Patent application number | Description | Published |
20090101181 | Substrate cleaning apparatus - A substrate cleaning apparatus is used to clean a substrate with a cleaning liquid. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold a substrate horizontally, a rotating mechanism configured to rotate the substrate held by the substrate holding mechanism, a liquid supply nozzle for supplying a cleaning solution to the substrate, and a spin cover provided around the substrate and rotatable at substantially the same speed as the substrate. The spin cover has an inner circumferential surface shaped so as to surround the substrate. The inner circumferential surface is, from a lower end to an upper end thereof, inclined radially inwardly. | 04-23-2009 |
20090305612 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 12-10-2009 |
20100154837 | Liquid-scattering prevention cup, substrate processing apparatus and method for operating the apparatus - A liquid-scattering prevention cup, provided in a substrate processing apparatus, is capable of attaching a hydrophilic member, such as a PVA sponge, to an inner surface of a liquid-scattering prevention cup body easily and efficiently. The liquid-scattering prevention cup includes a liquid-scattering prevention cup body, and a liquid-scattering prevention sheet having a surface hydrophilic material layer, attached to an entire area or a predetermined area of the inner surface of the liquid-scattering prevention cup body. The liquid-scattering prevention sheet has been attached to the liquid-scattering prevention cup body by an attachment such that the hydrophilic material layer is exposed. | 06-24-2010 |
20120244787 | POLISHING APPARATUS AND POLISHING METHOD - The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage. | 09-27-2012 |
20130096992 | SHAREHOLDER MANAGEMENT APPARATUS, SHAREHOLDER MANAGEMENT METHOD, AND PROGRAM - To promote computerization of exchange of various data, etc., between a listed corporation and its individual shareholders. An individual shareholder management apparatus includes an individual shareholder client terminal, an individual shareholder management server connected to the individual shareholder client terminal through a network, and a database group including an individual shareholder database connected to the individual shareholder management server. | 04-18-2013 |
20140197610 | SUBSTRATE GRIPPING APPARATUS - The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward. | 07-17-2014 |
20140242885 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit. | 08-28-2014 |
20140302676 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 10-09-2014 |
20150050863 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 02-19-2015 |