Patent application number | Description | Published |
20100301456 | METHOD FOR APPLYING A STRUCTURE TO A SEMICONDUCTOR ELEMENT - A method for applying a predetermined structure of a structural material to a semiconductor element. The method includes the following steps: A) partially covering a surface of the semiconductor element with a masking layer, B) applying a film of a structural material to the masking layer and to the surface of the semiconductor element in the zones that are devoid of the masking layer and C) removing the masking layer together with the structural material present on the masking layer. The method according to the invention provides that between process steps B and C, the film of structural material is partially removed in a process step B2. | 12-02-2010 |
20110155239 | SOLAR CELL AND METHOD FOR THE PRODUCTION THEREOF - A solar cell having a semiconductor substrate with a front face and a rear face extending substantially parallel thereto, a front face metallization, a rear face metallization and at least three doped regions having at least two different conductivity types, including: a first doped region with a first conductivity type located on the front face of the semiconductor substrate and extends substantially over the entire front face; a second doped region with the opposite conductivity type to that of the first conductivity type located on the rear face and extends partially over said face; and a third doped region with the first conductivity type located on the rear face and extends partially over said face. The front face metallization is connected to the first doped region and the rear face metallization is connected to the second doped region in an electrically conductive manner and the solar cell has an electrically conductive connection which connects the third doped region to the front face metallization and/or the first doped region. | 06-30-2011 |
20110272020 | SOLAR CELL AND METHOD FOR PRODUCING A SOLAR CELL FROM A SILICON SUBSTRATE - A method for producing a solar cell from a silicon wafer, including the following process steps: A) texturizing one side of the silicon substrate ( | 11-10-2011 |
20120055547 | HIGH-EFFICIENCY SOLAR CELL STRUCTURES AND METHODS OF MANUFACTURE - Solar cells of varying composition are disclosed, generally including a central substrate, conductive layer(s), antireflection layers(s), passivation layer(s) and/or electrode(s). Multifunctional layers provide combined functions of passivation, transparency, sufficient conductivity for vertical carrier flow, the junction, and/or varying degrees of anti-reflectivity. Improved manufacturing methods including single-side CVD deposition processes and thermal treatment for layer formation and/or conversion are also disclosed. | 03-08-2012 |
20120152299 | Solar Cell And Solar Cell Module With Improved Read-Side Electrodes, And Production Method - The present invention relates to rear-side contact solar cells and also solar cell modules manufactured therefrom, said modules having a special electrode structure, and also to a method for the production thereof. The electrodes, via which the current of the rear-side contact cell is tapped, are thereby separated by an insulating layer from the finger contacts which are in contact with the n- or p-semiconductor element of the solar cell through an insulating layer. The method makes possible a substantial simplification relative to the production methods described in the state of the art by means of spatial decoupling of the structuring of the electrodes from the solar cell. | 06-21-2012 |
20150027528 | SELECTIVE REMOVAL OF A COATING FROM A METAL LAYER, AND SOLAR CELL APPLICATIONS THEREOF - A method and resulting structure of patterning a metal film pattern over a substrate, including forming a metal film pattern over the substrate; depositing a coating over the substrate surface and the metal film pattern; and removing the coating over the metal film pattern by laser irradiation. The substrate and coating do not significantly interact with the laser irradiation, and the laser irradiation interacts with the metal film pattern and the coating, resulting in the removal of the coating over the metal film pattern. The invention offers a technique for the formation of a metal pattern surrounded by a dielectric coating for solar cells, where the dielectric coating may function as an antireflection coating on the front surface, internal reflector on the rear surface, and may further may function as a dielectric barrier for subsequent electroplating of metal patterns on either surface. | 01-29-2015 |
20150295122 | METHODS OF FORMING SOLAR CELLS - Methods of fabricating conductive patterns over a solar cell structure are provided, in which a patterned resist layer is provided over an anti-reflective coating layer formed over a solar cell structure. The patterned resist layer is used to etch the exposed portion of the anti-reflective coating, and a metal seed layer is provided over the resist layer and the exposed portion of the solar cell structure's surface. The metal seed layer is selectively removed from over the patterned resist layer without removal from the exposed portion of the surface of the solar cell structure. Different thermal conductivities of the patterned resist layer and the solar cell structure's surface facilitate the selective removal of the seed layer from over the resist layer. Also provided are methods of facilitating simultaneous fabrication of conductive patterns over a plurality of solar cell structures using one or more frame structures. | 10-15-2015 |
20150357487 | HIGH-EFFICIENCY SOLAR CELL STRUCTURES AND METHODS OF MANUFACTURE - Solar cells of varying composition are disclosed, generally including a central substrate, conductive layer(s), antireflection layers(s), passivation layer(s) and/or electrode(s). Multifunctional layers provide combined functions of passivation, transparency, sufficient conductivity for vertical carrier flow, the junction, and/or varying degrees of anti-reflectivity. Improved manufacturing methods including single-side CVD deposition processes and thermal treatment for layer formation and/or conversion are also disclosed. | 12-10-2015 |