Patent application number | Description | Published |
20090134529 | CIRCUIT BOARD MODULE, ELECTRIC DEVICE, AND METHOD FOR PRODUCING CIRCUIT BOARD MODULE - A circuit board module includes: a printed wiring board that is provided with a plurality of solder bonding pads; a semiconductor package that is provided with a plurality of solder bonding portions on a back face thereof to be mounted on the printed wiring board by soldering the solder bonding portions onto the respective solder bonding pads on the printed wiring board; a plurality of reinforcement pads that are provided on the printed wiring board at positions along peripheral edges of the semiconductor package, each of the reinforcement pads having a solder coated layer formed thereon; and a plurality of reinforcing adhesive agents that are disposed on each of the reinforcement pads to adhere the semiconductor package to the reinforcement pads. | 05-28-2009 |
20090219703 | PRINTED CIRCUIT BOARD, METHOD FOR FORMING FRAME GROUND FOR PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE - According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion. | 09-03-2009 |
20090321120 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE - A printed circuit board according to the present invention includes a printed wiring board, first electrodes, second electrodes, third electrodes, solders, and a flip chip. The printed wiring board includes a first surface and a second surface which is opposite the first surface. The first electrodes are respectively formed on the first surface. The second electrodes correspond to and are disposed near each of the first electrodes, and are respectively formed on the first surface. The third electrodes electrically respectively connect the first electrodes and the second electrodes corresponding to each of the first electrodes. The solders are applied so as to respectively cover the first electrodes, the second electrodes corresponding to the first electrodes, and the third electrodes connecting the first electrodes and the second electrodes. The flip chip is electrically connected to each of the first electrodes at a position opposed to the first electrodes. | 12-31-2009 |
20100097768 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board contained in the housing, an integrated-circuit component mounted on the circuit board, a member for heat radiation opposed to the integrated-circuit component and thermally connected to the integrated-circuit component, a sheet metal member which fixes the member for heat radiation, and an electronic component mounted on the circuit board. The sheet metal member includes a main part opposed to the member for heat radiation, and a plurality of leg parts fixed to the circuit board. One leg part of the plurality of leg parts extends from the main part over the electronic component, and is fixed to the circuit board at a position which is farther from the integrated-circuit component than the electronic component is. | 04-22-2010 |
20100302735 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board contained in the housing, an integrated-circuit component mounted on the circuit board, a member for heat radiation opposed to the integrated-circuit component and thermally connected to the integrated-circuit component, a sheet metal member which fixes the member for heat radiation, and an electronic component mounted on the circuit board. The sheet metal member includes a main part opposed to the member for heat radiation, and a plurality of leg parts fixed to the circuit board. One leg part of the plurality of leg parts extends from the main part over the electronic component, and is fixed to the circuit board at a position which is farther from the integrated-circuit component than the electronic component is. | 12-02-2010 |
20110199747 | STORAGE DEVICE AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first board, a second board facing the first board, a cover facing the second board from a side opposite to the first board, a first fixing portion attached to the first board and the cover, and a second fixing portion attached to the first board and the second board. | 08-18-2011 |
20120318572 | ENDOSCOPE DEVICE AND CIRCUIT BOARD - An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode. | 12-20-2012 |
20120323076 | ENDOSCOPE APPARATUS AND ELECTRONIC APPARATUS - According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the inertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board. | 12-20-2012 |