Numaguchi
Hiroyuki Numaguchi, Miyazaki JP
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20120193813 | WIRING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE WIRING STRUCTURE - A wiring structure of a semiconductor device, includes: an insulating layer formed on a base member; a first metal layer covered with the insulating layer; a second metal layer having a plurality of electrode parts which are arranged on the insulating layer to be spaced from each other and which have a thickness larger than the first metal layer, the insulating layer having a plurality of via holes which connect the first metal layer and the plurality of electrode parts; and a plurality of through wiring lines which are located within the plurality of via holes and which electrically connect the plurality of electrode parts to the first metal layer. | 08-02-2012 |
20140070374 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE - There is provided a method of fabricating a semiconductor device, method including: a) forming semiconductor elements in plural element regions surrounded by assumed dicing lines on a first principal surface of a semiconductor wafer; b) grinding the second principal surface in such a way that an outer peripheral portion of a second principal surface on the opposite side of the first principal surface of the semiconductor wafer becomes thicker than an inner peripheral portion of the second principal surface; c) forming a metal film, in such a way as to avoid sections corresponding to the dicing lines, on the second principal surface that has been ground in the grinding step; and d) cutting the semiconductor wafer from the second principal surface side along portions where the metal film is not formed on the dicing lines. | 03-13-2014 |
20150108612 | METHOD FOR THINNING, METALIZING, AND DICING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE MADE USING THE METHOD - There is provided a method of fabricating a semiconductor device, method including: a) forming semiconductor elements in plural element regions surrounded by assumed dicing lines on a first principal surface of a semiconductor wafer; b) grinding the second principal surface in such a way that an outer peripheral portion of a second principal surface on the opposite side of the first principal surface of the semiconductor wafer becomes thicker than an inner peripheral portion of the second principal surface; c) forming a metal film, in such a way as to avoid sections corresponding to the dicing lines, on the second principal surface that has been ground in the grinding step; and d) cutting the semiconductor wafer from the second principal surface side along portions where the metal film is not formed on the dicing lines. | 04-23-2015 |
Kazuhiro Numaguchi, Kasumigaura-Shi, Ibaraki JP
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20150300333 | Hydraulic Rotary Machine - A sliding layer ( | 10-22-2015 |
Kazuya Numaguchi, Tokyo JP
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20130187393 | AXIAL GAP TYPE GENERATOR - There is provided an axial gap type generator. The axial gap type generator includes: a stator core fixed to a crank case of an engine; a rotor yoke fixed to a crankshaft of the engine and opposing the stator core across spacing in an axial direction of the crankshaft; a first planar section provided in the crankshaft and formed to have a planar shape that is perpendicular to a rotation center axis; a second planar section provided at a base, at which the rotor yoke is mounted on the crankshaft, and disposed opposing the first planar section; and a shim clamped between the first planar section and the second planar section. | 07-25-2013 |
20130187489 | AXIAL GAP TYPE GENERATOR - There is provided an axial gap type generator exhibiting improved precision in positioning stator cores. An axial gap type generator comprises a generator case fixed to a crank case of an engine, a rotor yoke housed inside the generator case, and fixed to a crankshaft of the engine, and a first stator core and a second stator core fixed to generator case inner faces, and disposed flanking the rotor yoke in a rotation axis direction. The generator case is configured through direct connection of a first member to which the first stator core is fixed and a second member to which the second stator core is fixed. | 07-25-2013 |
20140132006 | AXIAL GAP TYPE GENERATOR - There is provided an axial gap type generator. The an axial gap type generator includes: generator cases are fixed to a crank case of an engine; a rotor yoke housed inside the generator cases and fixed to a crankshaft of the engine; a first stator core and a second stator core fixed to inner faces of the generator cases and disposed flanking the rotor yoke in a rotation axis direction; generator case supports for supporting the generator case in such a manner that a surface section of the generator case opposing the crank case has a spacing between the surface section and the crank case. | 05-15-2014 |
Naoki Numaguchi, Tokyo JP
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20140015813 | INPUT APPARATUS USING CONNECTABLE BLOCKS, INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSOR, AND INFORMATION PROCESSING METHOD - A block tool, which can be assembled by a user, is configured with multiple types of blocks and is shot by a camera for capturing a still image or a moving image. The position coordinates of a marker of the square-pillar block in a three-dimensional space are obtained by image recognition. Also, a connecting position and the type of each block, a gradient vector of the square-pillar block, an angle between two blocks constituting the square-pillar block, and the respective blocks' lengths are obtained so as to derive the shape, posture, and position of the block tool, and corresponding information processing is then performed. | 01-16-2014 |
Shogo Numaguchi, Fukuoka JP
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20080266436 | TRANSFER PULSE SUPPLYING CIRCUIT - A transfer pulse supplying circuit for supplying transfer pulses to a solid-state imaging apparatus including a charge transfer unit includes N (N is an integer of two or more) transfer pulse supplying wirings to which the transfer pulses are supplied, and lead-in wirings connecting the transfer pulse supplying wirings to corresponding lead-out wirings from the charge transfer unit. The respective lead-in wirings have almost the same width and length as one another. At least part of the lead-in wirings is divided into a first region and a second region by slits, and the first region is connected to the transfer pulse supplying wirings and the lead-out wiring, the second region is connected to the lead-out wiring. Regions of the respective lead-in wirings connected to the transfer pulse supplying wirings have almost the same ratio of width to length as one another. | 10-30-2008 |
Toshikazu Numaguchi, Tokyo JP
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20090020969 | WHEELED MOVING BODY AND GROUNDING CONDITION MONITORING APPARATUS FOR THE SAME - To provide a wheeled moving body incorporating electrostatic protection measures and capable of constantly monitoring its grounding condition, and a grounding condition monitoring system for the same. An electrostatic conductive mat | 01-22-2009 |
20100188793 | IONIZER HAVING CLEANING SYSTEM - An object of the present invention is to provide an ionizer having a cleaning system for cleaning an electrode needle of the ionizer automatically or remotely, while also being compact in size. The cleaning system ( | 07-29-2010 |
Yasushi Numaguchi, Chikusei-Shi JP
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20130040093 | ADHESIVE FILM - The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order. | 02-14-2013 |
20150239220 | ADHESIVE FILM - The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order. | 08-27-2015 |
Yoshitomo Numaguchi, Kanagawa JP
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20100219872 | Semiconductor device - A semiconductor device, having a test circuit of a multivalued logic circuit without newly provision of an output terminal for a test signal, and with no increase in transmission delay in an output signal, includes an n-valued input terminal, and comparators that operate at different threshold voltages in response to input signals which have been input to the n-valued input terminal, respectively, and also includes an impedance control circuit that is connected to the n-valued input terminal and outputs of the comparators, respectively, and changes a combine resistance value in response to the output signals of the comparators to change a current flowing in the n-valued input terminal. | 09-02-2010 |
20120086478 | SEMICONDUCTOR DEVICE INCLUDING A TEST CIRCUIT OF A MULTIVALUED LOGIC CIRCUIT HAVING AN IMPEDANCE CONTROL - A semiconductor device, having an input terminal configured to receive a multi-valued input signal as input, the multi-valued input signal including a plurality of values, a multi-valued logic circuit that operates with a multi-valued function and output binary signals to an output section in response to the input signal that has been input to the input terminal, the output section having a number of nodes being one less than a number of the plurality of values of the multi-valued input signal, and an impedance control circuit that is connected to the input terminal and the output section, and changes a combined resistance value in response to the binary signals of the plurality of nodes to change a current which flows in the input terminal. | 04-12-2012 |