Oberson
Eric Joseph Oberson, Oviedo, FL US
Patent application number | Description | Published |
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20150330222 | METHOD AND APPARATUS FOR TURBINE ENGINE THRU BOLT STUD AND NUT RETENTION - Broken remnants of turbine engine rotor thru-bolt/nut interfaces are enveloped in a housing that is coupled to the rotor, so that the remnant does not migrate to other portions of the engine. In exemplary embodiments the housing directly mates with and engages the thru-bolt stud male threaded portion that projects outwardly from the nut, such as by a female threaded sleeve that is engaged with the male threads. The sleeve is in turn coupled to and/or supported by the rest of the housing. Some housing embodiments surround one or more of the threaded stud/nut interfaces. Housing embodiments of the invention are installed in situ without removing the rotor structure from the engine. | 11-19-2015 |
Valerie Oberson, Granby CA
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20100175790 | New Flux Composition and Process For Use Thereof - The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes. | 07-15-2010 |
Valerie Oberson, Quebec CA
Patent application number | Description | Published |
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20090039140 | Solder Mold With Venting Channels - A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. | 02-12-2009 |
20090039142 | Method for Forming a Solder Mold with Venting Channels and Method for Using the Same - A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities. | 02-12-2009 |
20120083113 | CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS - A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball. | 04-05-2012 |
Valerie Oberson, St-Alphonse De Granby CA
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20120217289 | Flux Composition and Techniques for Use Thereof - The present invention is directed to flux compositions and uses thereof. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 08-30-2012 |
20120217290 | Flux Composition and Techniques for Use Thereof - The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 08-30-2012 |
20130001279 | Flux Composition and Techniques for Use Thereof - The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 01-03-2013 |
20150231721 | Flux Composition and Techniques for Use Thereof - The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects. | 08-20-2015 |
Valerie A. Oberson, Alphonse De Granby CA
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20100193949 | NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION - Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections. | 08-05-2010 |
Valerie A. Oberson, Quebec CA
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20090266447 | OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT - Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided. | 10-29-2009 |
20130098176 | Flat Laminate, Symmetrical Test Structures and Method of Use To Gauge White Bump Sensitivity - A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem. | 04-25-2013 |
20150036716 | FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAUGE WHITE BUMP SENSITIVITY - A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem. | 02-05-2015 |
Valérie Anne Oberson, St-Alphonse De Granby CA
Patent application number | Description | Published |
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20100062597 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 03-11-2010 |
Valérie Anne Oberson, St-Alphonse De Granby CA
Patent application number | Description | Published |
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20100062597 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers - An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components. | 03-11-2010 |