Patent application number | Description | Published |
20100031980 | LIQUID TREATMENT APPARATUS - Disclosed is a liquid treatment apparatus capable of effectively exhausting processing liquid atmosphere around a target object. The liquid treatment apparatus includes a container, a support part located within the container that supports the target object, a rotation driving mechanism to rotate the target object supported by the support part, a processing liquid supply mechanism to supply a processing liquid to the target object, and a rotation cup, which is located outside of the outer circumference of the target object and is rotatable together with the support part. A rotation exhaust cup is arranged above the rotation cup and is rotatable together with the rotation cup. A discharge mechanism discharges processing liquid atmosphere guided by the rotation cup and the rotation exhaust cup. | 02-11-2010 |
20110089137 | SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD, AND STORAGE MEDIUM HAVING SUBSTRATE LIQUID PROCESSING PROGRAM STORED THEREIN - Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate. | 04-21-2011 |
20130048609 | LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD AND STORAGE MEDIUM - Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater. | 02-28-2013 |
20140137902 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate. | 05-22-2014 |
Patent application number | Description | Published |
20090031948 | Substrate processing apparatus - A substrate processing apparatus includes a rotary cup disposed outside a substrate holding member to surround a substrate held on the substrate holding member and to rotate along with the substrate holding member, and having a wall portion that receives a process liquid thrown off from the substrate being rotated. Further, this apparatus includes an exhaust and drain cup disposed outside the rotary cup to surround the rotary cup and the substrate holding member, and including an annular liquid receptacle that receives the process liquid thrown off from the substrate being rotated and an inner annular space formed on an inward side from the annular liquid receptacle. An exhaust mechanism is connected to the inner annular space of the exhaust and drain cup. | 02-05-2009 |
20090056764 | Liquid processing apparatus, liquid processing method, and storage medium - A liquid processing apparatus | 03-05-2009 |
20110023909 | LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD, AND STORAGE MEDIUM - The liquid processing apparatus includes: a liquid supply mechanism; a supply line connected to the liquid supply mechanism, the supply line having a discharge opening for discharging a temperature-regulated liquid; a processing unit supporting the discharge opening of the supply line; a return line configured to return the liquid supplied to the supply line to the liquid supply mechanism; and a liquid-supply switching valve configured to switch between supply of the liquid, which is used in a processing of an object to be processed in the processing unit, and stoppage of the liquid supply. The liquid-supply switching valve is disposed on the supply line on a route of the liquid returning from the supply line to the liquid supply mechanism through the return line. | 02-03-2011 |
20120312332 | LIQUID PROCESSING APPARATUS, LIQUID PROCESSING METHOD, AND STORAGE MEDIUM - A liquid processing apparatus | 12-13-2012 |
20130014784 | LIQUID PROCESS APPARATUS AND LIQUID PROCESS METHODAANM ITO; NorihiroAACI Koshi-shiAACO JPAAGP ITO; Norihiro Koshi-shi JPAANM AlURA; KazuhiroAACI Koshi-shiAACO JPAAGP AlURA; Kazuhiro Koshi-shi JPAANM SHINDO; NaokiAACI Koshi-shiAACO JPAAGP SHINDO; Naoki Koshi-shi JPAANM HACHIYA; YosukeAACI Koshi-shiAACO JPAAGP HACHIYA; Yosuke Koshi-shi JPAANM NAGAI; TakashiAACI Koshi-shiAACO JPAAGP NAGAI; Takashi Koshi-shi JP - A top plate | 01-17-2013 |
20130014786 | LIQUID PROCESS APPARATUS AND LIQUID PROCESS METHODAANM Ito; NorihiroAACI Koshi-shiAACO JPAAGP Ito; Norihiro Koshi-shi JPAANM Aiura; KazuhiroAACI Koshi-shiAACO JPAAGP Aiura; Kazuhiro Koshi-shi JPAANM Shindo; NaokiAACI Koshi-shiAACO JPAAGP Shindo; Naoki Koshi-shi JPAANM Hachiya; YosukeAACI Koshi-shiAACO JPAAGP Hachiya; Yosuke Koshi-shi JPAANM Nagai; TakashiAACI Koshi-shiAACO JPAAGP Nagai; Takashi Koshi-shi JP - A top plate | 01-17-2013 |
20130319476 | LIQUID TREATMENT APPARATUS AND LIQUID TREATMENT METHOD - A liquid treatment apparatus includes a substrate holding member ( | 12-05-2013 |
20140248774 | LIQUID TREATMENT APPARATUS AND LIQUID TREATMENT METHOD - The liquid treatment apparatus according to the present invention includes a substrate holder configured to horizontally hold a substrate, and a top plate configured to be rotatable and to cover the substrate held by the substrate holder from above so as to define a treatment space. In the treatment space, a chemical liquid is supplied by a chemical liquid nozzle onto the substrate, and an atmosphere replacement gas is supplied by a replacement nozzle into the treatment space. The replacement nozzle is supported by a replacement nozzle support arm configured to be horizontally moved between an advanced position at which the replacement nozzle support arm is advanced into the treatment space and a retracted position at which the replacement nozzle support arm is retracted outside from the treatment space. The replacement nozzle is configured to discharge, above the substrate, the atmosphere replacement gas upward. | 09-04-2014 |
Patent application number | Description | Published |
20090056758 | TREATMENT APPARATUS, TREATMENT METHOD AND STORAGE MEDIUM - An apparatus and a method for accurately determining if a substrate is properly retained by a substrate-retaining mechanism, lowering the manufacturing cost, and instantly detecting any fracture of the substrate during treatment are disclosed. The apparatus includes a substrate-retaining mechanism to retain a wafer, a treatment liquid supply mechanism to supply a treatment liquid to the wafer, and a rotatable cup adapted to rotate as an integral unit with the substrate-retaining mechanism while covering the outer peripheral portion of the wafer. The substrate-retaining mechanism has a retaining member. A second end of the retaining member is in the upper position when a first end of the retaining member retains a wafer, or in the lower position when the first end is retaining no wafer. A touch sensor is arranged below the second end of the retaining member so that, when the second end is in the lower position, it can touch the second end. | 03-05-2009 |
20100144158 | Liquid Processing Apparatus and liquid Processing Method - A liquid treatment device having a substrate holding section ( | 06-10-2010 |
20100212701 | Substrate Processing Apparatus, Substrate Processing Method, and Drain Cup Cleaning Method - A substrate processing apparatus includes a substrate holding member configured to rotate along with a wafer (W) held thereon and a drain cup ( | 08-26-2010 |
20130284213 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - The present disclosure provides a substrate processing method and a substrate processing apparatus. The substrate processing method includes: generating an SPM liquid of a first temperature that contains Caro's acid having a separation effect of a resist film formed on the surface of a substrate by mixing heated sulfuric acid with hydrogen peroxide; cooling the SPM liquid to a second temperature at which a reduction effect of film loss occurs; and applying the SPM liquid of the second temperature to the resist film thereby separating the resist film. | 10-31-2013 |
20130340796 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - The present disclosure provides a substrate processing apparatus including: a substrate processing chamber configured to process a substrate on which a target layer to be removed is formed on the surface of an underlying layer; a substrate holding unit provided in the substrate processing chamber and configured to hold the substrate; a mixed liquid supplying unit configured to supply a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate held by the substrate holding unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer; and an OH-group supplying unit configured to supply a fluid containing OH-group to the substrate in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate. | 12-26-2013 |
20140261172 | SUBSTRATE LIQUID PROCESSING APPARATUS AND METHOD FOR DETECTING ABNORMALITY OF AIR FLOW - A substrate liquid processing apparatus includes a substrate holding unit configured to hold and rotate a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate; a cylindrical liquid receiving cup configured to receive and recover the processing liquid scattered from the substrate; a housing configured to accommodate the substrate holding unit and the liquid receiving cup; a cup exhaust path connected to the liquid receiving cup to exhaust atmosphere inside the liquid receiving cup; a cup exhaust path pressure sensor configured to detect pressure in the cup exhaust path; a housing pressure sensor configured to detect pressure in the housing outside the liquid receiving cup; and a control unit configured to alert when a difference between a value detected by the housing pressure sensor and a value detected by the cup exhaust path pressure sensor is a predetermined determination reference value or less. | 09-18-2014 |
Patent application number | Description | Published |
20120256197 | ORGANIC ELECTROLUMINESCENCE ELEMENT - The organic electroluminescence device includes an anode, a cathode, a first electron injection layer, an electron transport layer, and a light emitting layer. The first electron injection layer is made of alkali metal and is formed between the anode and the cathode. The electron transport layer is formed between the first electron injection layer and the anode. The light emitting layer is formed between the electron transport layer and the anode. The organic electroluminescence element further includes a second electron injection layer. The second electron injection layer is formed between the first electron injection layer and the electron transport layer. The second electron injection layer is made of amorphous inorganic material. | 10-11-2012 |
20120262053 | ORGANIC LUMINESCENT ELEMENT - An organic luminescent element comprises a substrate, an organic electroluminescence element formed on one surface thereof and having a light-emitting section emitting light to the substrate, and a lens attached on the other surface of the substrate. A refraction index of the lens is ≧ that of the substrate. An area of the light-emitting section, parallel to the substrate's surface, is smaller than an area of the substrate on which the lens is attached. An angle θ between a line perpendicular to the substrate's surface in a direction from the light-emitting section toward the substrate and a straight line connecting an end of the light-emitting section and an end of the lens, is set to be ≧60°. | 10-18-2012 |
20140014937 | ORGANIC ELECTROLUMINESCENT ELEMENT - Provided is an organic electroluminescent element superior in long-term durability and lifetime characteristics. The organic electroluminescent element has a structure where plurality of light-emitting layers formed via an intermediate layer are interposed between a positive electrode and a negative electrode. The intermediate layer has a mixed layer, a first layer, and a hole-injection layer which are formed in this order from the positive electrode to the negative electrode, the mixed layer containing an electron-donating substance and an electron-transporting organic material, and the first layer being made of an electron-transporting material. The first layer has a thickness in a range of 0.2 to 2.0 nm. The hole-injection layer consists of an electro-accepting organic material. | 01-16-2014 |