Patent application number | Description | Published |
20080307383 | ITERATIVE SYNTHESIS OF AN INTEGRATED CIRCUIT DESIGN FOR ATTAINING POWER CLOSURE WHILE MAINTAINING EXISTING DESIGN CONSTRAINTS - An approach that iteratively synthesizes an integrated circuit design to attain power closure is described. In one embodiment, the integrated circuit design is initially synthesized to satisfy timing and power constraints. Results from the initial synthesis are fed back into the synthesis process where specific nodes in the circuit design are targeted to satisfy the timing and power constraints. Selected nodes in the circuit design are worked on in an iterative manner until it has been determined that all of selected nodes have undergone evaluation for satisfying timing and power constraints. Once all of the selected nodes have undergone evaluation for satisfying timing and power constraints, then a final netlist representing the circuit design is generated. | 12-11-2008 |
20090002015 | ERROR CORRECTING LOGIC SYSTEM - The invention includes an error correcting logic system that allows critical circuits to be hardened with only one redundant unit and without loss of circuit performance. The system provides an interconnecting gate that suppresses a fault in one of at least two redundant dynamic logic gates that feed to the interconnecting gate. The system is applicable to dynamic or static logic systems. The system prevents propagation of a fault, and addresses not only soft errors, but noise-induced errors. Also, there is provided a design structure embodied in a machine readable medium used in a design process, and which includes such error correcting logic system. | 01-01-2009 |
20090100398 | STRUCTURE FOR PERFORMING ITERATIVE SYNTHESIS OF AN INTEGRATED CIRCUIT DESIGN TO ATTAIN POWER CLOSURE - A design structure that performs iterative synthesis of an integrated circuit design to attain power closure is described. In one embodiment, the design structure is embodied in a computer readable medium and has the capability to initially synthesized an integrated circuit design to satisfy timing and power constraints. Results from the initial synthesis are fed back into the synthesis process where specific nodes in the circuit design are targeted to satisfy the timing and power constraints. Selected nodes in the circuit design are worked on in an iterative manner until it has been determined that all of selected nodes have undergone evaluation for satisfying timing and power constraints. Once all of the selected nodes have undergone evaluation for satisfying timing and power constraints, then a final netlist representing the circuit design is generated. | 04-16-2009 |
20090114913 | TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES - A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C | 05-07-2009 |
20090222772 | Power Gating Logic Cones - Power gating logic cones is described. In one embodiment a method includes synthesizing logic for an integrated circuit (IC) design; identifying low switching nodes within the logic that switch less than a threshold; determining a potential power gating cone (PGC) based on the identified low switching nodes; determining a power gating logic expression for the potential PGC that includes a minimum set of inputs to the potential PGC that are least switching; determining whether energy savings using the power gating logic expression meets a criteria; and accepting the potential PGC in response to meeting the criteria. | 09-03-2009 |
20090241079 | METHOD AND SYSTEM FOR ACHIEVING POWER OPTIMIZATION IN A HIERARCHICAL NETLIST - The invention generally relates to integrated circuit design, and more particularly to systems and methods for providing power optimization in a hierarchical netlist. A method includes generating a hierarchical netlist of the design, wherein the design includes a plurality of macros. The method also includes determining the timing slack of each path of the design. For each pin of each one of the plurality of macros, the method includes: determining the worst timing path; determining the slack value of the worst timing path; determining the subset of macros of the plurality of macros associated with the worst timing path; determining an apportionment parameter for each one of the subset of macros; determining a distribution of the slack amongst the subset of macros based upon the respective apportionment parameters; and adjusting timing assertions for each one of the subset of macros based upon the distribution of the slack. | 09-24-2009 |
20120262197 | TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES - A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer. | 10-18-2012 |
20120264241 | TEST STRUCTURE AND METHODOLOGY FOR THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES - A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer. | 10-18-2012 |
20130179853 | DOUBLE-SIDED INTEGRATED CIRCUIT CHIPS - A double-sided integrated circuit chips, methods of fabricating the double-sided integrated circuit chips and design structures for double-sided integrated circuit chips. The method includes removing the backside silicon from two silicon-on-insulator wafers having devices fabricated therein and bonding them back to back utilizing the buried oxide layers. Contacts are then formed in the upper wafer to devices in the lower wafer and wiring levels are formed on the upper wafer. The lower wafer may include wiring levels. The lower wafer may include landing pads for the contacts. Contacts to the silicon layer of the lower wafer may be silicided. | 07-11-2013 |
20130275110 | REDUCING REPEATER POWER - A method, system and computer-readable medium for reducing repeater power and crosstalk are provided. The method includes generating a model of a circuit including a plurality of original repeaters connected between at least one source and at least one sink, performing a power optimization analysis on the plurality of original repeaters to change the plurality of original repeaters to low-power repeaters based on predetermined optimization parameters, performing a crosstalk analysis on the model of the circuit including the low-power repeaters to determine whether a crosstalk timing violation exists, and changing at least one of the low-power repeaters to a higher-power repeater when it is determined that a crosstalk violation exists, and leaving the low-power repeaters in the model of the circuit when it is determined that a crosstalk violation does not exist. | 10-17-2013 |
20140088948 | REDUCING REPEATER POWER - A method, system and computer-readable medium for reducing repeater power and crosstalk are provided. The method includes generating a model of a circuit including a plurality of original repeaters connected between at least one source and at least one sink, performing a power optimization analysis on the plurality of original repeaters to change the plurality of original repeaters to low-power repeaters based on predetermined optimization parameters, performing a crosstalk analysis on the model of the circuit including the low-power repeaters to determine whether a crosstalk timing violation exists, and changing at least one of the low-power repeaters to a higher-power repeater when it is determined that a crosstalk violation exists, and leaving the low-power repeaters in the model of the circuit when it is determined that a crosstalk violation does not exist. | 03-27-2014 |