Patent application number | Description | Published |
20080212191 | Optical arrangement and optical method - An optical arrangement comprising at least one first light-emitting element (LE | 09-04-2008 |
20090127573 | OPTOELECTRONIC COMPONENT WITH A WIRELESS CONTACTING - An optoelectronic component contains a semiconductor chip ( | 05-21-2009 |
20090296018 | Light-Emitting Device - A light-emitting device, comprising: a radiation source ( | 12-03-2009 |
20100044739 | Light-Radiating Semiconductor Component with a Luminescence Conversion Element - The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce. | 02-25-2010 |
20100066254 | Light-Emitting Device - One embodiment of the invention proposes a light-emitting device comprising a radiation source for the emission of a radiation having at least a first wavelength, and an elongated, curved light-guiding body, into which the radiation emitted by the radiation source is coupled and which couples out light at an angle with respect to its longitudinal axis on account of the coupled-in radiation having the first wavelength. | 03-18-2010 |
20100091516 | Arrangement Comprising a Fiber-Optic Waveguide - An arrangement comprising a fiber-optic waveguide ( | 04-15-2010 |
20100301355 | Optoelectronic Component and Production Method for an Optoelectronic Component - An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions. | 12-02-2010 |
20120223360 | Optoelectronic Component and Method for Producing an Opto-Electronic Component - An opto-electronic component has a carrier element ( | 09-06-2012 |
20120241779 | Light-Radiating Semiconductor Component with a Luminescence Conversion Element - The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce. | 09-27-2012 |
20120322178 | Method of Producing a Radiation-Emitting Optoelectronic Component - In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied. | 12-20-2012 |