Patent application number | Description | Published |
20090179215 | Semiconductor light emitting device and fabrication method for the semiconductor light emitting device - A semiconductor light emitting device includes a first metal layer placed on the p-type semiconductor layer on the substrate, and includes a first pattern width W | 07-16-2009 |
20100102342 | Semiconductor light-emitting device - A semiconductor light-emitting device capable of increasing an amount of light irradiated to the outside is provided. | 04-29-2010 |
20130056748 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on a front surface of the substrate with a first pitch, an n type nitride semiconductor layer located on the front surface of the substrate to cover the convex pattern and a p type nitride semiconductor layer located on the light emitting layer. The light emitting layer is located on the n type semiconductor layer. Each of the convex portions includes a sub convex pattern comprising a plurality of fine convex portions discretely formed at the top of the convex portion with a second pitch smaller than the first pitch, and a base supporting the sub convex pattern. | 03-07-2013 |
20140191270 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device includes a light emitting layer, a substrate that is transparent to an emission wavelength of the light emitting layer and positioned to receive an emission wavelength from the light emitting layer, a convex pattern including a collection of a plurality of convex portions discretely arranged on a front surface of the substrate with a first pitch, an n type nitride semiconductor layer located on the front surface of the substrate to cover the convex pattern and a p type nitride semiconductor layer located on the light emitting layer. The light emitting layer is located on the n type semiconductor layer. Each of the convex portions includes a sub convex pattern comprising a plurality of fine convex portions discretely formed at the top of the convex portion with a second pitch smaller than the first pitch, and a base supporting the sub convex pattern. | 07-10-2014 |
20140203318 | LIGHT EMITTING ELEMENT AND LIGHT EMITTING ELEMENT PACKAGE - A light emitting element includes: a sapphire substrate having a front surface and a rear surface opposite the front surface; a first conductive type semiconductor layer stacked on the front surface of the sapphire substrate; a light emitting layer stacked on the first conductive type semiconductor layer; a second conductive type semiconductor layer stacked on the light emitting layer; a reflective layer which contains Ag and is disposed on the rear surface of the sapphire substrate, the reflective layer reflecting light from the sapphire substrate toward the front surface of the sapphire substrate; and an adhesive layer which is interposed between the sapphire substrate and the reflective layer and is made of ITO, the adhesive layer being adhered to the reflective layer. | 07-24-2014 |
20140239340 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE - The light emitting device includes: a substrate; a first conductive-type semiconductor layer laminated on the substrate; a light emitting layer laminated on the first conductive-type semiconductor layer; a second conductive-type semiconductor layer laminated on the light emitting layer; a first ITO layer, a second ITO layer, a first metal layer and a second metal layer. The first ITO layer is laminated at a side of the first conductive-type semiconductor layer opposite to the substrate. The second ITO layer is laminated at a side of the second conductive-type semiconductor layer opposite to the substrate. The first metal layer is laminated on the first ITO layer. The second metal layer is laminated on the second ITO layer. | 08-28-2014 |
20150270461 | LIGHT EMITTING ELEMENT UNIT AND METHOD FOR MANUFACTURING THE SAME, LIGHT EMITTING ELEMENT PACKAGE AND ILLUMINATING DEVICE - A light emitting element unit according to the present invention includes a semiconductor light emitting element that has a surface, a back surface, and a side surface, where the surface or the back surface is a light extracting surface from which light generated inside is emitted, a submount which has a bottom wall and a side wall, has a recess portion defined by the bottom wall and the side wall, and supports the semiconductor light emitting element by the bottom wall in a position in which the light extracting surface is directed upward at the recess portion, and has an inclined surface on the side wall, inclined at a predetermined angle with respect to the bottom wall so as to face the side surface of the semiconductor light emitting element, and a light reflecting film formed on the inclined surface of the submount. | 09-24-2015 |
20160005929 | LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT UNIT, AND LIGHT-EMITTING ELEMENT PACKAGE - In a light-emitting element | 01-07-2016 |