireless sensor comprises a dual passage shell, an intake valve, an exhaust valve, a power supplying module, and a circuit board. The dual passage shell includes a cover, a base body, and a fixing receptacle. A receiving space is formed by assembling the cover and the base body. An air chamber is formed by disposing the fixing receptacle in the receiving space and by combining the base body. The base body is provided with an intake passage and an exhaust passage both communicating with the air chamber. The intake valve is provided and integrally formed within the intake passage. The exhaust valve is provided and integrally formed with the exhaust passage. Thus, a user can inflate the tire without disassembling wireless sensor, and the usage convenience of the wireless sensor is enhanced. | 08-06-2015 |
Patent application number | Description | Published |
20090138540 | File Conversion System and Method Used Thereby - This invention is to provide a file conversion system capable of transmitting via a network a file provided by a file providing end in a format supported by a file receiving end to the file receiving end, the file conversion system comprising a receiving module for receiving the file provided by the file providing end; a conversion module for converting the format of the file provided by the file providing end into a format supported by the file receiving end; a database module for recording a profile of the file receiving end, the profile comprising the format supported by the file receiving end; and a transmission module for transmitting the file to the file receiving end via the network, wherein if the format of the file is not supported by the file receiving end, the conversion module may, in accordance with the profile of the file receiving end, convert the format of the file into the format supported by the file receiving end so as to allow the transmission module to transmit the file to the file receiving end. | 05-28-2009 |
20110145440 | Method of distributed computing electronic device and system applying the method - A distributed computing method for a distributed computing system which converts the data of a data-providing end into a format supported by a data-receiving end is disclosed. The distributed computing system comprises a plurality of processing elements, and the method comprises the steps of: recording a first profile of the data-receiving end; determining whether the data-receiving end supports the data of the data-providing end; if not, processing the data of the data-providing end into a format supported by the data-receiving end; and transmitting the processed data to the data-receiving end. The step of processing the data of the data-providing end into a format supported by the data-receiving end further comprises the steps of: partitioning the data into a plurality of sub-data; and assigning the plurality of sub-data to the plurality of processing elements for computing. | 06-16-2011 |
20120017076 | Method of Customizing An Operating Configuration of a Portable Electronic Device and System Using the Method - A method of customizing an operating configuration of a portable electronic device and a system using the method are disclosed. The method is used for a server, the server comprises a device database, and the server is provided to the portable electronic device for logging in through a communication network and operating software. The method comprises the steps of: accepting the portable electronic device login; determining whether the device database comprising a device profile of the portable electronic device; and if yes, generating operating configuration information, wherein the operating configuration information comprises the operating configuration of altering the operating configuration of the portable electronic device. | 01-19-2012 |
Patent application number | Description | Published |
20140119905 | FAN STRUCTURE - A fan structure includes a casing, a fan, and two elastic members. The casing has an accommodation space. The fan is located in the accommodation space. The fan has a first side and a second side opposite to each other. One of the two elastic members is sandwiched between the casing and the first side of the fan. The other one of the two elastic members is sandwiched between the casing and the second side of the fan. The two elastic members normally keep the fan away from the casing, so as to make the fan contact the casing through the two elastic members, thereby achieving a damping effect. | 05-01-2014 |
20140140816 | FAN MODULE - A fan module includes a casing, a fan, and two vibration absorption assemblies. The casing has an accommodating space. The fan is located in the accommodating space and keeps a distance from the casing. Each of the two vibration absorption assemblies includes two first vibration absorption components and a second vibration absorption component. The two first vibration absorption components are respectively in contact with the fan and separated from the casing, respectively. The second vibration absorption component is connected with two first vibration absorption components and the casing, respectively. The first vibration absorption components and the second vibration absorption components are adapted for absorbing the vibration waves having different frequency ranges. | 05-22-2014 |
20150099137 | BASE FRAME - A base frame includes a base plate, a first side plate, and a second side plate. The base plate has a first edge and a second edge. The base plate includes a plurality of V-shaped reinforcing ribs. Each V-shaped reinforcing rib has a first end and a second end. The first and second ends are located at the first and second edges, respectively. The first side plate is connected to the first edge and has a plurality of first through holes. Each first through hole is locationally configured next to the first edge and faces to the corresponding first end. The second side plate is connected to the second edge and has a plurality of second through holes. Each second through hole is locationally configured next to the second edge and faces to the corresponding second end. | 04-09-2015 |
20150101389 | METAL PLATE REINFORCEMENT METHOD - A metal plate reinforcement method includes: (a) providing a metal plate, in which the metal plate has a first surface and a second surface opposite to each other; (b) stamping the metal plate to form a plurality of first protruding portions protruding from the first surface; (c) respectively stamping the first protruding portions so as to respectively form a plurality of second protruding portions protruding at the second surface; and (d) flattening the second protruding portions to restore the metal plate. | 04-16-2015 |
20150151504 | PLASTIC BEZEL - A plastic bezel is disclosed. The plastic bezel includes a plate body and a plurality of bosses connected to the plate body. The plate body has a plate thickness. Each of the bosses has an opening and an accommodating hole inwardly formed from the opening. The accommodating hole is configured to engage an insert nut of which the type is #6-32. Each of the bosses has a wall thickness. The wall thickness is equal to or larger than 1.5 mm, and the plate thickness is 1.6-2 times of the wall thickness. | 06-04-2015 |