Patent application number | Description | Published |
20090025216 | MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN INDEX FOR A POSITION OF VIA HOLES - A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film. | 01-29-2009 |
20090053459 | CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE - A package substrate | 02-26-2009 |
20090145652 | PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD - The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. | 06-11-2009 |
20090154131 | CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE - A package substrate | 06-18-2009 |
20090159327 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 06-25-2009 |
20090173523 | MULTILAYER BUILD-UP WIRING BOARD - Mesh holes | 07-09-2009 |
20090285531 | OPTICAL TRANSMISSION STRUCTURAL BODY, OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE FORMATION METHOD, AND OPTICAL WIRING CONNECTION BODY - An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to a core part of the optical waveguide. | 11-19-2009 |
20090314537 | CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE - A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure. | 12-24-2009 |
20100032200 | CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE - A package substrate | 02-11-2010 |
20110290544 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 12-01-2011 |
20120125680 | MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An opening is formed in resin | 05-24-2012 |