Nadamoto
Keisuke Nadamoto, Tokyo JP
Patent application number | Description | Published |
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20100055878 | Fabrication Method of Semiconductor Device - A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes. | 03-04-2010 |
Keisuke Nadamoto, Kumagaya-Shi JP
Patent application number | Description | Published |
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20140265094 | DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD - For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder | 09-18-2014 |
Yuji Nadamoto, Kyoto JP
Patent application number | Description | Published |
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20110051866 | DEMODULATION DEVICE - A demodulation device comprises at least a diversity combiner, an elimination parameter storage, an elimination parameter investigator, a noise eliminator, and a noise collection means. The elimination parameter storage stores elimination parameters used for eliminating a noise, as elimination parameters for each of antennas, the noise collection means receives a noise and outputs the received noise as a collected noise signal, and the diversity combiner outputs a combined signal along with combining parameters, each representing a parameter related to the combining for each of the antennas. The noise eliminator eliminates the noise by using the elimination parameters for all the antennas as well as the combining parameters for all the antennas. | 03-03-2011 |