Oosterlaken
Theodorus Gerardus Maria Oosterlaken, Oudewater NL
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20080227267 | Stop mechanism for trench reshaping process - An opening, such as a trench, on a semiconductor substrate is annealed to smooth edges and corners of the opening. The anneal causes reflow of the material forming the walls of the opening, thereby smoothing out the edges and corners of the opening. After a desired amount of reflow is accomplished, the substrate is exposed to an oxidant such as O | 09-18-2008 |
20080319559 | Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured - A method and an apparatus for transferring a substantially flat and substantially circular objects, such as wafers, from a pick-up position to a delivery position, the apparatus comprising, a manipulator, at least one source for emitting a source signal, at least one sensor for sensing said source signal and for providing a sensor signal, a computing device arranged for processing at least one sensor signal to obtain data on the position of said object, the manipulator being arranged for simultaneously transferring a first and a second object along a path in a substantially parallel orientation, spaced apart from each other, and substantially co-axially whereby the central axis of each object may be displaced radially, a said source and a said sensor are connected by a virtual line, whereby the virtual line includes an angle with the central axes of the first and second objects. | 12-25-2008 |
Theodorus G.m. Oosterlaken, Almere NL
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20120304935 | BUBBLER ASSEMBLY AND METHOD FOR VAPOR FLOW CONTROL - Disclosed is a bubbler assembly. The bubbler assembly includes a vessel configured to contain a liquid source material and its vapor. It also includes a carrier gas supply line, a downstream end of which discharges in a lower portion of the vessel, and a gas outlet line, an upstream end of which is in fluid communication with an upper portion of the vessel. The gas outlet line includes a constriction. The bubbler assembly further includes a pressurizing gas supply line, a downstream end of which discharges in either the upper portion of the vessel or in the gas outlet line at a point upstream of the constriction. | 12-06-2012 |
20130017503 | WAFER PROCESSING APPARATUS WITH HEATED, ROTATING SUBSTRATE SUPPORTAANM De Ridder; Chris G.M.AACI AlmereAACO NLAAGP De Ridder; Chris G.M. Almere NLAANM Boonstra; Klaas P.AACI AlmereAACO NLAAGP Boonstra; Klaas P. Almere NLAANM Oosterlaken; Theodorus G.M.AACI AlmereAACO NLAAGP Oosterlaken; Theodorus G.M. Almere NLAANM Ravenhorst; Barend J. T.AACI AlmereAACO NLAAGP Ravenhorst; Barend J. T. Almere NL - A semiconductor substrate processing apparatus ( | 01-17-2013 |
20130085593 | MODULAR SEMICONDUCTOR PROCESSING SYSTEM - Disclosed is a modular semiconductor substrate processing system ( | 04-04-2013 |
20130284683 | WAFER BOAT - A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer. | 10-31-2013 |
20140060430 | SEMICONDUCTOR PROCESSING APPARATUS INCLUDING A PLURALITY OF REACTORS, AND METHOD FOR PROVIDING THE SAME WITH PROCESS GAS - A semiconductor processing apparatus ( | 03-06-2014 |
Theodorus G.m. Oosterlaken, Oudewater NL
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20150279693 | METHOD AND SYSTEM FOR DELIVERING HYDROGEN PEROXIDE TO A SEMICONDUCTOR PROCESSING CHAMBER - In some embodiments, a system is disclosed for delivering hydrogen peroxide to a semiconductor processing chamber. The system includes a process canister for holding a H | 10-01-2015 |
Theodorus G. M. Oosterlaken, Oudewater NL
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20100136772 | DELIVERY OF VAPOR PRECURSOR FROM SOLID SOURCE - A method is disclosed that uses solid precursors for semiconductor processing. A solid precursor is provided in a storage container. The solid precursor is transformed into a liquid state in the storage container. The liquid state precursor is transported from the storage container to a liquid holding container. The liquid state precursor is transported from the liquid holding container to a reaction chamber. The molten precursor allows the precursor to be metered in the liquid state. The storage container can be heated only when necessary to replenish the liquid holding container, thereby reducing the possibility of thermal decomposition of the precursor. | 06-03-2010 |
Theodorus G. M. Oosterlaken, Almere NL
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20150303079 | MODULAR VERTICAL FURNACE PROCESSING SYSTEM - A vertical furnace processing system for processing semiconductor substrates, comprising the following modules:—a processing module including a vertical furnace; an I/O-station module including at least one load port to which a substrate cassette is dockable; a wafer handling module configured to transfer semiconductor substrates between the processing module and a substrate cassette docked to the load port of the I/O-station module; and a gas supply module including at least one gas supply or gas supply connection for providing the vertical furnace of the processing module with process gas, wherein at least two of the said modules are mutually decouplably coupled, such that said at least two modules are decouplable from one another to facilitate servicing of the system, and in particular the vertical furnace thereof. | 10-22-2015 |