Patent application number | Description | Published |
20080212325 | LED LAMP WITH HEAT DISSIPATION MECHANISM AND MULTIPLE LIGHT EMITTING FACES - An LED lamp with heat dissipation mechanism having double heat pipe and tridimensional LEDs arrangement is disclosed. The lamp is composed of a heat-dissipation unit, a heat pipe whose one end is mounted on the heat-dissipation unit, a plurality of LED units mounted on an outer surface of the heat pipe, a fin module encompassing the heat-dissipation unit and a reflector mounted on a bottom of the heat-dissipation unit. The heat-dissipation unit has two basin-like casings. The LED units on the heat pipe are towards the reflector. Thus the reflector concentrates the light from the LED units. | 09-04-2008 |
20080258157 | Packaging Method Of LED Of High Heat-Conducting Efficiency And Structure Thereof - A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed. | 10-23-2008 |
20080298062 | LED ILLUMINATION DEVICE - An LED illumination device includes a die casting lamp cover, a plurality of LED modules, a reflection cover, and a transparent module. A top surface of the die casting lamp cover protrudes forth to form a plurality of heat dissipating fins, and the LED modules are assembled in an accommodating room of the die casting lamp cover. The LED modules respectively include a LED lamp assembly and an isothermal vapor chamber. The reflection cover includes a plurality of openings surroundingly arranged on outside of the LED modules correspondingly. The transparent module are arranged under the die casting lamp cover and enclosed in the accommodating room. The LED illumination device can uniformly disperse light beams from the LED modules to outside for reducing energy loss, and further can efficiently dissipate heat to reduce chances of damaging the LEDs because of high temperature. | 12-04-2008 |
20080299360 | METHOD FOR MANUFACTURING TAG INTEGRATED CIRCUIT FLEXIBLE BOARD AND STRUCTURE OF THE SAME - In a method for manufacturing a tag integrated circuit flexible board, first a copper foil, an insulating heat-conductive material and a base material coated with an adhesive layer are prepared. After being treated by a hot-pressing process, the copper foil, the insulating heat-conductive material and the base material are combined together to form a continuous band-like or sheet-like copper foil flexible board. A photo-etching process is performed to etch the cooper foil. The surface of the insulating heat-conductive material is formed with a conductive circuit layer formed of a plurality of sections of circuits. The surface of the plurality of sections of circuits is plated with a silver metallic layer. Electronic components are soldered on the circuits and an outer covering body is packaged thereon. Finally, the copper foil flexible board is cut, so that the base material has a plurality of integrated circuit flexible boards thereon. | 12-04-2008 |
20080299688 | METHOD OF BONDING A SOLDER TYPE LIGHT EMITTING DIODE CHIP - In a method of bonding a low-resistance solder type light emitting diode chip, a copper substrate is prepared; an insulating layer is coated on the copper substrate; a conductive layer is formed on the insulating layer; a solder paste is coated onto the conductive layer by silk screen printing; a the chip is placed on the conductive layer and heated to melt the solder paste coated between the conductive layer and the chip; and finally the copper substrate is cooled such that the solder paste forms a solder layer to mount the chip onto the conductive layer. | 12-04-2008 |
20080310129 | STRUCTURE OF TAG INTEGRATED CIRCUIT FLEXIBLE BOARD - A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board includes an insulating heat-conductive material, and a conductive circuit layer provided on a surface of the insulating heat-conductive material and formed of a plurality of sections of circuits. | 12-18-2008 |
20090272987 | Structure Of LED Of High Heat-Conducting Efficiency - A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed. | 11-05-2009 |
20090302778 | SWITCHING LED DRIVER CIRCUIT - An LED driver circuit sequentially and repeatingly switches a plurality of LED arrays to result in blink with high frequency. A PWM generator outputs n series of high frequency periodic PWM signals. The period (T) and duty cycle (d) of each series of PWM signal are the same as each other, but pulse portions of the PWM signals sequentially follow over time, i.e. d=1/n. Each PWM signal is sent to a dimming constant current source for separately outputting a driving power with the same timing as the input PWM signals to one of the LED arrays, so that the LED arrays make a high frequency blink. The blink frequencies of each and overall LED arrays are 1/T Hz and n/T Hz, respectively. The driving current of LEDs can be increased over a rated average forward current I | 12-10-2009 |
20090323343 | LAMP BASE IMPROVEMENT OF A STREET LAMP - An illumination device of a lamp base improvement of a street lamp to change the projection direction is disclosed. A lamp base formed a plurality of brackets inside. Bottoms of the brackets are longitudinally set to be slanted. Lighting modules corresponding to the brackets are disposed along the bottoms. A transparent mask is combined to the lamp base to cover those lighting modules. Whereby, it can provide an LED street lamp which can change the projection direction. | 12-31-2009 |
20100027263 | LIGHT EMITTING DIODE LIGHTING SET - A light emitting diode (LED) lighting set includes an aluminum extrusion radiating base, an LED module, a light focus plate, a diaphanous cover and two electrical connectors. The LED module has a substrate settled onto the radiating base and a plurality of LED lamps electrically connected onto the substrate. The light focus plate is fixed onto the radiating base and correspondingly formed under the LED lamps. The diaphanous cover connects the radiating base and correspondingly formed under the light focus plate. The electrical connectors separately connect two ends of the radiating base and also electrically connect the substrate. The aluminum extrusion radiating base, the diaphanous cover and the two electrical connectors define a closed space together, and the LED module and the light focus plate are received in the closed space; therefore, the LED lighting set has good heat dissipating performance and the usage life-span is greatly improved. | 02-04-2010 |
20100232155 | COMBINATION STRUCTURE OF LED LIGHTING DEVICE - An LED lamp with lower manufacturing costs is disclosed. The LED lamp includes a lamp set, a plurality of light-emitting modules and a transparent cover. The lamp set having an accommodating space is a barlike body composed of a lampshell and two covers. The lampshell is constituted by two lateral lampshells and one middle lampshell connected therebetween. The lateral lampshells and the middle lampshell are connected together by a fixing structure. The two covers seal the front and rear sides of the lamp set separately. Furthermore, plural light-emitting modules are installed on the interior surface of the lampshell, and the transparent cover is fixed to cover the lamp set. | 09-16-2010 |
20100327723 | LED ILLUMINATION DEVICE - A light emitting diode (LED) illumination device includes a vapor chamber, a circuit board and at least one LED. At least one protrusion is formed on a surface of the vapor chamber, and a heat conducting tin layer is formed on the protrusion. The circuit board includes at least one through hole for passing the protrusion. The circuit board is formed by sequentially stacking an insulating layer and a heat conducting layer. The LEDs are installed on and contacted with the protrusions respectively, and each LED has two pins electrically connected to the circuit board. The LED device of the present invention is in a direct contact with the protrusion of the LED, such that the heat dissipated from the LED can be conducted to the vapor chamber, and then the vapor chamber carries away the heat quickly. | 12-30-2010 |
20110007505 | LIGHT SOURCE MODULE AND LED STREET LAMP USING THE SAME - A light source module includes a base, at least one light emitting diode device, a reflector and a transparent plate. The light emitting diode device is arranged on the base. The reflector is arranged on the base and around the light emitting diode device. The transparent plate is arranged on the reflector and forms a plurality of Fresnel lens portions facing the light emitting diode device. The Fresnel lens portions are aligned along a predetermined direction. The invention further provides a street lamp having the abovementioned light source module. | 01-13-2011 |