Motowaki
Shigehisa Motowaki, Tokyo JP
Patent application number | Description | Published |
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20150221626 | Power Semiconductor Module - A power semiconductor module includes a heat sink; a circuit board connected to the heat sink via a bonding material and formed with a wiring on a front surface of an insulating substrate; a transistor device including a main electrode and a control electrode formed on one surface and a back surface electrode formed on the other surface, the back surface electrode being connected to the circuit board via a bonding material; a first conductive member bonded to the main electrode via a bonding material; and wire or ribbon-shaped connection terminals that electrically connect the first conductive member and the control electrode with another device or the circuit board, wherein the control electrode is disposed at a corner portion of the main electrode, and the first conductive member has a shape in which the first conductive member is cut out at a portion above the control electrode. | 08-06-2015 |
Sigehisa Motowaki, Hitachi JP
Patent application number | Description | Published |
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20120256346 | MOLD STRUCTURES, AND METHOD OF TRANSFER OF FINE STRUCTURES - A mold and a pattern transfer method using the same for a nanoprinting technology. The mold can be released from a substrate accurately and easily. The mold, which is used for forming a fine pattern on a substrate using a press machine, comprises a release mechanism. | 10-11-2012 |
Sigehisa Motowaki, Mito JP
Patent application number | Description | Published |
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20130228907 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Conventional surface roughening plating technology cannot always improve the adhesion between a leadframe and a plating film and it depends on the material used for surface roughening plating. Conventional surface roughening technology by etching can only be used for leadframes made of limited materials. Improved adhesion cannot therefore be achieved between a metal member such as leadframe and a sealing resin. | 09-05-2013 |