Patent application number | Description | Published |
20110018130 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE - A semiconductor package is provided with a functionally necessary minimum number of components with which stress concentrated on specific solder bumps is reduced and ruptures of the bumps are prevented even when stress caused by physical bending or a difference in thermal expansion coefficient is applied to the package. The semiconductor package includes a tabular die and bonding pads arranged on a mounting surface of the die. A passivation layer and a protective film are provided on the mounting surface such that central areas of the bonding pads are open. Under-bump metals (UBMs) connected to the bonding pads are provided in the openings, and solder bumps are provided on the surfaces of the UBMs. The diameter of the UBMs provided at corners of the die is less than that of the UBM provided at the approximate center of the die so that the elastic modulus of the UBMs provided at the corners is small. | 01-27-2011 |
20110080331 | WIRELESS IC DEVICE AND ELECTROMAGNETIC COUPLING MODULE - A wireless IC device includes a wireless IC chip, a feeder circuit substrate which is coupled to the wireless IC chip and includes a feeder circuit including an inductance element, and a radiation plate. The inductance element includes a plurality of stacked layers having coil conductors electrically connected, and a coil conductor electrically connected in a middle portion of the inductance element is arranged at an end position in the coil axis direction and faces a coupling portion of the radiation plate. | 04-07-2011 |
20110181475 | ANTENNA AND WIRELESS IC DEVICE - An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode. | 07-28-2011 |
20110199713 | HIGH-FREQUENCY DEVICE AND WIRELESS IC DEVICE - A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip. | 08-18-2011 |
20110241804 | HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased. | 10-06-2011 |
20110253795 | WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE - A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna. | 10-20-2011 |
20120012369 | CIRCUIT BOARD - A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in plan in the z-axis direction, are overlaid on the external electrodes and are not connected to one another in regions in which the internal conductors are overlaid on the external electrodes. | 01-19-2012 |
20120218071 | HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE - A high-frequency coupler and a communication device are compact, capable of efficiently communicating a large volume of data over a short distance and can be used in combination with a non-contact IC card. The high-frequency coupler includes magnetic-field-generating patterns and a surrounding pattern disposed around a periphery thereof, and is used to communicate a large volume of data over a short distance in a communication system that uses broadband frequencies. Out of the magnetic fields radiated in directions perpendicular or substantially perpendicular to the plane of the patterns from the magnetic-field-generating patterns, portions extending laterally in the plane of the patterns are blocked by the surrounding pattern, the magnetic fields are lengthened in a direction perpendicular or substantially perpendicular to the plane of the patterns and the communication distance is increased. | 08-30-2012 |
20130087625 | WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE - A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna. | 04-11-2013 |
20140131457 | WIRELESS IC DEVICE AND ELECTROMAGNETIC COUPLING MODULE - A wireless IC device includes a wireless IC chip, a feeder circuit substrate which is coupled to the wireless IC chip and includes a feeder circuit including an inductance element, and a radiation plate. The inductance element includes a plurality of stacked layers having coil conductors electrically connected, and a coil conductor electrically connected in a middle portion of the inductance element is arranged at an end position in the coil axis direction and faces a coupling portion of the radiation plate. | 05-15-2014 |
20140159984 | ANTENNA AND WIRELESS IC DEVICE - An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode. | 06-12-2014 |