Patent application number | Description | Published |
20140285039 | Solder, Aluminum Wire Body and Motor Using the Same - An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag | 09-25-2014 |
20140287227 | Joint Material, and Jointed Body - Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal. | 09-25-2014 |
20150111755 | SUPERCONDUCTING WIRE, SUPERCONDUCTING WIRE PRECURSOR BODY AND FABRICATION METHOD THEREOF, AND SUPERCONDUCTING MULTI-CORE CONDUCTOR PRECURSOR BODY - A superconducting wire has a length that is sufficiently longer than a conventional one, and a critical current density that is uniformly high over the entire length thereof. Density of the magnesium diboride core is 1.5 g/cm | 04-23-2015 |
20150187510 | Electronic Component, Method for Producing Same, and Sealing Material Paste Used in Same - An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently. | 07-02-2015 |
20150228391 | CONDUCTIVE COOLING-TYPE PERSISTENT CURRENT SWITCH, MRI APPARATUS AND NMR APPARATUS - A technical problem is to turn a persistent current switch on and off at high speed with less heat input. The invention relates to a conductive cooling-type persistent current switch, including: a superconductive wire | 08-13-2015 |
20150270508 | ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SAME, SEALING MATERIAL PASTE, AND FILLER PARTICLES - In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10 | 09-24-2015 |
20150318062 | Structure, Electronic Element Module, Heat Exchanger, Fuel Rod, and Fuel Assembly - Provided is a structure including a first member ( | 11-05-2015 |
20150337106 | Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same - The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag | 11-26-2015 |